Thin metal film assembly and manufacturing method of the same

Patent metadata

Field	Value
Publication number	US-2019226081-A1
Application number	US-201916251743-A
Country	US
Kind code	A1
Filing date	Jan 18, 2019
Priority date	Jan 19, 2018
Publication date	Jul 25, 2019
Grant date	—

Abstract

A method for manufacturing a thin metal layer assembly includes forming a thin metal layer including nanopatterns on a preliminary substrate. The method includes forming a metal reducing layer by chemically reducing the thin metal layer. The method includes separating the metal reducing layer from the preliminary substrate. The method includes bonding the metal reducing layer to a target substrate.

First claim

What is claimed is:

1 . A method for manufacturing a thin metal layer assembly, comprising:
forming a thin metal layer including nanopatterns on a preliminary substrate; forming a metal reducing layer by chemically reducing the thin metal layer; separating the metal reducing layer from the preliminary substrate; and bonding the metal reducing layer to a target substrate.

2 . The method for manufacturing the thin metal layer assembly of claim 1 , wherein, in the forming of the thin metal layer, at least a part of the thin metal layer is oxidized.

3 . The method for manufacturing the thin metal layer assembly of claim 1 , wherein the thin metal layer is reduced by a vaporized reducing agent.

4 . The method for manufacturing the thin metal layer assembly of claim 3 , wherein the vaporized reducing agent includes at least one of an aldehyde including hydrazine, hydroxylamine, and formaldehyde, tetrahydroborate including hypophosphites, sulfites, and lithium (Li), tetrahydroborate including sodium (Na), tetrahydroborate including potassium (K), polyhydroxybenzenes including LiAlH 4 , hydroquinone, alkyl-substituted hydroquinones, pyrogallol, phenylenediamines, aminophenols, ascorbic acid, ascorbic acid ketals, an ascorbic acid-based material, 3-pyrazolidone, hydroxytetronic acid, hydroxytetronamide, bisnaphthols, sulfonamidophenols, lithium (Li), sodium (Na), or potassium (K).

5 . The method for manufacturing the thin metal layer assembly of claim 1 , wherein the thin metal layer includes at least one of lead (Tab), indium (In), tin (Sn), aluminum (Al), silver (Ag), copper (Cu), gold (Au), platinum (Pt), titanium (Ti), iron (Fe), nickel (Ni), cobalt (Co), or a mixture thereof.

6 . The method for manufacturing the thin metal layer assembly of claim 1 , wherein the separating the metal reducing layer and the preliminary substrate includes soaking the preliminary substrate and the metal reducing layer in water.

7 . The method for manufacturing the thin metal layer assembly of claim 1 , further comprising moving the separated metal reducing layer to a carrier substrate.

8 . The method for manufacturing the thin metal layer assembly of claim 7 , wherein a surface of the carrier substrate has hydrophobicity.

9 . The method for manufacturing the thin metal layer assembly of claim 7 , wherein the carrier substrate comprises at least one of polytetrafluoroethylene, polydimethyisiloxane, polyimide, an acryl polymer, a polyethylene terephthalate, poly(methyl methacrylate), or poly(urethane acrylate).

10 . The method for manufacturing the thin metal layer assembly of claim 1 , wherein the bonding of the metal reducing layer to the target substrate comprises pressing the metal reducing layer and the target substrate.

11 . A thin metal layer assembly comprising:
a metal reducing layer including nanopatterns; and a target substrate in direct contact with the metal reducing layer, wherein a side of the target substrate in direct contact with the metal reducing layer is smooth.

12 . The thin metal layer assembly of claim 11 , wherein an adhesive layer is not provided between the metal reducing layer arid the target substrate.

13 . The thin metal layer assembly of claim 11 , wherein at least one of an upper surface and a bottom surface of the metal reducing layer comprises a metal-oxidized film.

14 . The thin metal layer assembly of claim 13 , wherein the metal reducing layer comprises a metal in a reduced form.

15 . The thin metal layer assembly of claim 11 , wherein the metal reducing layer comprises at least one of lead (Pb), indium (In), tin (Sn), aluminum (Al), silver (Ag), copper (Cu), gold (Au), platinum (Pt), titanium (Ti), iron (Fe), nickel (Ni), cobalt (Co), or, a mixture thereof.

16 . The thin metal layer assembly of claim 11 , wherein the target substrate is flexible.

17 . The thin metal layer assembly of claim 11 , wherein the target substrate comprises an organic material or an inorganic material.

18 . The thin metal layer assembly of claim 11 , wherein the nanopatterns each have a length of about 1 μm or less.

19 . The thin metal layer assembly of claim 11 , wherein a surface of the metal reducing layer has hydrophilicity.

20 . The thin metal layer assembly of claim 11 , wherein a surface of the target substrate has hydrophilicity.

Assignees

• Samsung Display Co Ltd
• Korea Advanced Inst Sci & Tech

Inventors

• Ahn Jae Ho
• Shin Jae Min
• Kim Min Woo
• Park Won Sang
• Kim Sang Woo
• Lee Jung Yong

Classifications

• B82Y30/00

  Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title

• B05D7/24

  for applying particular liquids or other fluent materials · CPC title

• C23C16/56

  After-treatment · CPC title

• C23C16/06 Primary

  characterised by the deposition of metallic material · CPC title

• B82B1/005

  Constitution or structural means for improving the physical properties of a device · CPC title