Copper plated carbon powders for copper-carbon composite fabrication

US2019292060A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019292060-A1
Application numberUS-201815933567-A
CountryUS
Kind codeA1
Filing dateMar 23, 2018
Priority dateMar 23, 2018
Publication dateSep 26, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A copper-carbon composite forming mixture includes multiple carbon particles each plated with copper. The carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns. Multiple copper particles are combined with the multiple carbon particles plated with copper to form a mixture. The mixture is either pre-heated prior to extrusion or extruded at ambient temperature to form a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures approximately 500 degrees Kelvin.

First claim

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What is claimed is: 1 . A copper-carbon composite forming mixture, comprising: multiple carbon particles plated with copper; and multiple copper particles combined with the multiple carbon particles plated with copper to form a mixture. 2 . The copper-carbon composite forming mixture of claim 1 , wherein a finished member processed by extruding the mixture defines a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures above approximately 350 degrees Kelvin. 3 . The copper-carbon composite forming mixture of claim 2 , wherein the finished member is processed using a shear assisted processing and extrusion (ShAPE) operation extruding the mixture through a spinning die, the spinning die including an end face having a raised spiral frictionally contacting the mixture and forcing the mixture through a die bore to form a copper-carbon composite. 4 . The copper-carbon composite forming mixture of claim 2 , wherein the finished member is processed using a shear assisted processing and extrusion (ShAPE) operation including heating the mixture prior to extruding the mixture through a spinning die, the spinning die including an end face having a raised spiral frictionally contacting the mixture and forcing the mixture through a die bore to form a copper-carbon composite. 5 . The copper-carbon composite forming mixture of claim 2 , wherein the finished member is processed by extruding the mixture using: an extrusion press including a press container having a cavity receiving the mixture; and a die fixed in position to the press container, the die including a die opening having a predetermined geometric shape to produce the finished member with a desired shape. 6 . The copper-carbon composite forming mixture of claim 5 , wherein the mixture is heated prior to extrusion through the die opening to create the finished member. 7 . The copper-carbon composite forming mixture of claim 1 , wherein the carbon particles are plated using an electroless plating process prior to mixing with the copper particles. 8 . The copper-carbon composite forming mixture of claim 1 , wherein: the carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns; and a copper plating layer created on the carbon particles has a thickness ranging between approximately 0.1 microns to 20 microns. 9 . The copper-carbon composite forming mixture of claim 1 , wherein a carbon content of the mixture compared to copper ranges from approximately 5% to approximately 30% by weight. 10 . The copper-carbon composite forming mixture of claim 2 , wherein a carbon content of the mixture is selected to double the conductivity of the finished member compared to a conductivity of copper when the temperature is approximately 500 degrees Kelvin. 11 . A copper-carbon composite forming mixture, comprising: multiple carbon particles each plated with copper, the carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns; and multiple copper particles combined with the multiple carbon particles plated with copper to form a mixture, the mixture when consolidated and extruded forming a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures above approximately 350 degrees Kelvin. 12 . The copper-carbon composite forming mixture of claim 11 , wherein a carbon content of the mixture compared to copper ranges from approximately 5% to approximately 30% by weight. 13 . The copper-carbon composite forming mixture of claim 11 , wherein a carbon content of the mixture compared to copper ranges between approximately 0.5% to approximately 50% by weight. 14 . The copper-carbon composite forming mixture of claim 11 , wherein the mixture is substantially at an ambient temperature prior to extruding the mixture. 15 . The copper-carbon composite forming mixture of claim 11 , wherein the mixture is preheated to at least partially soften the copper of the carbon particles each plated with copper and the copper particles prior to extruding the mixture. 16 . The copper-carbon composite forming mixture of claim 11 , wherein a carbon content of the mixture is selected to substantially double the conductivity of the copper-carbon composite compared to a conductivity of copper when the temperature of the copper-carbon composite is approximately 500 degrees Kelvin. 17 . The copper-carbon composite forming mixture of claim 11 , wherein extrusion to form the copper-carbon composite applies a shear assisted processing and extrusion (ShAPE) operation and includes extruding the mixture through a spinning die. 18 . A method for creating a copper-carbon composite, comprising the steps of: plating multiple carbon particles with copper; creating a mixture containing the plated carbon particles and multiple copper particles; and processing a finished member by extruding the mixture, the finished member defining a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures above approximately 350 degrees Kelvin. 19 . The method for creating a copper-carbon composite of claim 18 , wherein the processing step includes using a shear assisted processing and extrusion (ShAPE) operation including either pre-heating the mixture prior to extruding the mixture through a spinning die or extruding the mixture at ambient temperature through the spinning die. 20 . The method for creating a copper-carbon composite of claim 18 , wherein the processing step includes: fixing a die to a press container of an extrusion press, the die having a die opening having a predetermined geometric shape to produce the finished member; loading the mixture in a cavity of the press container; and pressing the mixture through the die.

Assignees

Inventors

Classifications

  • Hollow particles · CPC title

  • Metallic powder containing non-metallic particles (containing lubricating or binding agents or organic material B22F1/10) · CPC title

  • Processes characterised by the sequence of their steps · CPC title

  • Alloys based on copper · CPC title

  • B22F3/20Primary

    by extruding · CPC title

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What does patent US2019292060A1 cover?
A copper-carbon composite forming mixture includes multiple carbon particles each plated with copper. The carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns. Multiple copper particles are combined with the multiple carbon particles plated with copper to form a mixture. The mixture is either pre-heated prior to extrusion or extruded at…
Who is the assignee on this patent?
Gm Global Tech Operations Llc
What technology area does this patent fall under?
Primary CPC classification B22F3/20. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Sep 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).