Implantable device for the brain

Patent metadata

Field	Value
Publication number	US-2019314627-A1
Application number	US-201816049686-A
Country	US
Kind code	A1
Filing date	Jul 30, 2018
Priority date	Jul 27, 2007
Publication date	Oct 17, 2019
Grant date	—

Abstract

The present invention consists of an implantable device with at least one package that houses electronics that receives input data or signals, and optionally, power, from an external system through at least one coil attached to the at least one package, processes the input data and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium, or on the dura, or on or in the brain.

First claim

What we claim is:

1 . An implantable device comprising:
a hermetic package enclosing an electronic circuit suitable to implanted within a head; a flexible circuit forming a plurality of separate electrode arrays, each electrode array including a plurality of electrodes, the flexible circuit electrically coupled to the electronic circuit and suitable to interface with neural tissue; and a wireless transceiver electrically coupled to the electronic circuit for sending and receiving data.

2 . The implantable device according to claim 1 , further comprising a plurality of hermetic packages, including electronic circuits, coupled to the flexible circuit.

3 . The implantable device according to claim 1 , wherein at least one of the plurality of electrode arrays includes penetrating electrodes.

4 . The implantable device according to claim 2 , wherein at least one of the plurality of hermetic packages includes a battery.

5 . The implantable device according to claim 1 , wherein the hermetic package includes a flange extending from the hermetic package.

6 . The implantable device according to claim 5 , wherein the flange defines voids configured to accept screws for attaching the hermetic package to a cranium.

7 . The implantable device according to claim 1 , wherein the flexible circuit comprises:
a polymer base layer forming array portions, cable portions, and a bond pad portion, the bond pad portion connected to the electronic circuit; patterned metal traces deposited on the polymer base layer, a polymer top layer deposited on the polymer base layer and the metal traces, the polymer top layer defining voids for the electrodes.

8 . The implantable device according to claim 1 , wherein at least one of the electrode arrays is divided into fingers.

9 . The implantable device according to claim 8 , wherein at least one of the fingers are curved.

10 . The implantable device according to claim 8 , wherein at least one of the fingers are pointed.

Assignees

• Second Sight Medical Products Inc

Inventors

• Greenberg Robert J
• Mech Brian V
• Mcclure Kelly H

Classifications

• A61N1/37518

  Anchoring of the implants, e.g. fixation · CPC title

• A61N1/37514

  Brain implants · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title