Systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions

US2020024762A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2020024762-A1
Application numberUS-201916415531-A
CountryUS
Kind codeA1
Filing dateMay 17, 2019
Priority dateSep 13, 2013
Publication dateJan 23, 2020
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention generally relates to systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions. In certain aspects, the invention provides methods that involve providing a metal and a solvent. The methods additionally involve applying voltage to the solvated metal to thereby produce solvent droplets including ions of the metal containing compound, and directing the solvent droplets including the metal ions to a target. In certain embodiments, once at the target, the metal ions can react directly or catalyze reactions.

First claim

Opening claim text (preview).

1 - 20 . (canceled) 21 . A method for producing a functionalized substrate, the method comprising: providing a substrate; providing a focusing mask; and spraying, under ambient conditions, metal ions from a droplet emitter toward the focusing mask such that the ions interact with the focusing mask and are focused to a discrete location on the substrate, thereby producing an aggregate of metal nanoparticles at the discrete location on the substrate. 22 . The method according to claim 21 , further comprising: moving to at least one other discrete location on the substrate; and spraying, under ambient conditions, metal ions from a droplet emitter toward another location on the focusing mask such that the ions interact with the other location on the focusing mask and are focused to another discrete location on the substrate, thereby producing an aggregate of uncapped metal nanoparticles at the other discrete location on the substrate. 23 . The method according to claim 21 , wherein the method is repeated a plurality of times to produce an array of discrete spots. 24 . The method according to claim 22 , further comprising depositing a sample on the substrate. 25 . The method according to claim 24 , wherein the sample is deposited prior to the spraying step. 26 . The method according to claim 24 , wherein the sample is deposited after to the spraying step. 27 . The method according to claim 21 , wherein the substrate comprises a metal. 28 . The method according to claim 21 , wherein the uncapped metal nanoparticles are uniform in size. 29 . The method according to claim 21 , wherein the focusing mask is a non-conductive focusing mask. 30 . The method according to claim 21 , wherein the focusing mask is a conductive focusing mask. 31 . A method for producing a functionalized substrate, the method comprising: providing a substrate; providing a focusing mask; and spraying, under ambient conditions, metal ions from a droplet emitter toward the focusing mask such that the ions interact with the focusing mask and are focused to a discrete location on the substrate, wherein the focusing mask may selectively block a portion of the metal ions, thereby producing an aggregate of metal nanoparticles at the discrete location on the substrate. 32 . The method according to claim 31 , further comprising: moving to at least one other discrete location on the substrate; and spraying, under ambient conditions, metal ions from a droplet emitter toward another location on the focusing mask such that the ions interact with the other location on the focusing mask and are focused to another discrete location on the substrate, thereby producing an aggregate of uncapped metal nanoparticles at the other discrete location on the substrate. 33 . The method according to claim 31 , wherein the method is repeated a plurality of times to produce an array of discrete spots. 34 . The method according to claim 32 , further comprising depositing a sample on the substrate. 35 . The method according to claim 34 , wherein the sample is deposited prior to the spraying step. 36 . The method according to claim 34 , wherein the sample is deposited after to the spraying step. 37 . The method according to claim 31 , wherein the substrate comprises a metal. 38 . The method according to claim 31 , wherein the uncapped metal nanoparticles are uniform in size. 39 . The method according to claim 31 , wherein the focusing mask is a non-conductive focusing mask. 40 . The method according to claim 31 , wherein the focusing mask is a conductive focusing mask.

Assignees

Inventors

Classifications

  • of noble metals · CPC title

  • C25C7/06Primary

    Operating or servicing · CPC title

  • Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells (for the production of aluminium C25C3/06 - C25C3/22) · CPC title

  • of metals not provided for in groups C25C1/02 - C25C1/20 · CPC title

  • Cross-Sectional Technologies · mapped topic

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What does patent US2020024762A1 cover?
The invention generally relates to systems and methods for producing metal clusters; functionalized surfaces; and droplets including solvated metal ions. In certain aspects, the invention provides methods that involve providing a metal and a solvent. The methods additionally involve applying voltage to the solvated metal to thereby produce solvent droplets including ions of the metal containing…
Who is the assignee on this patent?
Purdue Research Foundation
What technology area does this patent fall under?
Primary CPC classification C25C7/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jan 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).