Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components

Patent metadata

Field	Value
Publication number	US-2019394912-A1
Application number	US-201916428081-A
Country	US
Kind code	A1
Filing date	May 31, 2019
Priority date	Mar 4, 2004
Publication date	Dec 26, 2019
Grant date	—

Abstract

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

First claim

1 . A circuit board panel comprising:
a first module circuit board and a second module circuit board arranged to define a space that runs between a first portion of the periphery of the first module circuit board and a portion of the periphery of the second module circuit board; and a plurality of shield components each extending across the space and each including a first conductive portion mounted along the first portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the second module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and second module circuit boards, respectively.

2 . The circuit board panel of claim 1 wherein the space defines a sacrificial margin between the first module circuit board and the second module circuit board.

3 . The circuit board panel of claim 2 wherein the sacrificial margin is a linear cut path that includes the non-conductive portions of the plurality of shield components.

4 . The circuit board panel of claim 1 wherein each of the plurality of shield components is dimensioned to be at least as high as a top portion of the at least one electronic component mounted on the first module circuit board.

5 . The circuit board panel of claim 1 wherein each shield component is a surface mount technology shield wall component.

6 . The circuit board panel of claim 1 further comprising:
a third module circuit board, the first module circuit board and the third module circuit board arranged to define a second space that runs between a second portion of the periphery of the first module circuit board and a portion of the periphery of the third module circuit board; and
a second plurality of shield components each extending across the second space and each including a first conductive portion mounted along the second portion of the periphery of the first module circuit board, a second conductive portion mounted along the portion of the periphery of the third module circuit board, and a non-conductive portion extending between the first conductive portion and the second conductive portion, the first and second conductive portions of each of the second plurality of shield components configured to provide electromagnetic shielding for at least one electronic component mounted on the first and third module circuit boards, respectively.

7 . The circuit board panel of claim 1 wherein the at least one electronic component mounted on the first module circuit board is a surface mount technology component.

8 . The circuit board panel of claim 1 wherein each of the plurality of shield components is higher than a top portion of the at least one electronic component mounted on the first module circuit board.

9 . The circuit board panel of claim 1 further comprising a top conductive shield mounted above the first module circuit board.

10 . The circuit board panel of claim 9 wherein the top conductive shield is coupled to the first conductive portion mounted along the first portion of the periphery of the first module circuit board.

11 . The circuit board panel of claim 9 wherein the top conductive shield is formed from a conformal coating.

12 . The circuit board panel of claim 1 further comprising an encapsulant mounted above the at least one electronic component mounted on the first module circuit board.

13 . The circuit board panel of claim 12 wherein the encapsulant is a nonconductive material.

14 . The circuit board panel of claim 12 further comprising a top conductive shield mounted above the encapsulant and coupled to an exposed portion of the first conductive portion mounted along the first portion of the periphery of the first module circuit board.

15 . The circuit board panel of claim 12 wherein the encapsulant is a polymer resin.

16 . The circuit board panel of claim 1 wherein the non-conductive portion extending between the first conductive portion and the second conductive portion is a polymer resin.

17 . The circuit board panel of claim 1 wherein a gap exists between a pair of consecutive shield components of the plurality of shield components.

18 . A radio frequency component comprising:
a plurality of surface mounted components mounted on a circuit board; a plurality of shield components mounted on a periphery of the circuit board and at least partially surrounding the plurality of surface mounted components, each shield component of the plurality of shield components dimensioned to be higher than the plurality of surface mounted components, and the plurality of shield components providing electromagnetic shielding to the plurality of surface mounted components; an overmold layer at least partially covering the plurality of surface mounted components while leaving at least a portion of at least some of the plurality of shield components exposed; and a conductive layer above the overmold layer, the conductive layer in contact with the exposed portions of the at least some of the plurality of shield components.

19 . The radio frequency component of claim 18 wherein the top conductive shield is a conformal coating.

20 . The radio frequency component of claim 18 wherein the overmold layer is a non-conductive resin.

Assignees

• Skyworks Solutions Inc

Inventors

• Thompson Philip H
• Pottebaum Larry D

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title