Lens, camera module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2019361153-A1
Application number	US-201816479403-A
Country	US
Kind code	A1
Filing date	Jan 26, 2018
Priority date	Jan 26, 2017
Publication date	Nov 28, 2019
Grant date	—

Abstract

A lens ( 10 ) and a camera module ( 100 ) and a manufacturing method thereof, wherein the lens ( 10 ) comprises an edge-cut lens sheet ( 114 ), wherein the edge-cut lens sheet ( 14 ) includes at least one chord edge ( 1141 ) and at least one circular edge ( 1142 ), wherein the chord edge ( 1141 ) and the circular edge ( 1142 ) are adjacently connected to each other, and wherein the chord edge ( 1141 ) and the circular edge ( 1142 ) have different curvatures, so that the lens sheet ( 114 ) becomes narrow and the width of the lens ( 10 ) become narrow, to form an ultra-narrow camera module ( 100 ).

First claim

1 - 145 . (canceled)

146 . A camera module, characterized in that it comprises:
a lens, which includes at least one edge-cut lens sheet, wherein the edge-cut lens sheet includes at least one chord edge and at least one circular edge, wherein the chord edge and the circular edge are adjacently connected to each other, and wherein the chord edge and the circular edge have different curvatures; and a photosensitive assembly, wherein the lens is in the photosensitive path of the photosensitive assembly.

147 . The camera module according to claim 146 , wherein the chord edge has a curvature of zero and is a straight line segment.

148 . The camera module according to claim 146 , wherein the circular edge has a curvature greater than 0, and is an arc line segment.

149 . The camera module according to claim 146 , wherein the chord edge is a straight line and the circular edge is a circular arc.

150 . The camera module according to claim 146 , wherein the number of the chord edges and the number of the circular edges are 1 , and the chord edge has a curvature of zero and is a straight line segment.

151 . The camera module according to claim 146 , wherein the number of chord edges is 2, and each of the chord edges has a curvature of 0 and is a straight line segment.

152 . The camera module according to claim 146 , wherein the number of chord edges is 2, the number of circular edges is 2 , and the chord edges are symmetrically distributed.

153 . The camera module according to claim 146 , wherein the lens includes a plurality of lens sheets, at least one of which is the edge-cut lens sheet and at least one of which is a round lens sheet.

154 . The camera module according to claim 153 , wherein the edge-cut lens sheet is larger than the round lens sheet in size.

155 . The camera module according to claim 153 , wherein the lens includes an edge-cut lens barrel, in which the edge-cut lens sheet is mounted, wherein the edge-cut lens barrel includes a chord edge portion and a circular edge portion, and wherein the chord edge portion and the circular edge portion have different curvatures in their section edges.

156 . The camera module according to claim 153 , wherein the edge-cut lens sheet is one-shot molded by means of injection molding.

157 . The camera module according to claim 146 , wherein the photosensitive assembly includes at least one base, at least one photosensitive chip and at least one circuit board, and wherein the base is disposed on the circuit board so as to provide a mounting position, the photosensitive chip is electrically connected to the circuit board, and the lens is located in the photosensitive path of the photosensitive chip.

158 . The camera module according to claim 157 , wherein the base is adhesively fixed to the circuit board.

159 . The camera module according to claim 157 , wherein the circuit board includes a circuit board main body and at least one electronic element, which is disposed on the circuit board main body, and wherein the base is integrally formed on the circuit board main body and encapsulates at least one of the electronic elements.

160 . The camera module according to claim 157 , wherein the circuit board includes a circuit board main body and at least one electronic element, wherein at least one of the electronic elements is disposed at the bottom of the circuit board main body.

161 . The camera module according to claim 157 , wherein the circuit board has a sinking region, in which the photosensitive chip is sunkenly disposed, wherein the sinking region is selected as a groove or a through hole.

162 . The camera module according to claim 147 , wherein the photosensitive assembly includes at least one base, at least one photosensitive chip and at least one circuit board, and wherein the base is disposed on the circuit board so as to provide a mounting position, the photosensitive chip is electrically connected to the circuit board, and the lens is located in the photosensitive path of the photosensitive chip.

163 . The camera module according to claim 148 , wherein the photosensitive assembly includes at least one base, at least one photosensitive chip and at least one circuit board, and wherein the base is disposed on the circuit board so as to provide a mounting position, the photosensitive chip is electrically connected to the circuit board, and the lens is located in the photosensitive path of the photosensitive chip.

164 . The camera module according to claim 149 , wherein the photosensitive assembly includes at least one base, at least one photosensitive chip and at least one circuit board, and wherein the base is disposed on the circuit board so as to provide a mounting position, the photosensitive chip is electrically connected to the circuit board, and the lens is located in the photosensitive path of the photosensitive chip.

165 . The camera module according to claim 150 , wherein the photosensitive assembly includes at least one base, at least one photosensitive chip and at least one circuit board, and wherein the base is disposed on the circuit board so as to provide a mounting position, the photosensitive chip is electrically connected to the circuit board, and the lens is located in the photosensitive path of the photosensitive chip.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Liu Chunmei
• Chen Feifan
• Chen Zhenyu

Classifications

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• G02B3/00 Primary

  Simple or compound lenses · CPC title

• G02B2003/0093

  characterised by the shape · CPC title

• G02B13/004

  having four lenses · CPC title