Plated steel sheet having multilayer structure and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-2020080205-A1
Application number	US-201716469980-A
Country	US
Kind code	A1
Filing date	Dec 21, 2017
Priority date	Dec 22, 2016
Publication date	Mar 12, 2020
Grant date	—

Abstract

Provided is a plated steel sheet often used as materials for vehicles, home appliances, construction and the like and, more specifically, to a plated steel sheet having a multilayer structure and a method for manufacturing the same.

First claim

1 . A plating steel sheet having a multilayer structure, comprising:
a base steel sheet; a first Zn layer formed on the base steel sheet; a second Mg layer formed on the first Zn layer; and a third Zn layer formed on the second Mg layer, wherein the second Mg layer is an amorphous phase.

2 . The plating steel sheet of claim 1 , wherein the second Mg layer comprises one or more of a Zn—Mg amorphous phase and a Zn—Mg alloy phase having a nanocrystal form.

3 . The plating steel sheet of claim 2 , wherein a content of Zn included in a Zn—Mg amorphous phase and a Zn—Mg alloy phase having a nanocrystal form is 20 to 60 wt %.

4 . The plating steel sheet of claim 1 , wherein a thickness of the first Zn layer is 1 to 3 μm.

5 . The plating steel sheet of claim 1 , wherein a thickness of the second Mg layer is 0.5 to 1.5 μm.

6 . The plating steel sheet of claim 1 , wherein a thickness of the third Zn layer is 1 to 3 μm.

7 . A method of manufacturing a plating steel sheet having a multilayer structure, comprising:
preparing a base steel sheet; forming a first Zn layer on the base steel sheet; forming a second Mg layer on the first Zn layer; and forming a third Zn layer on the second Mg layer, wherein the second Mg layer and the third Zn layer are formed by a vacuum evaporation method, and a temperature of the base steel sheet is 50 to 120° C.

8 . The method of claim 7 , wherein the first Zn layer is formed by a method selected from among a hot-dip plating method, an electroplating method, and a vacuum evaporation method.

9 . The method of claim 7 , wherein a degree of vacuum of a chamber during the vacuum evaporation of the second Mg layer and the third Zn layer is 1×10 −5 to 1×10 −2 mbar.

Assignees

• Posco

Inventors

• Ko Kyoung-Pil
• Nam Kyung-Hoon
• Kim Tae-Yeob
• Lee Dong-Yoeul
• Jung Yong-Hwa
• Jung Woo-Sung

Classifications

• C23C28/021

  including at least one metal alloy layer · CPC title

• C23C2/40

  Plates; Strips · CPC title

• C23C14/16 Primary

  on metallic substrates or on substrates of boron or silicon · CPC title

• B32B15/013

  one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium · CPC title

• C23C14/24

  Vacuum evaporation · CPC title