Silicone mold

Patent metadata

Field	Value
Publication number	US-2020031024-A1
Application number	US-201816498344-A
Country	US
Kind code	A1
Filing date	Feb 5, 2018
Priority date	Mar 27, 2017
Publication date	Jan 30, 2020
Grant date	—

Abstract

Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.

First claim

1 . A silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold comprising a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.

2 . The silicone mold according to claim 1 , wherein the silicone resin composition is an addition reaction type silicone resin composition.

3 . The silicone mold according to claim 1 , wherein a maximum thickness of the silicone mold is 5 mm or less.

4 . A method for producing a silicone mold comprising molding a silicone resin composition, and subsequently heat-curing the silicone resin composition to form the silicone mold described in claim 1 .

5 . A method for producing an optical element comprising molding a curable composition containing an epoxy resin using the silicone mold described in claim 1 , and subsequently subjecting the curable composition to photocuring to form an optical element including a cured product of the curable composition.

6 . The method for producing an optical element according to claim 5 , wherein the epoxy resin is a polyfunctional alicyclic epoxy compound.

7 . The method for producing an optical element according to claim 5 , wherein the epoxy resin is a compound represented by Formula (i) below:

wherein X represents a single bond or a linking group.

8 . The method for producing an optical element according to claim 5 , wherein a maximum thickness of the optical element is from 0.1 to 2.0 mm.

9 . The method for producing an optical element according to claim 5 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

10 . The silicone mold according to claim 2 , wherein a maximum thickness of the silicone mold is 5 mm or less.

11 . A method for producing a silicone mold comprising molding a silicone resin composition, and subsequently heat-curing the silicone resin composition to form the silicone mold described in claim 2 .

12 . A method for producing a silicone mold comprising molding a silicone resin composition, and subsequently heat-curing the silicone resin composition to form the silicone mold described in claim 3 .

13 . A method for producing an optical element comprising molding a curable composition containing an epoxy resin using the silicone mold described in claim 2 , and subsequently subjecting the curable composition to photocuring to form an optical element including a cured product of the curable composition.

14 . A method for producing an optical element comprising molding a curable composition containing an epoxy resin using the silicone mold described in claim 3 , and subsequently subjecting the curable composition to photocuring to form an optical element including a cured product of the curable composition.

15 . The method for producing an optical element according to claim 6 , wherein a maximum thickness of the optical element is from 0.1 to 2.0 mm.

16 . The method for producing an optical element according to claim 7 , wherein a maximum thickness of the optical element is from 0.1 to 2.0 mm.

17 . The method for producing an optical element according to claim 6 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

18 . The method for producing an optical element according to claim 7 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

19 . The method for producing an optical element according to claim 8 , wherein the optical element is a microlens, a Fresnel lens, a molded product formed of a, plurality of microlenses or Fresnel lenses bonded via a joining section, a lenticular lens sheet, or a prism sheet.

Assignees

• Daicel Corp

Inventors

• Fujikawa Takeshi
• Fukui Sadayuki

Classifications

• G02B3/00

  Simple or compound lenses · CPC title

• B29D11/00134

  Curing of the contact lens material · CPC title

• B29K2063/00

  Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

• B29C33/40 Primary

  Plastics, e.g. foam or rubber · CPC title

• G02B1/041

  Lenses · CPC title