Display device and chip-on-film structure thereof

Patent metadata

Field	Value
Publication number	US-2019244881-A1
Application number	US-201815765188-A
Country	US
Kind code	A1
Filing date	Feb 12, 2018
Priority date	Feb 2, 2018
Publication date	Aug 8, 2019
Grant date	—

Abstract

A display device and a chip-on-film structure thereof are provided. The chip-on-film structure includes a substrate, multiple first output pads, multiple second output pads, multiple first lead wires, and multiple second lead wires. The substrate has a surface including a bonding zone. The first and output pads are located in the bonding zone. The first lead wires and the first output pads are located on the same surface of the substrate. The first lead wires and the second lead wires are located on two opposite surfaces of the substrate. Each of the first lead wires is connected to one of the first output pads. Each of the second lead wires is connected to one of the second output pads. The second lead wires each have a portion corresponding to the bonding zone and having the terminal sections that are respectively opposite to the first and second output pads.

First claim

What is claimed is:

1 . A chip-on-film structure, comprising a substrate, a plurality of first output pads, a plurality of second output pads, a plurality of first lead wires, and a plurality of second lead wires, the substrate having a surface that comprises a bonding zone, the plurality of first output pads and the plurality of second output pads being located in the bonding zone, the plurality of first lead wires and the plurality of first output pads being located on one common surface of the substrate, the plurality of first lead wires and the plurality of second lead wires being respectively located on two opposite surfaces of the substrate, each of the first lead wires being connected to one of the first output pads, each of the second lead wires being connected to the second output pads, the second lead wires each having a portion that corresponds to the bonding zone and has two terminal sections respectively opposite to the first output pads and the second output pads.

2 . The chip-on-film structure according to claim 1 , wherein the plurality of first output pads and the plurality of second output pads are arranged to stagger with respect to each other.

3 . The chip-on-film structure according to claim 2 , wherein the plurality of first output pads and the plurality of second output pads are respectively arranged in a straight line extending in a first direction, and the plurality of first output pads and the plurality of second output pads are spaced from each other in a second direction, wherein the first direction and the second direction are perpendicular.

4 . The chip-on-film structure according to claim 1 , wherein the second lead wires have orthogonal projections on the substrate that cover orthogonal projections of the first lead wires on the substrate.

5 . The chip-on-film structure according to claim 1 , wherein the substrate is formed with vias that respectively correspond, in a one to one manner, to the plurality of second output pads, and the second lead wires are connected, through the vias, to the second output pads.

6 . The chip-on-film structure according to claim 5 , wherein the bonding zone is located between the vias and the first lead wires.

7 . The chip-on-film structure according to claim 1 further comprising a driver chip, wherein the driver chip is located on the same surface of the substrate as the plurality of first lead wires, and the first lead wires and the second lead wires are individually connected to the driver chip.

8 . A display device, comprising a display panel and a chip-on-film structure, wherein the chip-on-film structure comprises a substrate, a plurality of first output pads, a plurality of second output pads, a plurality of first lead wires, and a plurality of second lead wires, the substrate having a surface that comprises a bonding zone, the plurality of first output pads and the plurality of second output pads being located in the bonding zone, the plurality of first lead wires and the plurality of first output pads being located on one common surface of the substrate, the plurality of first lead wires and the plurality of second lead wires being respectively located on two opposite surfaces of the substrate, each of the first lead wires being connected to one of the first output pads, each of the second lead wires being connected to the second output pads, the second lead wires each having a portion that corresponds to the bonding zone and has two terminal sections respectively opposite to the first output pads and the second output pads; and the display panel comprises a plurality of first input pads that are respectively corresponding, in a one to one manner, to the plurality of first output pads and a plurality of second input pads that are respectively corresponding, in a one to one manner, to the plurality of second output pads, the plurality of first input pads being electrically connected to the plurality of first output pads, the plurality of second input pads being electrically connected to the plurality of second output pads.

9 . The display device according to claim 8 , wherein the plurality of first output pads and the plurality of second output pads are arranged to stagger with respect to each other.

10 . The display device according to claim 9 , wherein the plurality of first output pads and the plurality of second output pads are respectively arranged in a straight line extending in a first direction, and the plurality of first output pads and the plurality of second output pads are spaced from each other in a second direction, wherein the first direction and the second direction are perpendicular.

11 . The display device according to claim 8 , wherein the second lead wires have orthogonal projections on the substrate that cover orthogonal projections of the first lead wires on the substrate.

12 . The display device according to claim 8 , wherein the substrate is formed with vias that respectively correspond, in a one to one manner, to the plurality of second output pads, and the second lead wires are connected, through the vias, to the second output pads.

13 . The display device according to claim 12 , wherein the bonding zone is located between the vias and the first lead wires.

14 . The display device according to claim 8 further comprising a driver chip, wherein the driver chip is located on the same surface of the substrate as the plurality of first lead wires, and the first lead wires and the second lead wires are individually connected to the driver chip.

15 . The display device according to claim 8 further comprising a conductive layer arranged between the first input pads and the first output pads and between the second input pads and the second output pads.

16 . The display device according to claim 8 , wherein the plurality of first input pads and the plurality of second input pads are located in an edge portion of the display panel.

Assignees

• Wuhan China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Luo Jing

Classifications

• H10W70/695

  Organic materials · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/10128

  Display · CPC title