Epoxy resin composition, prepreg, cured resin, and fiber reinforced composite material (as amended)
US-2017362427-A1 · Dec 21, 2017 · US
Thermally crosslinkable composition
US2020002584A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020002584-A1 |
| Application number | US-201816490127-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 10, 2018 |
| Priority date | Jul 11, 2017 |
| Publication date | Jan 2, 2020 |
| Grant date | — |
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Abstract
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The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.
First claim
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1 . A thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C. 2 . The thermally crosslinkable composition according to claim 1 comprising 30 to 200 parts by mass of the acid-modified polymer B based on 100 parts by mass of the acid-modified polymer A, and 20 to 200 parts by mass of the tackifier resin and 0.2 to 3 parts by mass of the curing agent based on 100 parts by mass of a total amount of the acid-modified polymers A and B. 3 . The thermally crosslinkable composition according to claim 1 , wherein a content of the tackifier resin having an acid value of 5 or less is 20 to 100% by mass based on 100% by mass of a whole tackifier resin. 4 . The thermally crosslinkable composition according to claim 3 , wherein the tackifier resin having an acid value of 5 or less is selected from the group consisting of rosin types, terpene types and petroleum resin types. 5 . The thermally crosslinkable composition according to claim 1 , wherein the curing agent is a solid polyamine compound having a melting point of 150° C. or higher. 6 . The thermally crosslinkable composition according to claim 5 , wherein the solid polyamine compound having a melting point of 150° C. or higher is a hydrazide type polyamine. 7 . The thermally crosslinkable composition according to claim 1 , further comprising an acid-unmodified thermoplastic resin. 8 . The thermally crosslinkable composition according to claim 7 , wherein the acid-unmodified thermoplastic resin is an acid-unmodified styrene-containing thermoplastic elastomer. 9 . The thermally crosslinkable composition according to claim 1 , further comprising a solvent. 10 . A hot melt type adhesive comprising the thermally crosslinkable composition according to claim 1 . 11 . A film adhesive comprising the thermally crosslinkable composition according to claim 1 . 12 . An adhesive for adherent surface material, wherein the adhesive comprises the thermally crosslinkable composition according to claim 1 . 13 . An adherent surface material comprising the adhesive according to claim 12 . 14 . An automotive interior component comprising the adherent surface material according to claim 13 and a polyolefin substrate. 15 . An architectural interior material comprising the adherent surface material according to claim 13 and the polyolefin substrate.
Assignees
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Classifications
Presence of styrenic polymer · CPC title
Presence of graft polymer · CPC title
grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond · CPC title
Rosin · CPC title
Presence of ethen-propene or ethene-propene-diene copolymers · CPC title
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- What does patent US2020002584A1 cover?
- The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkabl…
- Who is the assignee on this patent?
- Sunstar Engineering Inc
- What technology area does this patent fall under?
- Primary CPC classification C09J123/30. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Jan 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).