Tuning wafer inspection recipes using precise defect locations
US-9224660-B2 · Dec 29, 2015 · US
US2019368024A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019368024-A1 |
| Application number | US-201715748885-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 24, 2017 |
| Priority date | Feb 24, 2017 |
| Publication date | Dec 5, 2019 |
| Grant date | — |
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A positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber is described. The positioning arrangement comprising a first track extending in a first direction and configured transportation of the substrate carrier configured for holding a substrate having a substrate surface, a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface, and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track.
Opening claim text (preview).
1 . A positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber, comprising: a first track extending in a first direction and configured for transportation of the substrate carrier configured for holding a substrate having a substrate surface; a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface; and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track. 2 . The positioning arrangement according to claim 1 , wherein the first track is configured for contactless transportation of the substrate carrier, and wherein the second track is configured for contactless transportation of the mask carrier. 3 . The positioning arrangement according to claim 2 , wherein the holding arrangement comprises at least one holding element configured to be movable in a moving direction being different to a substrate transport direction. 4 . The positioning arrangement according to claim 1 , further comprising an alignment system configured for aligning the substrate carrier relative to the mask carrier. 5 . The positioning arrangement according to claim 1 , wherein the first track comprises a first guiding structure and a first drive structure which are spaced apart by a first distance. 6 . The positioning arrangement according to claim 1 , wherein the second track comprises a second guiding structure and a second drive structure which are spaced apart by a second distance. 7 . The positioning arrangement according to according to claim 1 , wherein the first track comprises a first guiding structure and a first drive structure which are spaced apart by a first distance, wherein the second track comprises a second guiding structure and a second drive structure which are spaced apart by a second distance, and wherein the first distance is smaller than the second distance. 8 . The positioning arrangement according to claim 5 , wherein the first guiding structure is a first magnetic guiding structure and the first drive structure is a first magnetic drive structure, and/or wherein the second guiding structure is a second magnetic guiding structure and the second drive structure is a second magnetic drive structure. 9 . A transportation system for transporting a substrate carrier and a mask carrier in a processing system, comprising: a first track extending in a first direction and for contactless transportation of the substrate carrier configured for holding a substrate having a substrate surface; and a second track extending in the first direction and configured for contactless transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface. 10 . The transportation system according claim 9 , wherein the first track comprises a first guiding structure and a first drive structure which are spaced apart by a first distance. 11 . The transportation system according to claim 9 , wherein the second track comprises a second guiding structure and a second drive structure which are spaced apart by a second distance. 12 . The transportation system according to claim 10 , wherein the first distance is smaller than the second distance. 13 . A vacuum processing system comprising: a vacuum processing chamber having a positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber, the positioning arrangement comprising: a first track extending in a first direction and configured for transportation of the substrate carrier configured for holding a substrate having a substrate surface; a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface, and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track; and at least one further chamber having a transportation system for transporting a substrate carrier and a mask carrier in a processing system, the transportation system comprising: a first track extending in a first direction and for contactless transportation of the substrate carrier configured for holding a substrate having a substrate surface; and a second track extending in the first direction and configured for contactless transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface. 14 . A method for positioning a substrate carrier relative to a mask carrier, comprising: positioning the substrate carrier in a first position by using a first track configured for contactless transportation of the substrate carrier; positioning the mask carrier in a second position by using a second track configured for contactless transportation of the mask carrier; holding the mask carrier by using an holding arrangement arranged between the first track and the second track; and aligning the substrate carrier relative to the mask carrier. 15 . A method for transporting a substrate carrier and a mask carrier through a processing system, comprising: transporting the substrate carrier on a first track configured for contactless transportation of the substrate carrier configured for holding a substrate having a substrate surface; and transporting the mask carrier on a second track configured for contactless transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface. 16 . The positioning arrangement according to claim 4 , wherein the first track comprises a first guiding structure and a first drive structure which are spaced apart by a first distance. 17 . The positioning arrangement according to claim 4 , wherein the second track comprises a second guiding structure and a second drive structure which are spaced apart by a second distance. 18 . The positioning arrangement according to claim 5 , wherein the second track comprises a second guiding structure and a second drive structure which are spaced apart by a second distance. 19 . The positioning arrangement according to claim 6 , wherein the first guiding structure is a first magnetic guiding structure and the first drive structure is a first magnetic drive structure, and/or wherein the second guiding structure is a second magnetic guiding structure and the second drive structure is a second magnetic drive structure. 20 . The positioning arrangement according to claim 7 , wherein the first guiding structure is a first magnetic guiding structure and the first drive structure is a first magnetic drive structure, and/or wherein the second guiding structure is a second magnetic guiding structure and the second drive structure is a second magnetic drive structure.
the substrate being handled substantially vertically · CPC title
using magnetic elements · CPC title
Mask-wafer alignment · CPC title
Substrate holders · CPC title
Transferring the substrates through a series of coating stations (C23C14/562 takes precedence) · CPC title
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