Laser assembly

Patent metadata

Field	Value
Publication number	US-2019393673-A1
Application number	US-201916363916-A
Country	US
Kind code	A1
Filing date	Mar 25, 2019
Priority date	Jun 21, 2018
Publication date	Dec 26, 2019
Grant date	—

Abstract

Laser assemblies are provided. Aspects of the laser assemblies according to certain embodiments include a laser, a thermoelectric cooler in contact with a bottom surface of the laser and a heat dissipation component in contact with a bottom surface of the thermoelectric cooler. Optical decks having a substrate and a laser assembly, e.g. as described above, are also provided. Methods and systems for irradiating a sample in a flow stream with the laser assembly are also provided. Aspects further include kits having a diode laser, a thermoelectric cooler and a heat dissipation component.

First claim

1 . A laser assembly comprising:
a laser; a thermoelectric cooler in contact with a bottom surface of the laser; and a heat dissipation component in contact with a bottom surface of the thermoelectric cooler.

2 . The laser assembly according to claim 1 , wherein the laser is a diode laser.

3 . The laser assembly according to claim 1 , wherein the thermoelectric cooler is a Peltier thermoelectric cooler.

4 . The laser assembly according to claim 1 , wherein the heat dissipation component further comprises a heat dissipation fin.

5 . The laser assembly according to claim 4 , wherein the heat dissipation component comprises a plurality of heat dissipation fins.

6 . The laser assembly according to claim 1 , wherein the heat dissipation component comprises a first heat transfer block and a second heat transfer block.

7 . The laser assembly according to claim 6 , wherein the heat dissipation component is configured to symmetrically dissipate heat from the thermoelectric cooler to the first heat transfer block and the second heat transfer block.

8 . The laser assembly according to claim 6 , wherein the heat dissipation component is symmetrical across a vertical plane.

9 . The laser assembly according to claim 6 , wherein the first heat transfer block and the second heat transfer block comprise a plurality of heat dissipation fins.

10 . The laser assembly according to claim 1 , wherein the heat dissipation component is axially symmetrical.

11 . The laser assembly according to claim 1 , wherein the heat dissipation component comprises one or more cutouts.

12 . The laser assembly according to claim 10 , wherein the one or more cutouts are configured to dissipate heat by thermal expansion.

13 . The laser assembly according to claim 1 , further comprising one or more thermally insulating mounting pads in contact with a bottom surface of the heat dissipation component.

14 - 15 . (canceled)

16 . The laser assembly according to claim 1 , wherein the laser consists of a laser diode and a collimating lens.

17 . An optical deck comprising:
a substrate; and a laser assembly in contact with a surface of the substrate, the laser assembly comprising:
a laser;
a thermoelectric cooler in contact with a bottom surface of the laser; and
a heat dissipation in contact with a bottom surface of the thermoelectric cooler.

18 . The optical deck according to claim 17 , wherein the substrate is a printed circuit board.

19 - 40 . (canceled)

41 . A flow cytometer comprising:
a flow cell configured to propagate a sample in a flow stream; a sensor configured to detect light signals from the flow stream; and a laser assembly comprising:
a laser configured to irradiate the sample in the flow stream;
a thermoelectric cooler in contact with a bottom surface of the laser; and
a heat dissipation in contact with a bottom surface of the thermoelectric cooler.

42 . The flow cytometer according to claim 41 , wherein the laser is a diode laser.

43 - 66 . (canceled)

67 . A method comprising:
irradiating a sample in a flow stream with a laser assembly according to claim 1 ,
and
detecting light from the flow stream at one or more wavelengths.

68 . The method according to claim 67 , wherein the laser is a diode laser.

69 - 110 . (canceled)

Assignees

• Becton Dickinson Co

Inventors

• Cao Jianying
• Rey Dennis
• Shao Qing

Classifications

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title

• G01N2015/1006

  for cytology · CPC title

• G01N15/1404

  Handling flow, e.g. hydrodynamic focusing · CPC title

• H01S5/02415 Primary

  by using a thermo-electric cooler [TEC], e.g. Peltier element · CPC title