Additively manufacturing structures for increased spray forming resolution or increased fatigue life

US2019354083A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019354083-A1
Application numberUS-201815981775-A
CountryUS
Kind codeA1
Filing dateMay 16, 2018
Priority dateMay 16, 2018
Publication dateNov 21, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Systems, apparatus, and method for forming a structure are disclosed. An apparatus for forming a structure may be configured to receive instructions for printing at least one portion of the structure. The instructions may be based on a data model of the structure. The apparatus for forming a structure may be configured to receive material and print the at least one portion of the structure based on the instructions. The printing may include spray forming the material to produce the at least one portion of the structure.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of forming a structure, comprising: receiving instructions for printing at least one portion of the structure, the instructions based on a data model of the structure; receiving material; and printing the at least one portion of the structure based on the instructions, the printing comprising spray forming the material to produce the at least one portion of the structure. 2 . The method of claim 1 , wherein spray forming the material to produce the at least one portion of the structure further comprises using a pattern. 3 . The method of claim 2 , wherein the pattern comprises an additively manufactured plastic pattern. 4 . The method of claim 3 , wherein the plastic pattern comprises a conductive plastic pattern, the conductivity achieved using at least one of using conductive plastic or painting a conductive layer on the plastic pattern. 5 . The method of claim 4 , further comprising electroplating the conductive plastic pattern. 6 . The method of claim 2 , wherein the pattern is configured to increases the resolution of the spray forming. 7 . The method of claim 1 , wherein: the instructions including an instruction causing a determination of a location for strengthening of a subcomponent of the structure using the at least one portion of the structure; and the printing comprises printing the at least one portion of the structure at the location for strengthening, based on the instructions, the printing comprising spray forming the material to on the subcomponent of the structure to produce the structure. 8 . The method of claim 7 , wherein the material comprises a material having a high bulk fatigue limit relative to a second material of the subcomponent of the structure. 9 . The method of claim 8 , wherein the subcomponent comprises a laser melted part. 10 . The method of claim 7 , wherein the spray used for spray forming increases compressive stresses on the external surface of the structure, where cracks are likely to initiate. 11 . The method of claim 7 , wherein the location for strengthening is a location that is computationally selected. 12 . The method of claim 7 , wherein the location for strengthening is a location that is optically selected. 13 . An apparatus for forming a structure, the structure including a first portion, a second portion, and a structural joint, the apparatus, comprising: a memory; and at least one processor coupled to the memory and configured to: receive instructions for printing at least one portion of the structure, the instructions based on a data model of the structure; receive material; and print the at least one portion of the structure based on the instructions, the printing comprising spray forming the material to produce the structure. 14 . The apparatus of claim 13 , further configured to use a pattern to spray form the material to produce the structure. 15 . The apparatus of claim 14 , wherein the pattern comprises an additively manufactured plastic pattern. 16 . The apparatus of claim 15 , wherein the plastic pattern comprises a conductive plastic pattern, the conductivity achieved using at least one of using conductive plastic or painting a conductive layer on the plastic pattern. 17 . The apparatus of claim 16 , the at least one processor is further configured to electroplate the conductive plastic pattern. 18 . The apparatus of claim 14 , wherein the pattern is configured to increases the resolution of the spray forming. 19 . The apparatus of claim 13 , wherein the at least one processor is configured to: cause a determination of a location for strengthening within the at least one portion of the structure; and print at least one portion of the structure, including printing at the location for strengthening, based on the instructions, the printing comprising spray forming the material to produce the structure. 20 . The apparatus of claim 19 , wherein the material comprises a material having a high bulk fatigue limit relative to a second material of the subcomponent of the structure. 21 . The apparatus of claim 20 , wherein the subcomponent comprises a laser melted part. 22 . The apparatus of claim 19 , wherein the spray forming increases compressive stresses on the external surface of the structure, where cracks are likely to initiate. 23 . The apparatus of claim 19 , wherein the location for strengthening is a location that is computationally selected. 24 . The apparatus of claim 19 , wherein the location for strengthening is a location that is optically selected. 25 . An apparatus for forming a structure, the structure including a first portion, a second portion, and a structural joint, the apparatus comprising: means for receiving instructions for printing at least one portion of the structure, the instructions based on a data model of the structure; means for receiving material; and means for printing the at least one portion of the structure based on the instructions, the printing comprising spray forming the material to produce the structure. 26 . The apparatus of claim 25 , wherein spray forming the material to produce the structure further comprises using a pattern. 27 . The apparatus of claim 25 , wherein: the instructions including an instruction causing a determination of a location for strengthening within the at least one portion of the structure; and the printing comprises printing at least one portion of the structure, including printing at the location for strengthening, based on the instructions, the printing comprising spray forming the material to produce the structure. 28 . A computer-readable medium storing computer executable code, comprising code to: receive instructions for printing a structural joint, the instructions based on a data model of the structural joint; receive a first portion and a second portion; receive material; and print the structural joint based on the instructions, the printing comprising spray forming the material to produce the structural joint, the structural joint connecting the first portion to the second portion.

Assignees

Inventors

Classifications

  • using individual droplets, e.g. from jetting heads · CPC title

  • Data acquisition or data processing for additive manufacturing · CPC title

  • 3-D printing, layer of powder, add drops of binder in layer, new powder · CPC title

  • characterised by the tasks executed · CPC title

  • Surface or curve machining, making three-dimensional [3D] objects, e.g. desktop manufacturing · CPC title

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What does patent US2019354083A1 cover?
Systems, apparatus, and method for forming a structure are disclosed. An apparatus for forming a structure may be configured to receive instructions for printing at least one portion of the structure. The instructions may be based on a data model of the structure. The apparatus for forming a structure may be configured to receive material and print the at least one portion of the structure base…
Who is the assignee on this patent?
Divergent Tech Inc
What technology area does this patent fall under?
Primary CPC classification G05B19/4099. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Nov 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).