Pixel array package structure and display panel

Patent metadata

Field	Value
Publication number	US-2020067009-A1
Application number	US-201816232041-A
Country	US
Kind code	A1
Filing date	Dec 25, 2018
Priority date	Aug 22, 2018
Publication date	Feb 27, 2020
Grant date	—

Abstract

A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

First claim

What is claimed is:

1 . A pixel array package structure, comprising:
a substrate; a pixel array disposed on the substrate, wherein the pixel array comprises a plurality of light emitting diode chips, and the light emitting diode chips comprise at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, wherein the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

2 . The pixel array package structure of claim 1 , further comprising an anti-external light material disposed on the light-transmitting layer.

3 . The pixel array package structure of claim 2 , wherein the anti-external light material is a polarizer.

4 . The pixel array package structure of claim 1 , wherein the reflective layer is composed of a mixture of a colloidal material and inorganic particles, wherein the inorganic particles comprise titanium dioxide, boron nitride, silicon dioxide, barium sulfate or aluminum oxide.

5 . The pixel array package structure of claim 1 , wherein a lower surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array.

6 . The pixel array package structure of claim 1 , wherein an upper surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array.

7 . The pixel array package structure of claim 1 , wherein the light-absorbing layer is composed of a colloidal material and an inorganic material, or a colloidal material and an organic material.

8 . The pixel array package structure of claim 7 , wherein the inorganic material is carbon powder or perovskite.

9 . The pixel array package structure of claim 8 , wherein the carbon powder has a specific surface area of 50 m 2 /g to 70 m 2 /g.

10 . A pixel array package structure, comprising:
a substrate; a pixel array disposed on the substrate, wherein the pixel array comprises a plurality of light emitting diode chips, and the light emitting diode chips comprise at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-transmitting layer disposed on the pixel array, wherein the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm; and a light-absorbing layer disposed on the reflective layer and surrounding the light-transmitting layer, wherein the upper surface of the light-transmitting layer is substantially coplanar with an upper surface of the light-absorbing layer.

11 . The pixel array package structure of claim 10 , wherein a lower surface of the light-absorbing layer is substantially coplanar with an upper surface of the pixel array.

12 . The pixel array package structure of claim 10 , wherein the light-absorbing layer is composed of a colloidal material and an inorganic material, or a colloidal material and an organic material.

13 . The pixel array package structure of claim 12 , wherein the inorganic material is carbon powder or perovskite.

14 . The pixel array package structure of claim 13 , wherein the carbon powder has a specific surface area of 50 m 2 /g to 70 m 2 /g.

15 . The pixel array package structure of claim 10 , wherein the light-transmitting layer covers a portion of the reflective layer.

16 . A display panel, comprising:
a plurality of sub-display panels, any two adjacent of the sub-display panels having a splicing gap, wherein each of the sub-display panels comprises a plurality of the pixel array package structures of claim 1 .

Assignees

• Lextar Electronics Corp

Inventors

• Wu Hui-Ru
• Liang Jian-Chin
• Chen Jo-Hsiang
• Lai Lung-Kuan
• Tsai Cheng-Yu
• Su Hsin-Lun
• Chen Ting-Kai

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H01L51/5284

  Electricity · mapped topic

• H01L33/60

  Electricity · mapped topic

• H01L51/5036 Primary

  Electricity · mapped topic

• H01L51/5293

  Electricity · mapped topic