Lens module with enhanced stability

Patent metadata

Field	Value
Publication number	US-2020007722-A1
Application number	US-201816116102-A
Country	US
Kind code	A1
Filing date	Aug 29, 2018
Priority date	Jun 29, 2018
Publication date	Jan 2, 2020
Grant date	—

Abstract

A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

First claim

1 . A lens module comprising:
a circuit board; an image sensor connected to a surface of the circuit board; a mounting bracket defining a receiving hole, the mounting bracket being connected to the surface of the circuit board, which has the image sensor connected thereto, the image sensor received in the receiving hole of the mounting bracket; an optical filter connected to the mounting bracket and positioned above the image sensor; and a lens unit connected to a surface of the mounting bracket facing away from the circuit board through a hollow adhesive layer, a surface of the lens unit connected to the mounting bracket having at least two protrusions, the protrusions positioned at an inner edge of the adhesive layer, wherein a vertical height of the protrusions is greater than or equal to a vertical height of the adhesive layer, wherein the lens unit comprises a lens holder integrally formed with a lens, the lens holder is connected to the mounting bracket, the lens is positioned above the optical filter, the lens holder comprises a square-shaped first holding portion and a circular-shaped second holding portion, the first holding portion is connected to the mounting bracket, the second holding portion is connected to a surface of the first holding portion facing away from the mounting bracket, the adhesive layer is square and comprises four sides connected end-to-end, the protrusions number four, each protrusion is parallel to one edge of the surface of the first holding portion connected to the mounting bracket, the protrusions contacts and abuts against inner edge of the four sides of the adhesive layer.

2 - 3 . (canceled)

4 . The lens module of claim 1 , wherein a recess is formed at each corner of a plurality of corners of the surface of the first holding portion connected to the mounting bracket.

5 . The lens module of claim 1 , wherein the circuit board is a rigid-flexible circuit board that comprises a first rigid board portion, a second rigid board portion, and a flexible board portion positioned between and connecting together the first rigid board portion and the second rigid board portion, the image sensor is connected to a surface of the first rigid board portion.

6 . The lens module of claim 5 , wherein the surface of the first rigid board portion having the image sensor further comprises electronic components and gold fingers, the electronic components and the gold fingers surround the image sensor, metallic wires are arranged on edges of a surface of the image sensor facing away from the circuit board, the metallic wires match and are electrically connected to the gold fingers.

7 . The lens module of claim 5 , wherein the second rigid board portion has an electronic connecting component on one surface.

8 . The lens module of claim 1 , wherein the receiving hole passes through the mounting bracket, the receiving hole is wider than the image sensor.

9 . The lens module of claim 8 , wherein a flange is formed on an inner wall of the receiving hole, the flange divides the receiving hole into a first receiving space facing the circuit board and a second receiving space opposite to the first receiving space, the image sensor is received in the first receiving space, the optical filter is received in the second receiving space and is connected to and supported by the flange.

10 . The lens module of claim 9 , wherein a surface of the optical filter facing away from the circuit board is flush with a surface of the mounting bracket facing away from the circuit board.

11 . The lens module of claim 1 , further comprising a protecting cover covering the lens unit.

12 . A lens module comprising:
a circuit board; an image sensor connected to a surface of the circuit board; a mounting bracket defining a receiving hole and four protrusions, the mounting bracket being connected to the surface of the circuit board, and the image sensor being received in the receiving hole of the mounting bracket; an optical filter connected to the mounting bracket and positioned above the image sensor; and a lens unit connected to a surface of the mounting bracket facing away from the circuit board through a hollow adhesive layer, a surface of the lens unit being connected to each of the four protrusions of the mounting bracket, the four protrusions being positioned at an inner edge of the adhesive layer, a vertical height of each of the four protrusions being greater than or equal to a vertical height of the adhesive layer, wherein the lens unit comprises a lens holder connected to the mounting bracket, the lens holder comprises a first holding portion and a second holding portion, the first holding portion is square shaped and connected to the mounting bracket, the second holding portion is circular shaped and is connected to a surface of the first holding portion facing away from the mounting bracket, the adhesive layer is square shaped and comprises four sides connected end-to-end, each of the four protrusions is parallel to one edge of the surface of the first holding portion connected to the mounting bracket, the protrusions contacts and abuts against inner edge of the four sides of the adhesive layer.

Assignees

• Triple Win Tech Shenzhen Co Ltd
• Hon Hai Prec Ind Co Ltd

Inventors

• Chen Shin-Wen
• Ma xiao-mei
• Fan Ke-Hua
• Zhang Long-Fei

Classifications

• G02B7/025 Primary

  using glue · CPC title

• H04N23/50

  Constructional details · CPC title

• H04N23/68

  for stable pick-up of the scene, e.g. compensating for camera body vibrations · CPC title

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title