Tin alloy plating solution

US2019390357A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019390357-A1
Application numberUS-201716481959-A
CountryUS
Kind codeA1
Filing dateDec 13, 2017
Priority dateJan 31, 2017
Publication dateDec 26, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A tin alloy plating solution comprising a soluble tin salt, a soluble salt of a metal nobler than tin, and a sulfide compound represented by general formula (I). In formula (I), n is 1 to 3. The metal nobler than tin is preferably silver, copper, gold, or bismuth.

First claim

Opening claim text (preview).

1 . A tin alloy plating solution comprises a soluble tin salt, a soluble salt of a metal nobler than tin, and a sulfide compound represented by general formula (1), wherein a metal nobler than tin is at least 1 or 2 or more kinds of metals selected from silver, copper, gold and bismuth, in general formula (1), n is from 1 to 3 HO—CH 2 CH 2 —S—(CH 2 CH 2 —O—CH 2 CH 2 —S) n —CH 2 CH 2 —OH  (1) 2 . The tin alloy plating solution according to claim 1 , further comprising at least 1 or 2 or more surfactants selected from anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. 3 . (canceled) 4 . The tin alloy plating solution according to claim 1 , further comprising an antioxidant. 5 . The tin alloy plating solution according to claim 1 , further comprising a complexing agent for tin. 6 . The tin alloy plating solution according to claim 1 , further comprising a pH adjusting agent. 7 . The tin alloy plating solution according to claim 1 , further comprising a brightening agent. 8 . The tin alloy plating solution according to claim 2 , further comprising an antioxidant. 9 . The tin alloy plating solution according to claim 2 , further comprising a complexing agent for tin. 10 . The tin alloy plating solution according to claim 4 , further comprising a complexing agent for tin. 11 . The tin alloy plating solution according to claim 8 , further comprising a complexing agent for tin. 12 . The tin alloy plating solution according to claim 2 , further comprising a pH adjusting agent. 13 . The tin alloy plating solution according to claim 4 , further comprising a pH adjusting agent. 14 . The tin alloy plating solution according to claim 5 , further comprising a pH adjusting agent. 15 . The tin alloy plating solution according to claim 8 , further comprising a pH adjusting agent. 16 . The tin alloy plating solution according to claim 2 , further comprising a brightening agent. 17 . The tin alloy plating solution according to claim 4 , further comprising a brightening agent. 18 . The tin alloy plating solution according to claim 5 , further comprising a brightening agent. 19 . The tin alloy plating solution according to claim 6 , further comprising a brightening agent. 20 . The tin alloy plating solution according to claim 8 , further comprising a brightening agent. 21 . The tin alloy plating solution according to claim 9 , further comprising a brightening agent.

Assignees

Inventors

Classifications

  • C25D3/56Primary

    of alloys · CPC title

  • characterised by the organic bath constituents used · CPC title

  • Semiconductors · CPC title

  • C25D3/60Primary

    containing more than 50% by weight of tin · CPC title

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Frequently asked questions

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What does patent US2019390357A1 cover?
A tin alloy plating solution comprising a soluble tin salt, a soluble salt of a metal nobler than tin, and a sulfide compound represented by general formula (I). In formula (I), n is 1 to 3. The metal nobler than tin is preferably silver, copper, gold, or bismuth.
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification C25D3/56. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Dec 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).