Circuit module and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-2020058599-A1
Application number	US-201916662615-A
Country	US
Kind code	A1
Filing date	Oct 24, 2019
Priority date	Apr 28, 2017
Publication date	Feb 20, 2020
Grant date	—

Abstract

A circuit module (101) includes a circuit board (1) having a main surface (1u), an electronic component (3) mounted on the main surface (1u), and a sealing resin (4) covering at least part of the electronic component (3) on the main surface (1u). A recess (7) is formed on at least part of a side surface (11) of the sealing resin (4). At least the recess (7) is covered with an electrically conductive film (6).

First claim

1 . A circuit module comprising:
a circuit board having a main surface; an electronic component mounted on the main surface; and a sealing resin covering at least a part of a joint between the main surface and the electronic component, wherein a recess is provided on a side surface of the sealing resin at a position adjoining the joint, and at least the recess is covered with an electrically conductive film.

2 . The circuit module according to claim 1 , further comprising a grounding wire disposed on the main surface, wherein the electrically conductive film is connected to the grounding wire inside the recess.

3 . The circuit module according to claim 1 , wherein a part of the main surface or a part of the electronic component is not covered with the sealing resin but covered with the electrically conductive film.

4 . The circuit module according to claim 1 , wherein
the electronic component includes a terminal electrode, and at least a part of the terminal electrode is not covered with the sealing resin but covered with the electrically conductive film.

5 . The circuit module according to claim 1 , wherein the electrically conductive film extends so as to cover a side surface of the circuit board.

6 . A manufacturing method for the circuit module according to claim 2 , the manufacturing method comprising:
a step of mounting the electronic component and the grounding wire on the main surface of the circuit board; a step of forming a first material portion on a surface of at least any one of a part of the main surface of the circuit board and a part of the grounding wire disposed on the main surface, wherein the first material portion is formed by using a material having a property of repelling the sealing resin; a step of covering the main surface with the sealing resin and setting the sealing resin so as to cover at least a part of the electronic component and partially cover the first material portion; a step of forming the recess on the side surface of the sealing resin at the position adjoining the joint between the circuit board and the sealing resin by removing the first material portion; and a step of forming the electrically conductive film so as to cover at least the recess.

7 . The manufacturing method for a circuit module according to claim 6 , wherein, in the step of forming the first material portion, the first material portion is formed so as to cover a surface of a part of the electronic component.

8 . The circuit module according to claim 2 , wherein a part of the main surface or a part of the electronic component is not covered with the sealing resin but covered with the electrically conductive film.

9 . The circuit module according to claim 2 , wherein
the electronic component includes a terminal electrode, and at least a part of the terminal electrode is not covered with the sealing resin but covered with the electrically conductive film.

10 . The circuit module according to claim 3 , wherein
the electronic component includes a terminal electrode, and at least a part of the terminal electrode is not covered with the sealing resin but covered with the electrically conductive film.

11 . The circuit module according to claim 2 , wherein the electrically conductive film extends so as to cover a side surface of the circuit board.

12 . The circuit module according to claim 3 , wherein the electrically conductive film extends so as to cover a side surface of the circuit board.

13 . The circuit module according to claim 4 , wherein the electrically conductive film extends so as to cover a side surface of the circuit board.

Assignees

• Murata Manufacturing Co

Inventors

• Okada Takahiro
• Sato Kazushige
• Kanno Takafumi
• Amachi Nobumitsu

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/0198

  batch processes · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title