Composition for catalyst-free electroless plating and method for electroless plating using the same

Patent metadata

Field	Value
Publication number	US-2019256981-A1
Application number	US-201816233563-A
Country	US
Kind code	A1
Filing date	Dec 27, 2018
Priority date	Feb 20, 2018
Publication date	Aug 22, 2019
Grant date	—

Abstract

This disclosure relates to a composition for catalyst-free electroless plating and a method for catalyst-free electroless plating using the same. More particularly, this disclosure relates to a composition for catalyst-free electroless plating and a method for catalyst-free electroless plating using the same that does not require a catalyst such as an expensive noble metal catalyst and may simplify the process.

First claim

What is claimed is:

1 . A composition for catalyst-free electroless plating, the composition comprising:
a metal precursor comprising a nickel precursor; a reducing agent; a material to be plated; and a dispersion, wherein a concentration of the metal precursor is 0.0001 to 0.07 M.

2 . The composition of claim 1 , wherein pH of the composition is at least 6.5.

3 . The composition of claim 1 , wherein the material to be plated is one selected from graphene, carbon nanotube, carbon black, carbon fiber, glass fiber, polymer fiber, and porous carbon material.

4 . The composition of claim 1 , wherein the nickel precursor is at least one selected from nickel acetate, nickel sulfate (NiSO 4 ), nickel chloride (NiCl 2 ), nickel carbonate (NiCO 3 ), nickel nitrate (Ni(NO 3 ) 2 ), and a hydrate thereof.

5 . The composition of claim 1 , wherein the metal precursor further comprises at least one selected from an iron precursor, a cobalt precursor, a copper precursor, a molybdenum precursor, a tungsten precursor, and a zinc precursor.

6 . The composition of claim 1 , wherein the nickel of the nickel precursor is included at an atomic ratio of 2% or more with respect to the entire metal of the metal precursor.

7 . The composition of claim 1 , wherein the reducing agent comprises at least one selected from dimethylamine borane (DMAB), hydrazine, sodium hypophosphite, sodium borohydride, and formaldehyde.

8 . The composition of claim 1 , wherein a temperature of the composition is 75° C. or higher.

9 . A method for catalyst-free electroless plating using the composition of claim 1 , the method comprising:
i) preparing a composition for electroless plating comprising a metal precursor comprising a nickel precursor and a reducing agent; and ii) introducing the composition for electroless plating into a dispersion solution containing a material to be plated so that a concentration of the metal precursor is 0.0001-0.07 M.

10 . The method of claim 9 , wherein the step i) further comprises controlling pH of the composition for electroless plating to at least 6.5.

11 . The method of claim 9 , wherein the step i) further comprises heating the composition for electroless plating to 75° C. or higher.

12 . The method of claim 9 , wherein the step ii) is maintained for at least one minute to promote nuclear growth.

13 . The method of claim 9 , wherein the step ii) further comprises controlling the pH of the dispersion solution containing the material to be plated to at least 6.5.

14 . The method of claim 9 , wherein the nickel precursor is at least one selected from nickel acetate, nickel sulfate(NiSO 4 ), nickel chloride(NiCl 2 ), nickel carbonate(NiCO 3 ), nickel nitrate(Ni(NO 3 ) 2 ), and a hydrate thereof.

15 . The method of claim 9 , wherein the metal precursor further comprises at least one selected from an iron precursor, a cobalt precursor, a copper precursor, a molybdenum precursor, a tungsten precursor, and a zinc precursor.

16 . The method of claim 9 , wherein the nickel of the nickel precursor is included at an atomic ratio of 2% or more with respect to the entire metal of the metal precursor.

17 . The method of claim 9 , wherein the reducing agent comprises at least one selected from dimethylamine borane (DMAB), hydrazine, sodium hypophosphite, sodium borohydride, and formaldehyde.

18 . The method of claim 9 , wherein the material to be plated is one selected from graphene, carbon nanotube, carbon black, carbon fiber, glass fiber, polymer fiber, and porous carbon material.

Assignees

• Korea Inst Mach & Materials

Inventors

• Kim Taehoon
• Lee Sang Bok
• Jung Byung Mun
• Lee Kyunbae

Classifications

• C23C18/1245

  Inorganic substrates other than metallic · CPC title

• C23C18/36

  using hypophosphites · CPC title

• C23C18/1233

  Organic substrates · CPC title

• C23C18/34 Primary

  using reducing agents · CPC title

• C23C18/1635

  Composition of the substrate · CPC title