Avalanche protection circuit
US-2024322812-A1 · Sep 26, 2024 · US
US2019319615A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019319615-A1 |
| Application number | US-201816119902-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 31, 2018 |
| Priority date | Apr 16, 2018 |
| Publication date | Oct 17, 2019 |
| Grant date | — |
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A system includes a storage capacitor coupled between an input voltage source and a ground terminal, a voltage sensing circuit coupled to the input voltage source and to the storage capacitor, a first transistor coupled to the voltage sensing circuit, a current mirror circuit coupled to the first transistor, a diode coupled between the storage capacitor and the current mirror circuit, and a second transistor configured to couple between a gate of a power switching device and the ground terminal. A gate of the second transistor is coupled to the storage capacitor by way of the voltage sensing circuit.
Opening claim text (preview).
1 . A system, comprising: a storage capacitor coupled between an input voltage source and a ground terminal; a voltage sensing circuit coupled to the input voltage source and to the storage capacitor; a first transistor coupled to the voltage sensing circuit; a current mirror circuit coupled to the first transistor; a diode coupled between the storage capacitor and the current mirror circuit; and a second transistor configured to couple between a gate of a power switching device and the ground terminal, wherein a gate of the second transistor is coupled to the storage capacitor by way of the voltage sensing circuit. 2 . The system of claim 1 wherein the power switching device is an n-type metal-oxide-semiconductor field effect transistor. 3 . The system of claim 1 further comprising a p-type metal-oxide-semiconductor field effect transistor coupled between the storage capacitor and the input voltage source. 4 . The system of claim 1 wherein the voltage sensing circuit comprises an n-type metal-oxide-semiconductor field effect transistor (MOSFET) coupled to the ground terminal and a p-type MOSFET coupled to the n-type MOSFET and the storage capacitor, wherein the input voltage source is coupled to a gate of both the n-type and p-type MOSFETs. 5 . The system of claim 4 wherein the first transistor comprises an n-type MOSFET, and wherein a gate of the first transistor is coupled to a node between the n-type and p-type MOSFETs of the voltage sensing circuit. 6 . The system of claim 4 wherein the second transistor comprises an n-type MOSFET, and wherein the gate of the second transistor is coupled to a node between the n-type and p-type MOSFETs of the voltage sensing circuit. 7 . The system of claim 6 wherein the gate of the second transistor is configured to couple to the storage capacitor in response to an input voltage source voltage being below a threshold. 8 . The system of claim 1 wherein: the current mirror circuit further comprises first and second p-type metal-oxide-semiconductor field effect transistors (MOSFETs); a gate of the first p-type MOSFET is coupled to a gate of the second p-type MOSFET, which is in turn coupled to a drain of the second p-type MOSFET and to the first transistor; sources of both the first and second p-type MOSFETs are coupled to the gate of the power switching device; and a drain of the first p-type MOSFET is coupled to the diode. 9 . The system of claim 1 further comprising an n-type metal-oxide-semiconductor field effect transistor (MOSFET) coupled between the gate of the power switching device and the ground terminal, wherein a gate of the n-type MOSFET is coupled to an inverted power enable input. 10 . A system, comprising: a storage capacitor coupled between an input voltage source and a ground terminal; a voltage sensing circuit coupled to the input voltage source and to the storage capacitor; a first transistor coupled to the voltage sensing circuit and to the storage capacitor; a current mirror circuit coupled to the first transistor; a diode coupled between the storage capacitor and the current mirror circuit; and a second transistor configured to couple between a gate of a power switching device and the input voltage source, wherein a gate of the second transistor is coupled to the storage capacitor. 11 . The system of claim 10 wherein the power switching device is a p-type metal-oxide-semiconductor field effect transistor. 12 . The system of claim 10 wherein: the voltage sensing circuit comprises a p-type metal-oxide-semiconductor field effect transistor (MOSFET); the storage capacitor is coupled to the input voltage source by way of the voltage sensing circuit; and a source of the p-type MOSFET is coupled to the input voltage source and a gate of the p-type MOSFET is coupled to the ground terminal. 13 . The system of claim 10 wherein the first transistor comprises a p-type metal-oxide-semiconductor field effect transistor. 14 . The system of claim 10 wherein the second transistor comprises a p-type metal-oxide-semiconductor field effect transistor. 15 . The system of claim 10 wherein: the current mirror circuit further comprises first and second n-type metal-oxide-semiconductor field effect transistors (MOSFETs); a gate of the first n-type MOSFET is coupled to a gate of the second n-type MOSFET, which is in turn coupled to a drain of the second n-type MOSFET and to the first transistor; sources of both the first and second p-type MOSFETs are coupled to the gate of the power switching device; and a drain of the first p-type MOSFET is coupled to the diode. 16 . The system of claim 10 further comprising a p-type metal-oxide-semiconductor field effect transistor (MOSFET) coupled between the gate of the power switching device and the input voltage source, wherein a gate of the p-type MOSFET is coupled to a power enable input. 17 . A system, comprising: a regenerative current feedback loop; a voltage sensing circuit coupled to the regenerative current feedback loop and configured to activate the regenerative current feedback loop when an input voltage source drops below a threshold; a storage capacitor coupled to the regenerative current feedback loop, wherein in response to being activated, the regenerative current feedback loop is configured to charge the storage capacitor from a gate capacitance of a power switching device; and a gate pull-down device configured to couple a gate of the power switching device to a ground terminal in response to the storage capacitor becoming increasingly charged. 18 . The system of claim 17 wherein the power switching device is an n-type metal-oxide-semiconductor field effect transistor. 19 . The system of claim 17 further comprising a p-type metal-oxide-semiconductor field effect transistor coupled between the storage capacitor and the input voltage source. 20 . The system of claim 17 wherein the voltage sensing circuit comprises an n-type metal-oxide-semiconductor field effect transistor (MOSFET) coupled to the ground terminal and a p-type MOSFET coupled to the n-type MOSFET and the storage capacitor, wherein the input voltage source is coupled to a gate of both the n-type and p-type MOSFETs. 21 . (canceled) 22 . The system of claim 20 wherein the gate pull-down device comprises an n-type MOSFET, and wherein the gate of the gate pull-down device is coupled to a node between the n-type and p-type MOSFETs of the voltage sensing circuit. 23 . The system of claim 17 wherein: the current mirror circuit further comprises first and second p-type metal-oxide-semiconductor field effect transistors (MOSFETs); a gate of the first p-type MOSFET is coupled to a gate of the second p-type MOSFET, which is in turn coupled to a drain of the second p-type MOSFET and to the first transistor; sources of both the first and second p-type MOSFETs are coupled to the gate of the power switching device; and a drain of the first p-type MOSFET is coupled to the storage capacitor.
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