Antenna apparatus and antenna module

Patent metadata

Field	Value
Publication number	US-2019273320-A1
Application number	US-201816175099-A
Country	US
Kind code	A1
Filing date	Oct 30, 2018
Priority date	Mar 2, 2018
Publication date	Sep 5, 2019
Grant date	—

Abstract

An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.

First claim

What is claimed is:

1 . An antenna apparatus, comprising:
a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.

2 . The antenna apparatus according to claim 1 , further comprising a grounding via disposed to electrically connect the first conductive ring pattern and the ground layer to each other, and arranged to laterally surround the patch antenna pattern.

3 . The antenna apparatus according to claim 1 , further comprising chain vias disposed to electrically connect the first conductive ring pattern and the second conductive ring pattern to each other, and arranged to laterally surround the patch antenna pattern.

4 . The antenna apparatus according to claim 1 , further comprising a third conductive ring pattern disposed between the first conductive ring pattern and the second conductive ring pattern, and having a third through region laterally surrounding the patch antenna pattern,
wherein an area of the third through region is greater than an area of the first through region, and is smaller than an area of the second through region.

5 . The antenna apparatus according to claim 4 , further comprising:
first chain vias disposed to electrically connect the first conductive ring pattern and the third conductive ring pattern to each other, and arranged to laterally surround the patch antenna pattern; and second chain vias disposed to electrically connect the second conductive ring pattern and the third conductive ring pattern to each other, and arranged to laterally surround the patch antenna pattern, wherein the first chain vias laterally overlap the second chain vias.

6 . The antenna apparatus according to claim 1 , wherein an area of an upper surface of the first conductive ring pattern is greater than an area of an upper surface of the second conductive ring pattern.

7 . The antenna apparatus according to claim 1 , further comprising a coupling patch pattern disposed in a position vertically higher than the position of the patch antenna pattern, and laterally overlapping the patch antenna pattern.

8 . The antenna apparatus according to claim 7 , wherein the coupling patch pattern and the second conductive ring pattern are disposed at a same vertical height, and
the patch antenna pattern and the first conductive ring pattern are disposed at a same vertical height.

9 . The antenna apparatus according to claim 8 , wherein an area of an upper surface of the coupling patch pattern is greater than an area of an upper surface of the patch antenna pattern, and
a shortest distance between the coupling patch pattern and the second conductive ring pattern is longer than a shortest distance between the patch antenna pattern and the first conductive ring pattern.

10 . The antenna apparatus according to claim 1 , wherein an angle of a virtual line connecting a boundary of the first conductive ring pattern and a boundary of the second conductive ring pattern with respect to a vertical direction is greater than or equal to 20 degrees and less than or equal to 30 degrees.

11 . An antenna module, comprising:
feed vias; patch antenna patterns respectively electrically connected to ends of corresponding feed vias among the feed vias; a ground layer disposed in a position vertically lower than a position of the patch antenna patterns, and having through-holes through which the feed vias pass; a first conductive porous plate pattern disposed in a position vertically higher than the position of the ground layer, and having first through regions laterally surrounding the patch antenna patterns; and a second conductive porous plate pattern disposed in a position vertically higher than the position of the first conductive porous plate pattern, and having second through regions laterally surrounding the patch antenna patterns, wherein a total area of the second through regions is greater than a total area of the first through regions.

12 . The antenna module according to claim 11 , further comprising:
coupling patch patterns disposed in a position vertically higher than the position of the corresponding patch antenna patterns among the patch antenna patterns, and laterally overlapping the patch antenna patterns, wherein a total area of the coupling patch patterns is greater than a total area of the patch antenna patterns.

13 . The antenna module according to claim 11 , further comprising:
first feed lines disposed in a position vertically lower than the position of the ground layer, and respectively electrically connected to other ends of corresponding feed vias among the feed vias; first wiring vias disposed in a position vertically lower than the position of the ground layer, and respectively electrically connected to the first feed lines; and an IC disposed in a position vertically lower than the position of the ground layer, and electrically connected to the first wiring vias.

14 . The antenna module according to claim 13 , further comprising:
second wiring vias disposed in a position vertically lower than the position of the ground layer, and respectively electrically connected to the IC; second feed lines disposed in a position vertically lower than the position of the ground layer, and respectively electrically connected to corresponding second wiring vias among the second wiring vias; and end-fire antennas electrically connected to corresponding second feed lines among the second feed lines.

15 . The antenna module according to claim 14 , further comprising:
a second ground layer disposed in a position vertically lower than the positions of the first and second feed lines, and vertically higher than a position of the IC, wherein the second ground layer has through-holes through which the first and second wiring vias pass, and is electrically connected to the ground layer.

16 . The antenna module according to claim 15 , further comprising:
a chain via disposed to electrically connect the first conductive porous plate pattern and the second conductive porous plate pattern to each other; a grounding via disposed to electrically connect the first conductive porous plate pattern and the ground layer to each other; and a shield member disposed in a position vertically lower than a position of the second ground layer, electrically connected to the second ground layer and the ground layer, and disposed to surround the IC.

17 . An antenna apparatus, comprising:
a core; a feed via disposed in the core; a patch antenna pattern disposed on a first surface of the core and electrically connected to the feed via; a ground layer disposed on a second surface of the core opposite the first surface of the core, and defining a through-hole through which the feed via passes; a first conductive ring pattern disposed on the first surface of the core and defining a first open space surrounding the patch antenna pattern in directions parallel to the first surface of th

Assignees

• Samsung Electro Mech

Inventors

• Kim Nam Ki
• Park Ju Hyoung
• Ryoo Jeong Ki
• Lim Dae Ki
• Han Myeong Woo

Classifications

• H10W70/635

  Through-vias · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W44/248

  for antennas · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title