Laser dicing device, method of laser beam modulation, and method of dicing a substrate

Patent metadata

Field	Value
Publication number	US-2020006909-A1
Application number	US-201916354686-A
Country	US
Kind code	A1
Filing date	Mar 15, 2019
Priority date	Jun 28, 2018
Publication date	Jan 2, 2020
Grant date	—

Abstract

A laser dicing device includes: a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the support, wherein the focusing lens is configured to collect the modulated Gaussian laser beam inside the substrate seated on the substrate support.

First claim

1 . A method of laser beam modulation, the method comprising:
emitting a Gaussian laser beam; and modulating a shape of the emitted Gaussian laser beam by reducing intensity of the Gaussian laser beam in a region surrounding a first line passing through a center of the Gaussian laser beam in a plan view, wherein the first line is parallel with a laser dicing direction of the emitted Gaussian laser beam.

2 . The method of claim 1 , wherein the modulating of the shape of the emitted Gaussian laser beam comprises modulating the shape of the emitted Gaussian laser beam by using a slit.

3 . The method of claim 1 , wherein the modulating of the Gaussian laser beam comprises modulating the Gaussian laser beam into an 8-shaped laser beam.

4 . The method of claim 3 , wherein the modulating of the laser beam by using a spatial light modulator (SLM).

5 . The method of claim 3 , wherein the modulating of the Gaussian laser beam comprises:
splitting the emitted Gaussian laser beam through birefringence; removing a central portion of the split Gaussian laser beam; and removing side portions of the Gaussian laser beam after removing the central portion of the split Gaussian laser beam.

6 . The method of claim 3 , wherein the modulating of the Gaussian laser beam comprises:
modulating the emitted Gaussian laser beam into a cylindrical vector beam (CVB); and modulating the CVB into an 8-shaped laser beam.

7 . The method of claim 6 , wherein the modulating of the Gaussian laser beam into the CVB is performed by using at least one of a spiral element, a plurality of spatial laser beam modulators, a fiber-optic polarization controller, and a spatially segmented half-wavelength plate.

8 . The method of claim 7 , wherein the modulating of the CVB into the 8-shaped laser beam is performed by using a polarizing filter.

9 . The method of claim 8 , wherein the CVB has radial polarization.

10 . The method of claim 8 , wherein the CVB has azimuthal polarization.

11 . A laser dicing device comprising:
a Gaussian laser beam emitter configured to emit a Gaussian laser beam having a Gaussian energy distribution; a laser beam modulator configured to modulate a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian laser beam, the first line crossing a center of the Gaussian laser beam in a plan view; a focusing lens configured to focus a modulated Gaussian laser beam modulated by the laser beam modulator; and a substrate support configured that a substrate to be diced is seated on the substrate support, wherein the focusing lens is configured to collect the modulated laser beam inside the substrate seated on the substrate support.

12 . The laser dicing device of claim 11 , wherein the laser beam modulator is configured to modulate a Gaussian laser beam emitted from the Gaussian laser beam emitter into an 8-shaped laser beam.

13 . The laser dicing device of claim 12 , further comprising an optical transmission unit configured to transmit the modulated 8-shaped laser beam.

14 . The laser dicing device of claim 12 , wherein the laser beam modulator comprises a slit.

15 . The laser dicing device of claim 12 , wherein the laser beam modulator comprises a spatial light modulator (SLM).

16 . The laser dicing device of claim 12 , wherein the laser beam modulator comprises:
a birefringent lens configured to split the Gaussian laser beam; a center slit configured to remove a central portion of the Gaussian laser beam split by the birefringent lens; and a side slit configured to remove side portions of the Gaussian laser beam after removing the central portion of the Gaussian laser beam by the center slit.

17 . The laser dicing device of claim 12 , wherein the laser beam modulator comprises: a cylindrical vector beam (CVB) modulation module configured to modulate the Gaussian laser beam into the CVB; and an 8-shaped laser beam modulation module configured to modulate the CVB into an 8-shaped laser beam.

18 - 21 . (canceled)

22 . A method of dicing a substrate by using a laser dicing device, the method comprising:
emitting a Gaussian laser beam; modulating a shape of the emitted Gaussian laser beam by reducing intensity in a region surrounding a first line parallel with a laser dicing direction of the emitted Gaussian laser beam, the first line passing through a center of the Gaussian laser beam in a plan view; focusing the modulated Gaussian laser beam; forming modified regions and cracks by collecting the focused modulated Gaussian laser beam inside a substrate; relatively moving the laser dicing device and the substrate in a dicing direction; and dicing the substrate into individual semiconductor chips by applying an external force to the substrate and expanding the cracks.

23 . The method of dicing the substrate of claim 22 , wherein the modulating comprises modulating the emitted Gaussian laser beam into an 8-shaped laser beam.

24 - 27 . (canceled)

28 . The method of dicing the substrate of claim 22 , wherein the modulating of the Gaussian laser beam comprises:
cylindrical vector beam (CVB) modulating changing the emitted Gaussian laser beam into the CVB; and 8-shaped laser beam modulating changing the CVB into the 8-shaped laser beam.

29 - 32 . (canceled)

What is claimed is:

1 . A method of laser beam modulation, the method comprising:
emitting a Gaussian laser beam; and modulating a shape of the emitted Gaussian laser beam by reducing intensity of the Gaussian laser beam in a region surrounding a first line passing through a center of the Gaussian laser beam in a plan view, wherein the first line is parallel with a laser dicing direction of the emitted Gaussian laser beam.

2 . The method of claim 1 , wherein the modulating of the shape of the emitted Gaussian laser beam comprises modulating the shape of the emitted Gaussian laser beam by using a slit.

3 . The method of claim 1 , wherein the modulating of the Gaussian laser beam comprises modulating the Gaussian laser beam into an 8-shaped laser beam.

4 . The method of claim 3 , wherein the modulating of the Gaussian laser beam comprises modulating the Gaussian laser beam into the 8-shaped laser beam by using a spatial light modulator (SLM).

5 . The method of claim 3 , wherein the modulating of the Gaussian laser beam comprises:
splitting the emitted Gaussian laser beam through birefringence; removing a central portion of the split Gaussian laser beam; and removing side portions of the Gaussian laser beam after removing the central portion of the split Gaussian laser beam.

6 . The method of claim 3 , wherein the modulating of the Gaussian laser beam comprises:
modulating the emitted Gaussian laser beam into a cylindrical vector beam (CVB); and modulating the CVB into an 8-shaped laser beam.

7 . The method of claim 6 , wherein the modulating of the Gaussian laser beam into the CVB is performed by using at least one of a spiral element, a plurality of spatial laser beam modulators, a fiber-optic polarization controller, and a spatially segmented half-wavelength plate.

8 . The method of claim 7 , wherein the modulating of the CVB into the 8-shaped laser beam is performed

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kwon Young-Chul
• Kang Dong-Woo
• Han Man-Hee

Classifications

• C03B33/0222 Primary

  Scoring using a focussed radiation beam, e.g. laser · CPC title

• G02B27/0927 Primary

  Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat · CPC title

• H01S3/0085 Primary

  Modulating the output, i.e. the laser beam is modulated outside the laser cavity · CPC title

• G02B27/0988

  Diaphragms, spatial filters, masks for removing or filtering a part of the beam · CPC title

• G02B27/286

  for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another (G02B5/3083 takes precedence; light guide coupling means utilising polarising elements G02B6/34) · CPC title