Fingerprint identification sensor, method for manufacturing the same and fingerprint identification apparatus

Patent metadata

Field	Value
Publication number	US-2020042761-A1
Application number	US-201816104604-A
Country	US
Kind code	A1
Filing date	Aug 17, 2018
Priority date	Apr 4, 2018
Publication date	Feb 6, 2020
Grant date	—

Abstract

A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.

First claim

1 . A fingerprint identification sensor comprising:
a substrate; and a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.

2 . The fingerprint identification sensor according to claim 1 , wherein at least a portion of the active layer is located between the source and drain in the direction perpendicular to the substrate surface.

3 . The fingerprint identification sensor according to claim 2 , wherein in a direction parallel to the substrate surface, the gate is located on a side of the source and the drain away from the photosensitive device, and the thin film transistor further comprises a gate insulation layer between the gate and the active layer.

4 . The fingerprint identification sensor according to claim 1 , wherein:
within each of the sensor units, in a direction parallel to the substrate surface, the thin film transistor is located on a first side of a substrate surface and the photosensitive device is located on a second side of the substrate surface opposite to the first side, and the photosensitive device, the source and drain, the active layer, and the gate are disposed on the substrate surface sequentially from the second side to the first side.

5 . The fingerprint identification sensor according to claim 3 , wherein:
one of the source and the drain is disposed directly on the substrate surface and is directly connected to the active layer, and the other of the source and drain is disposed on the gate insulation layer and is connected to the active layer through a first via hole in the gate insulation layer in the direction perpendicular to the substrate surface.

6 . The fingerprint identification sensor according to claim 1 , wherein a black resin layer is disposed between the source and the drain, and the active layer covers at least a portion of the black resin layer.

7 . The fingerprint identification sensor according to claim 1 , wherein the photosensitive device comprises a first electrode, a photosensitive layer, and a second electrode disposed in the direction perpendicular to a substrate surface, and wherein the first electrode is closer to the substrate surface than the second electrode, one of the source and the drain is integrated with the first electrode.

8 . The fingerprint identification sensor according to claim 4 , wherein the photosensitive device comprises a first electrode, a photosensitive layer, and a second electrode disposed in the direction perpendicular to a substrate surface, and wherein the first electrode is closer to the substrate surface than the second electrode, one of the source and the drain is integrated with the first electrode.

9 . The fingerprint identification sensor according to claim 6 , wherein the photosensitive device comprises a first electrode, a photosensitive layer, and a second electrode disposed in the direction perpendicular to a substrate surface, and wherein the first electrode is closer to the substrate surface than the second electrode, one of the source and the drain is integrated with the first electrode.

10 . The fingerprint identification sensor according to claim 7 , wherein the gate insulation layer of the thin film transistor covers at least an upper portion of the photosensitive layer and the second electrode is connected to the photosensitive layer through a second via hole in the gate insulation layer.

11 . The fingerprint identification sensor according to claim 1 , wherein the photosensitive device is a PIN photodiode or a heterojunction photodiode.

12 . A method for manufacturing a fingerprint identification sensor according to claim 1 , the method comprising the steps of:
a) depositing a metal layer on the substrate surface and integrally forming one of the source and the drain of the thin film transistor as well as the first electrode of the photosensitive device through one and the same patterning process; b) preparing a photosensitive layer of the photosensitive device and forming an active layer of the thin film transistor; and c) depositing a metal layer and performing a patterning process to the metal layer to form a second electrode of the photosensitive device, a gate of the thin film transistor, and the other of the source and the drain, respectively.

13 . The method according to claim 12 , further comprising a step between step a) and step b):
applying a black resin material and performing a patterning process to the black resin material to form a black resin layer.

14 . The method according to claim 12 , further comprising a step between step b) and step c):
depositing an insulation layer and performing a patterning process to the insulation layer to form a gate insulation layer.

15 . The method according to claim 12 , wherein the other of the source and the drain is connected to the active layer through a first via hole in the gate insulation layer, and the second electrode is connected to the photosensitive layer of the photosensitive device through a second via hole of the gate insulation layer.

16 . The method according to claim 12 wherein the photosensitive device is a PIN photodiode, and wherein the step b) comprises: preparing an N-terminal, a P-terminal, and an intrinsic portion between the N-terminal and the P-terminal of the PIN photodiode, and forming the active layer of the thin film transistor at the same time of forming one of the N-terminal, the P-terminal, and the intrinsic portion of the PIN photodiode.

17 . The method according to claim 12 wherein the photosensitive device is a heterojunction photodiode, and wherein the step b) comprises: preparing an N-terminal and a P-terminal of the heterojunction photodiode, and forming the active layer of the thin film transistor at the same time of forming the N-terminal of the heterojunction photodiode.

18 . A fingerprint identification apparatus comprising the fingerprint identification sensor according to claim 1 .

Assignees

• Boe Technology Group Co Ltd

Inventors

• Liang Zhiwei
• Liu Yingwei
• Luo Wenqian
• Liu Qingzhao
• Di Muxin

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H01L31/105

  Electricity · mapped topic

• H01L31/02164

  Electricity · mapped topic

• H01L31/18

  Electricity · mapped topic

• H01L27/1218

  Electricity · mapped topic