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Negative thermal expansion material and composite material
US2019375655A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019375655-A1 |
| Application number | US-201916433269-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 6, 2019 |
| Priority date | Jun 8, 2018 |
| Publication date | Dec 12, 2019 |
| Grant date | — |
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- Title
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Abstract
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A negative thermal expansion material according to an embodiment is represented by a general formula (1): Cu2-xRxV2O7 (R is at least one element selected from Zn, Ga, and Fe) and includes an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less.
First claim
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What is claimed is: 1 . A negative thermal expansion material that is represented by a general formula (1): Cu 2-x R x V 2 O 7 (R is at least one element selected from Zn, Ga, and Fe) and that comprises an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less. 2 . The negative thermal expansion material according to claim 1 , wherein x in the general formula (1) is 0.1 to 0.2. 3 . The negative thermal expansion material according to claim 1 , wherein R is Zn. 4 . The negative thermal expansion material according to claim 3 , wherein x in the general formula (1) is 0.15 to 1. 5 . A negative thermal expansion material that is represented by a general formula (2): Cu 2 V 2-x Mo x O 7 and that comprises an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less. 6 . The negative thermal expansion material according to claim 5 , wherein x in the general formula (2) is 0.1 to 0.2. 7 . The negative thermal expansion material according to claim 1 , wherein the oxide sintered compact is in a monoclinic β phase. 8 . The negative thermal expansion material according to claim 1 , wherein the linear expansion coefficient is −10 ppm/K or less in a temperature range of 100 to 700K. 9 . A composite material comprising: the negative thermal expansion material according to claim 1 ; and a positive thermal expansion material having a positive linear expansion coefficient.
Assignees
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Classifications
Compounds of vanadium · CPC title
by d-values or two theta-values, e.g. as X-ray diagram · CPC title
by unit-cell parameters, atom positions or structure diagrams · CPC title
Thermal properties · CPC title
- C09K5/14Primary
Solid materials, e.g. powdery or granular · CPC title
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Frequently asked questions
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- What does patent US2019375655A1 cover?
- A negative thermal expansion material according to an embodiment is represented by a general formula (1): Cu2-xRxV2O7 (R is at least one element selected from Zn, Ga, and Fe) and includes an oxide sintered compact whose linear expansion coefficient is −10 ppm/K or less.
- Who is the assignee on this patent?
- Univ Nagoya Nat Univ Corp
- What technology area does this patent fall under?
- Primary CPC classification C09K5/14. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Dec 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).