Solid-state imaging device, package, and imaging system
US-2024323556-A1 · Sep 26, 2024 · US
US2020080902A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020080902-A1 |
| Application number | US-201916557024-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 30, 2019 |
| Priority date | Sep 7, 2018 |
| Publication date | Mar 12, 2020 |
| Grant date | — |
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Official abstract text for this publication.
A temperature control system, adapted to a central processing unit powered by a power supply module of an electronic device, is provided. The temperature control system includes a setting module, a first temperature detecting module, a second temperature detecting module, and a power adjusting module. The setting module is configured to set a target temperature of the CPU and a target temperature of the power supply module. The first temperature detecting module is configured to obtain a detected temperature of the CPU. The second temperature detecting module is electrically connected to the power supply module, to obtain a detected temperature of the power supply module. The power adjusting module is configured to adjust a control parameter of the CPU or the power supply module based on a first temperature difference between the target temperature of the CPU and the detected temperature of the CPU or a second temperature difference between the target temperature of the power supply module and the detected temperature of the power supply module.
Opening claim text (preview).
What is claimed is: 1 . A temperature control system, adapted to a central processing unit (CPU) powered by a power supply module of an electronic device, comprising: a setting module, configured to set a target temperature of the CPU and a target temperature of the power supply module; a first temperature detecting module, electrically connected to the CPU, to obtain a detected temperature of the CPU; a second temperature detecting module, electrically connected to the power supply module, to obtain a detected temperature of the power supply module; and a power adjusting module, configured to adjust a control parameter of the CPU or the power supply module based on a first temperature difference between the target temperature of the CPU and the detected temperature of the CPU or a second temperature difference between the target temperature of the power supply module and the detected temperature of the power supply module. 2 . The temperature control system according to claim 1 , wherein the first temperature detecting module is electrically connected to the CPU through a first bus and the second temperature detecting module is electrically connected to the power supply module through a second bus. 3 . The temperature control system according to claim 1 , wherein the first temperature detecting module is electrically connected to the CPU through an input/output control interface. 4 . The temperature control system according to claim 1 , wherein the control parameter is a power limit value of the CPU. 5 . The temperature control system according to claim 4 , wherein when the first temperature difference or the second temperature difference is less than zero, the power limit value is adjusted to be less than a thermal design power of the CPU. 6 . The temperature control system according to claim 4 , wherein when the first temperature difference or the second temperature difference is greater than zero, the power limit value is adjusted to be greater than a thermal design power of the CPU. 7 . A temperature control method, adapted to a temperature control system that is adapted to a central processing unit powered by a power supply module of an electronic device, comprising: setting a target temperature of the CPU and a target temperature of the power supply module; obtaining a detected temperature of the CPU; obtaining a power supply module detected module of the power supply module; and adjusting a control parameter of the CPU or the power supply module based on a first temperature difference between the target temperature of the CPU and the detected temperature of the CPU or a second temperature difference between the target temperature of the power supply module and the detected temperature of the power supply module. 8 . The temperature control method according to claim 7 , wherein the control parameter is a power limit value of the CPU. 9 . The temperature control method according to claim 8 , wherein when the first temperature difference or the second temperature difference is less than zero, the power limit value is adjusted to be less than a thermal design power of the CPU. 10 . The temperature control method according to claim 8 , wherein when the first temperature difference or the second temperature difference is greater than zero, the power limit value is adjusted to be greater than a thermal design power of the CPU.
comprising thermal management · CPC title
Monitoring of events, devices or parameters that trigger a change in power modality · CPC title
where the monitored property is the power consumption (power management in a computing system G06F1/3203) · CPC title
where the computing system component is a central processing unit [CPU] · CPC title
Threshold · CPC title
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