Method of forming multi-layer sintering object support structure

US2019375009A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019375009-A1
Application numberUS-201916436271-A
CountryUS
Kind codeA1
Filing dateJun 10, 2019
Priority dateJun 11, 2018
Publication dateDec 12, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Support substrates are used in certain additive fabrication processes to permit processing of an object. For additive fabrication processes with materials that are sintered into a final part, a multi-layer support substrate of interleaved support and interface layers is fabricated to support an object while reducing an impact of friction on shrinkage of the part during the sintering process.

First claim

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1 - 20 . (canceled) 21 . A method for additive manufacturing, the method comprising: depositing a first amount of a first metal build material having a first sintering temperature; depositing a first amount of interface material on a surface of the first amount of the first metal build material, the interface material having a second sintering temperature greater than the first sintering temperature; depositing a second amount of the first metal build material on a surface of the first amount of interface material; and depositing a second amount of interface material on a surface of the second amount of the first metal build material, wherein the first amount of interface material physically separates the first amount of the first metal build material from the second amount of the first metal build material 22 . The method according to claim 21 , wherein the depositing the first amount of metal build material, the first amount of interface material, the second amount of metal build material, and the second amount of interface material includes forming a plurality of gaps where the first amount of metal build material, the first amount of interface material, the second amount of metal build material, and the second amount of interface material are not deposited, and wherein each gap from the plurality of gaps overlaps at least one adjacent gap from the plurality of gaps in at least one of a vertical direction or a horizontal direction. 23 . The method according to claim 21 , further comprising printing a three-dimensional (3D) object on a surface of the second amount of interface material using a second metal build material. 24 . The method according to claim 23 , wherein the second metal build material is the same as the first metal build material. 25 . The method according to claim 23 , wherein the metal build material includes a binder, and wherein the method further comprises: de-binding a first portion of the binder; and heating the first amount of the first metal build material, the second amount of metal build material, and the 3D object, wherein a second portion of the binder is vaporized during the heating step. 26 . The method according to claim 23 , further comprising heating the first amount of the first metal build material, the second amount of the first metal build material, the first amount of interface material, the second amount of interface material, and the 3D object to the first sintering temperature, wherein a volume of each of the first amount of the first metal build material, the second amount of the first metal build material, and the 3D object decreases during the heating. 27 . The method according to claim 23 , wherein the first metal build material has a first physical property and the second metal build material also has the first physical property. 28 . The method according to claim 21 , further comprising depositing an initial amount of interface material before depositing the first amount of the first metal build material. 29 . The method according to claim 21 , wherein the interface material is sinter-resistant to the first metal build material when heated to the first sintering temperature. 30 . The method according to claim 21 , further comprising depositing amounts of a support material to form one or more supports, wherein the support material forming the one or more supports has a different shrink ratio than a shrink ratio of the first metal build material. 31 . The method according to claim 21 , wherein one or more of the first amount of the first metal build material or the second amount of the first metal build material are formed of a plurality of layers of the first metal build material, and one or more of the first amount of interface material or the second amount of interface material are formed of a plurality of layers of the interface material. 32 . The method according to claim 21 , wherein the method further comprises depositing the first amount of the first metal build material on a printing surface and controlling a temperature of the printing surface. 33 . The method according to claim 21 , wherein the first amount of the first metal build material is deposited on a printing surface, and wherein the method further comprises moving the printing surface. 34 . The method according to claim 21 , wherein the interface material includes a ceramic material. 35 . A method of printing a three-dimensional (3D) object, the method comprising: forming a plurality of layers on a build surface, wherein each of the plurality of layers includes a first material including metal powder; depositing an interface layer including a second material on a surface of a topmost layer of the plurality of layers and on at least another layer of the plurality of layers; and forming the 3D object out of the first material, wherein the 3D object is formed on the interface layer deposited on the topmost layer of the plurality of layers. 36 . The method according to claim 35 , wherein the forming the plurality of layers includes forming a plurality of gaps where the first material from each of the plurality layers is not formed, and wherein the plurality of gaps in each layer of the plurality of layers overlaps with the plurality of gaps on adjacent layers of the plurality of layers. 37 . A method of printing a three-dimensional (3D) object, the method comprising: forming a plurality of layers on a build surface, wherein each layer of the plurality of layers includes a first material; depositing an interface layer including a second material on a surface of a topmost layer of the plurality of layers and on at least another layer of the plurality of layers; and printing the 3D object out of a third material, wherein the 3D object is printed on the interface layer deposited on the topmost layer of the plurality of layers, wherein the first material and the third material each have a sintering temperature that is below a sintering temperature of the second material. 38 . The method according to claim 37 , wherein the first material and the third material each include a metal powder. 39 . The method according to claim 38 , wherein the metal powder of the first material is the same as the metal powder of the second material. 40 . The method according to claim 37 , wherein the metal powder of the first material has a first physical property and a metal powder in the third material also has the first physical property.

Assignees

Inventors

Classifications

  • using only solid materials · CPC title

  • Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material (selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00) · CPC title

  • Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title

  • Use of metals, their alloys or their compounds, as filler · CPC title

  • Parallel processing within single device · CPC title

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What does patent US2019375009A1 cover?
Support substrates are used in certain additive fabrication processes to permit processing of an object. For additive fabrication processes with materials that are sintered into a final part, a multi-layer support substrate of interleaved support and interface layers is fabricated to support an object while reducing an impact of friction on shrinkage of the part during the sintering process.
Who is the assignee on this patent?
Desktop Metal Inc
What technology area does this patent fall under?
Primary CPC classification B22F3/008. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Dec 12 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).