Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US2020083419A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020083419-A1 |
| Application number | US-201916543648-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 19, 2019 |
| Priority date | Aug 17, 2018 |
| Publication date | Mar 12, 2020 |
| Grant date | — |
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Official abstract text for this publication.
A light emitting device including a light emitting unit, two electrodes, a reflective member, and a light transmissive member is provided. The two electrodes are disposed on one side of the light emitting unit, and electrically connected to the light emitting unit. The reflective member is disposed on the other side of the light emitting unit, and has at least one reflective surface. The light transmissive member is disposed between the reflective member and the light emitting unit, and covers a part of the light emitting unit. A lateral surface of the light transmissive member is served as a light emitting surface of the light emitting device. A manufacturing method of a light emitting device is also provided.
Opening claim text (preview).
1 . A light emitting device, comprising: a light emitting unit comprising a first side and a second side opposite to each other; a plurality of electrodes disposed on the first side, wherein the electrodes are electrically connected to the light emitting unit; a reflective member disposed on the second side, wherein the reflective member comprises at least one reflective surface; and a light transmissive member disposed between the reflective member and the light emitting unit, and covering a part of the light emitting unit, wherein a lateral surface of the light transmissive member is served as a light emitting surface of the light emitting device. 2 . The light emitting device according to claim 1 , wherein the light transmissive member comprises a first light transmissive portion and a second light transmissive portion, the first light transmissive portion is located between the reflective member and the second light transmissive portion, the second light transmissive portion is located between the first light transmissive portion and the light emitting unit, and lateral surfaces of the first light transmissive portion and the second light transmissive portion together are served as the lateral surface of the light transmissive member. 3 . The light emitting device according to claim 2 , wherein the light transmissive member further comprises a third light transmissive portion, the first light transmissive portion and the second light transmissive portion cover a top surface of the light emitting unit, and the third light transmissive portion covers a lateral surface of the light emitting unit. 4 . The light emitting device according to claim 3 , further comprising a reflective protection member, disposed beside the third light transmissive portion, wherein the reflective protection member comprises a reflective curved surface. 5 . The light emitting device according to claim 3 , wherein the second light transmissive portion is connected to the third light transmissive portion. 6 . The light emitting device according to 1 , further comprising a phosphor resin layer, covering a top surface of the light emitting unit, wherein the phosphor resin layer is located between a part and another part of the light transmissive member. 7 . The light emitting device according to claim 1 , further comprising: a reflective protection member, surrounding the light ei ing unit and covering a lateral surface of the light emitting unit, wherein the thickness of the reflective protection member is greater than the thickness of the light emitting unit. 8 . The light emitting device according to claim 7 , further comprising a phosphor resin layer, wherein the reflective protection member comprises an accommodating space, the accommodating space corresponds to the light emitting unit, the phosphor resin layer is disposed in the accommodating space, and the light transmissive member is disposed between the reflective member and the phosphor resin layer. 9 . The light emitting device according to claim 1 , wherein the light transmissive member comprises a phosphor. 10 . The light emitting device according to claim 1 , wherein the reflective surface is a reflective inclined surface, a reflective curved surface, a reflective planar surface, or a combination thereof. 11 . The light emitting device according to claim 1 , wherein the light transmissive member covers at least a part of a top surface and a lateral surface of the light emitting unit. 12 . A manufacturing method of a light emitting device, comprising: forming a reflective resin layer; providing a plurality of light emitting units, wherein a bottom surface of each of the light emitting units is provided with a plurality of electrodes; bonding a plurality of top surfaces of the light emitting units respectively to the reflective resin layer; forming a light transmissive resin layer, and enabling the light transmissive resin layer to cover a plurality of lateral surfaces of the light emitting units; and performing a cutting process on the reflective resin layer and the light transmissive resin layer to form a plurality of light emitting devices, wherein each of the light emitting devices comprises at least one of the light emitting units. 13 . The manufacturing method of the light emitting device according to claim 12 , wherein after the step of forming the reflective resin layer, the manufacturing method further comprises: performing a scribing process on the reflective resin layer to form a plurality of first grooves in the reflective resin layer, such that the reflective resin layer is divided into a plurality of bonding areas. 14 . The manufacturing method of the light emitting device according to claim 13 , wherein in the step of bonding the top surfaces of the light emitting units respectively to the reflective resin layer, the top surfaces are respectively bonded to the bonding areas of the reflective resin layer. 15 . The manufacturing method of the light emitting device according to claim 13 , wherein in the step of forming the light transmissive resin layer, the manufacturing method further comprises: providing a light transmissive resin in the first grooves, and covering the lateral surfaces of the light emitting units; and curing the light transmissive resin to form the light transmissive resin layer. 16 . The manufacturing method of the light emitting device according to claim 13 , wherein in the step of performing the cutting process on the reflective resin layer and the light transmissive resin layer, the manufacturing method further comprises: performing the cutting process on the reflective resin layer and the light transmissive resin layer along the first grooves. 17 . The manufacturing method of the light emitting device according to claim 13 , wherein the cross-sectional shape of the first grooves is an arc shape, a trapezoidal shape, a straight line, or a combination thereof. 18 . The manufacturing method of the light emitting device according to claim 13 , wherein in the step of forming the light transmissive resin layer, the manufacturing method further comprises: providing a plurality of first light transmissive resins on the top surfaces of the light emitting units. 19 . The manufacturing method of the light emitting device according to claim 18 , wherein in the step of bonding the top surfaces of the light emitting units respectively to the reflective resin layer, the top surfaces are respectively bonded to the bonding areas of the reflective resin layer through the first light transmissive resins, wherein the first light transmissive resins cover a partial surface of the reflective resin layer. 20 . The manufacturing method of the light emitting device according to claim 19 , wherein in the step of forming the light transmissive resin layer, the manufacturing method further comprises: providing a plurality of second light transmissive resins around the light emitting units, and enabling the second light transmissive resins to cover the lateral surfaces of the light emitting units; and curing the first light transmissive resins and the second light transmissive resins to form the light transmissive resin layer. 21 - 35 . (canceled)
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