Method for bonding separators, method for manufacturing electrochemical device, and electrochemical device

Patent metadata

Field	Value
Publication number	US-2020052278-A1
Application number	US-201716494933-A
Country	US
Kind code	A1
Filing date	Dec 27, 2017
Priority date	Mar 31, 2017
Publication date	Feb 13, 2020
Grant date	—

Abstract

A method for bonding separators ( 3 ) having a multilayer structure that comprises a substrate layer ( 3 a ) and a ceramic layer ( 3 b ), the ceramic layer ( 3 b ) being laminated on at least one surface of the substrate layer ( 3 a ) and having higher heat resistance properties than the substrate layer ( 3 a ), the method comprising steps of: applying an adhesive member ( 10 ) onto the ceramic layer ( 3 b ) and then peeling off the adhesive member ( 10 ) to remove a portion of the ceramic layer ( 3 b ) together with the adhesive member ( 10 ); and heating a portion of the separator ( 3 ), from which the ceramic layer ( 3 b ) has been removed, to heat-weld the separator ( 3 ) to other separator ( 3 ).

First claim

1 . A method for bonding separators having a multilayer structure that comprises a substrate layer and a ceramic layer, the ceramic layer being laminated on at least one surface of the substrate layer and having higher heat resistance properties than the substrate layer,
the method comprising steps of: applying an adhesive member onto the ceramic layer and then peeling off the adhesive member to remove a portion of the ceramic layer together with the adhesive member; and heating a portion of the separator, from which the ceramic layer has been removed, to heat-weld the separator to other separator.

2 . The method for bonding separators according to claim 1 , wherein the substrate layer is exposed in the portion of the separator from which the ceramic layer has been removed.

3 . The method for bonding separators according to claim 1 , wherein the ceramic layer is adhered to the substrate layer by an adhesive agent, and the substrate layer or the adhesive agent is exposed in the portion of the separator from which the ceramic layer has been removed.

4 . The method for bonding separators according to claim 1 , wherein:
the ceramic layer is removed except for one portion in an outer periphery of the separator; the separator overlaps the other separator; and the portion of the outer periphery of the separator, from which the ceramic layer has been removed, is heat-welded to an outer periphery of the other separator to form a bag-shaped separator.

5 . The method for bonding separators according to claim 4 , wherein:
an adhesive member is adhered to the ceramic layer at an outer periphery of the other separator except for one portion, and then a portion of the ceramic layer is removed together with the adhesive member by peeling off the adhesive member; and the portion of the outer periphery of the separator, from which the ceramic layer has been removed, overlaps and then is heat-welded on the portion of the outer periphery of the other separator, from which the ceramic layer has been removed, to form a bag-shaped separator.

6 . The method for bonding separators according to claim 1 , wherein:
the ceramic layer at beginning of the separator is removed; and the portion at the beginning of the separator, from which the ceramic layer has been removed, overlaps and is heat-welded on the substrate layer of the terminal of the other separator to splice the separator and the other separator.

7 . The method for bonding separators according to claim 1 , wherein:
the ceramic layer at the terminal of the separator is removed; and the portion of the terminal of the separator, from which the ceramic layer has been removed, overlaps and is heat-welded on the substrate layer at the beginning of the other separator to splice the separator and the other separator.

8 . A method for manufacturing an electrochemical device that has an electrode laminate body in which two types of electrodes are alternately stacked on each other with separators interposed therebetween, and an outer container that accommodates the electrode laminate body together with an electrolyte;
the method comprising steps of: inserting one type of electrode into a bag-shaped separator which was formed by the method for bonding of separators according to claim 4 ; and alternately laminating the other type of electrode and the bag-shaped separators that each accommodate one type of electrode to form the electrode laminate body.

9 . An electrochemical device comprising an electrode laminate body in which two types of electrodes are stacked on each other with separators interposed therebetween, and an outer container that accommodates the electrode laminate body together with an electrolyte; wherein:
the separators having a multilayer structure that comprises a substrate layer and a ceramic layer that is laminated on at least one surface of the substrate layer and that has higher heat resistance properties than the substrate layer; the ceramic layer is removed except for one portion of the outer periphery of the separator; the outer peripheries of the separators overlap at the outside of the electrodes, the portions of the separators, from which the ceramic layers have been removed, are heat-welded together to form a bag-shaped separator, and one type of electrode is accommodated in the bag-shaped separators.

Assignees

• Envision Aesc Energy Devices Ltd

Inventors

• Kishi Mayuko
• Iwata Naoyuki

Classifications

• H01M50/466 Primary

  U-shaped, bag-shaped or folded · CPC title

• H01G11/52

  Separators · CPC title

• H01M2/18 Primary

  Electricity · mapped topic

• H01M2/145

  Electricity · mapped topic

• H01M2/164

  Electricity · mapped topic