Camera Substrate Assembly, Camera Module, and Terminal Device

Patent metadata

Field	Value
Publication number	US-2019356822-A1
Application number	US-201716331869-A
Country	US
Kind code	A1
Filing date	Jan 13, 2017
Priority date	Dec 27, 2016
Publication date	Nov 21, 2019
Grant date	—

Abstract

A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.

First claim

1 . A camera substrate assembly, comprising:
a rigid support plate; and a printed circuit board laminated with the rigid support plate, at least two mounting holes configured to accommodate camera chips disposed on the printed circuit board, and the rigid support plate having mounting surfaces facing the at least two mounting holes respectively and configured to support the camera chips, strength of the rigid support plate being greater than strength of the printed circuit board, and flatness of the mounting surfaces being less than a specified threshold.

2 . The camera substrate assembly of claim 1 , further comprising a height difference between mounting surfaces facing different mounting holes.

3 . The camera substrate assembly of claim 2 , wherein at least one groove is disposed on the rigid support plate, and a bottom surface of each groove being one of the mounting surfaces.

4 . The camera substrate assembly of claim 3 , further comprising a groove, the groove coupled to one of the at least two mounting holes, and a mounting surface of the rigid support plate facing another one of the at least two mounting holes being flush with a surface of the rigid support plate facing the printed circuit board.

5 . The camera substrate assembly of claim 2 , wherein at least one boss is disposed on the rigid support plate, and a top surface of each boss being one of the mounting surfaces.

6 . The camera substrate assembly of claim 5 , further comprising a boss inserted into one of the at least two mounting holes when only a boss structure is disposed on the rigid support plate, and a mounting surface of the rigid support plate facing another one of the at least two mounting holes being flush with a surface of the rigid support plate facing the printed circuit board.

7 . The camera substrate assembly of claim 5 , wherein the at least one boss and the rigid support plate are an integrated structure.

8 . The camera substrate assembly of claim 1 , wherein the rigid support plate is a metal support plate.

9 . The camera substrate assembly of claim 8 , wherein the metal support plate is a steel plate.

10 . The camera substrate assembly of claim 1 , further comprising a flexible circuit board signal-connected to the printed circuit board and a connector, and the flexible circuit board being disposed between two plates of the printed circuit board.

11 . The camera substrate assembly of claim 1 , wherein the specified threshold is from five to ten micrometers (μm).

12 . A camera apparatus, comprising:
a camera substrate assembly, comprising:
a rigid support plate; and
a printed circuit board laminated with the rigid support plate, at least two mounting holes configured to accommodate camera chips disposed on the printed circuit board, and the rigid support plate having mounting surfaces facing the at least two mounting holes respectively and configured to support the camera chips, strength of the rigid support plate being greater than strength of the printed circuit board, and flatness of the mounting surfaces being less than a specified threshold;
a camera chip disposed on a mounting surface in each mounting hole, each camera chip being signal-connected to the printed circuit board; a lens mount fixedly coupled to the printed circuit board, a light filter being disposed on the lens mount; a lens coupled to the lens mount, an optical axis of the lens and an axis of the light filter being coaxial; and a drive motor driving the lens to zoom in or zoom out.

13 . The camera apparatus of claim 12 , wherein each camera chip is signal-connected to the printed circuit board using a metallic wire.

14 . A terminal device, comprising a camera apparatus, comprising:
a camera substrate assembly, comprising:
a rigid support plate; and
a printed circuit board laminated with the rigid support plate, at least two mounting holes configured to accommodate camera chips disposed on the printed circuit board, and the rigid support plate having mounting surfaces facing the at least two mounting holes respectively and configured to support the camera chips, strength of the rigid support plate being greater than strength of the printed circuit board, and flatness of the mounting surfaces being less than a specified threshold;
a camera chip disposed on a mounting surface in each mounting hole, each camera chip being signal-connected to the printed circuit board; a lens mount fixedly coupled to the printed circuit board, a light filter being disposed on the lens mount; a lens coupled to the lens mount, an optical axis of the lens and an axis of the light filter being coaxial; and a drive motor driving the lens to zoom in or zoom out.

15 . The camera substrate assembly of claim 8 , wherein the metal support plate is an alloy plate.

Assignees

• Huawei Tech Co Ltd

Inventors

• Wang Guanghai
• Li Cunying
• Luo Zhendong
• Tian Qingshan
• Wang Jianwen
• Li Sheng

Classifications

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H05K3/301

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title

• H04N5/2252

  Electricity · mapped topic