Epoxy resin composition

Patent metadata

Field	Value
Publication number	US-2019352448-A1
Application number	US-201816476714-A
Country	US
Kind code	A1
Filing date	Jan 9, 2018
Priority date	Jan 10, 2017
Publication date	Nov 21, 2019
Grant date	—

Abstract

Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

First claim

1 . An epoxy resin composition comprising an epoxy resin and a phenol-based curing agent, the epoxy resin being represented by the formula (1):

wherein X ring is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed, or in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected;
R Xa , R Xb , R Xc , and R Xd are the same or different, and each is a hydrogen atom, a lower alkyl group, a lower alkoxy group, a lower alkenyl group, a halogen atom, or a group represented by the formula (3):

wherein R 1 is the same or different, and is a C 1-18 alkyl group, a C 2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R 2 is a C 1-18 alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R 3 is the same or different, and is a C 1-18 alkyl group, a C 2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
m is an integer of 0 to 6; and
n is an integer of 0 to 3;
provided that at least one of R Xa , R Xb , R Xc , and R Xd is a group represented by the formula (3); and

one or more hydrogen atoms bonded to one or more carbon atoms that constitute the hydrocarbon ring constituting the X ring, and that are not bonded to R Xa , R Xb , R Xc , or R Xd , may be replaced by a lower alkyl group, a lower alkoxy group, a lower alkenyl group, or a halogen atom.

2 . The epoxy resin composition according to claim 1 , wherein the rings having a structure in which 2 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are connected are rings represented by the formula (2):

wherein X 1 ring and X 2 ring are the same or different, and each is a saturated hydrocarbon ring or an unsaturated hydrocarbon ring; and
Y is a bond, a C 1-6 alkylene group that may be substituted with a C 1-4 alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO 2 —.

3 . The epoxy resin composition according to claim 1 , wherein the saturated hydrocarbon ring is a C 4-8 saturated hydrocarbon ring, and the unsaturated hydrocarbon ring is a C 4-8 unsaturated hydrocarbon ring.

4 . The epoxy resin composition according to claim 1 , wherein the composition comprises a phenol-based curing agent and at least one epoxy resin selected from the group consisting of: an epoxy resin represented by the formula (1-iia):

wherein X ii is a divalent group obtained by removing two hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a divalent group represented by the formula (2 g -iia):

wherein Y is a bond, a C 1-6 alkylene group that may be substituted with a C 1-4 alkyl group, an oxygen atom (—O—), a sulfur atom (—S—), —SO—, or —SO 2 —;
R 1 is the same or different, and is a C 1-18 alkyl group, a C 2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R 2 is the same or different, and is a C 1-18 alkylene group, wherein one or more carbon atoms of this group other than a carbon atom directly bonded to a silicon atom may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
R 3 is the same or different, and is a C 1-18 alkyl group, a C 2-9 alkenyl group, a cycloalkyl group, an aryl group, or an aralkyl group, wherein one or more carbon atoms of these groups may be replaced by at least one atom selected from the group consisting of an oxygen atom and a nitrogen atom;
m is an integer of 0 to 6; and
n is an integer of 0 to 3; and

an epoxy resin represented by the formula (1-iiia):

wherein X iii is a trivalent group obtained by removing three hydrogen atoms from a saturated hydrocarbon ring or an unsaturated hydrocarbon ring, or from rings having a structure in which 2 to 6 saturated hydrocarbon rings and/or unsaturated hydrocarbon rings are condensed; or a trivalent group represented by the formula (2 g -iiia):

wherein Y is as defined above; and
R 1 , R 2 , R 3 , m, and n are as defined above.

5 . The epoxy resin composition according to claim 1 , wherein the phenol-based curing agent is at least one resin selected from the group consisting of a novolak-type phenol resin, a resol-type phenol resin, and an aralkyl-type phenol resin.

6 . The epoxy resin composition according to claim 1 , wherein the phenol-based curing agent is at least one resin selected from the group consisting of:
a resin represented by the formula (7):

wherein R 4 is the same or different, and is a hydrogen atom, a lower alkyl group, or a lower alkylol group; and p is an average value of 1 to 30; and
a resin represented by the formula (8):

wherein R 5 is the same or different, and is a hydrogen atom or a lower alkyl group; and q is an average value of 1 to 15.

7 . The epoxy resin composition according to claim 1 , further comprising a curing accelerator.

8 . A varnish comprising the epoxy resin composition according to claim 1 , and an organic solvent.

9 . A cured product of the epoxy resin composition according to claim 1 .

10 . A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the epoxy resin composition according to claim 1 .

11 . A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a coverlay film, an electromagnetic shielding film, a printed circuit board material, or a composite material, each of which uses the varnish according to claim 8 .

12 . A semiconductor sealing material, a liquid sealing material, a potting material, a sealing material, an interlayer insulation film, an adhesive layer, a cov

Assignees

• Sumitomo Seika Chemicals

Inventors

• Harisaki Ryota
• Fukuda Noriaki
• Yamamoto Katsumasa

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C08G59/621 Primary

  Phenols · CPC title

• H05K1/0313

  Organic insulating material · CPC title