Display apparatus with array of light emitting diodes and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2019392751-A1
Application number	US-201916447484-A
Country	US
Kind code	A1
Filing date	Jun 20, 2019
Priority date	Jun 22, 2018
Publication date	Dec 26, 2019
Grant date	—

Abstract

A display includes a substrate with a plurality of electronic control elements, an array of light-emitting diodes having a semiconductor layer, a plurality of light emitting units disposed on the semiconductor layer, and a plurality of first electrodes disposed on the semiconductor layer, an bonding layer disposed between the substrate and the array of light-emitting diodes, and a plurality of wavelength conversion elements disposed on the semiconductor layer and spaced apart from each other. The plurality of wavelength conversion elements and the plurality of light emitting units are disposed at different sides of the semiconductor layer. The plurality of wavelength conversion elements is arranged in positions corresponding to the plurality of light-emitting units.

First claim

What is claimed is:

1 . A display, comprising:
a substrate, comprising a plurality of control elements; an LED array, comprising a semiconductor layer, a plurality of light-emitting units formed on the semiconductor layer, and a plurality of first electrodes formed on the semiconductor layer; a bonding layer, formed between the substrate and the LED array; and a plurality of wavelength conversion elements, separated from each other, and arranged on the semiconductor layer in positions corresponding to the plurality of light-emitting units,
wherein the plurality of light-emitting units and the plurality of the wavelength elements are arranged on opposite sides of the semiconductor layer.

2 . The display according to claim 1 , wherein the plurality of wavelength conversion elements are arranged on the plurality of the light-emitting units without an interposition of growth substrate.

3 . A display, comprising:
a substrate, comprising a plurality of electronic control elements; an LED array, comprising a semiconductor layer, a plurality of light-emitting units formed on the semiconductor layer, and a plurality of first electrodes formed on the semiconductor layer; and a bonding layer, comprising a bonding glue, and a plurality of connecting metals in the bonding glue, wherein the bonding glue is disposed between the substrate and the LED array, wherein the plurality of connecting metals comprises:
a plurality of first portions, corresponding to the plurality of light-emitting units; and
a plurality of second portions, corresponding to a portion of the plurality of first electrodes,
wherein the plurality of first portions and the plurality of second portions have different heights.

4 . A method of forming a display, comprising steps of:
providing a substrate with a plurality of electronic control elements; forming a plurality of connecting metals on the substrate, wherein the plurality of connecting metals comprises a plurality of first portions and a plurality of second portions; providing an LED array which comprises a semiconductor layer and a plurality of light-emitting units formed on the semiconductor layer; connecting the LED array and the substrate; forming a bonding glue between the substrate and the LED array; forming a plurality of wavelength conversion elements on the semiconductor layer,
wherein the plurality of wavelength conversion elements is separated from each other, and arranged in positions corresponding to the plurality of light-emitting units,
wherein the plurality of light-emitting units and the plurality of the wavelength elements are arranged on different sides of the semiconductor layer.

5 . The method according to claim 4 , wherein the step of connecting the LED array and the substrate is performed before the step of forming the bonding glue.

6 . The method according to claim 4 , wherein the step of forming the bonding glue is performed before the step of connecting the LED array and the substrate.

7 . The method according to claim 4 , wherein the step of forming the plurality of connecting metals comprises steps of:
forming a photoresist on the substrate; patterning the photoresist to form a patterned photoresist with a plurality of openings; and forming the plurality of connecting metals on the plurality of openings.

8 . The method according to claim 7 , wherein the plurality of connecting metals is formed by vapor deposition.

9 . The method according to claim 4 , further comprising a step of forming a plurality of first electrodes on the semiconductor layer, wherein the plurality of first portions corresponds to the plurality of light-emitting units, respectively, wherein, the plurality of second portions corresponds to a portion of the plurality of first electrodes.

10 . The method according to claim 9 , wherein the substrate comprises a plurality of control pads which connects the plurality of first portions and the plurality of second portions.

11 . The method according to claim 7 , further comprising a step of removing the patterned photoresist.

Assignees

• Epistar Corp

Inventors

• Hsieh Min-Hsun

Classifications

• H10P14/6328

  Deposition from the gas or vapour phase · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• G09G3/32 Primary

  semiconductive, e.g. using light-emitting diodes [LED] · CPC title

• H01L21/02263

  Electricity · mapped topic

• H01L33/38

  Electricity · mapped topic