Phenol novolak resin, curable resin composition, and cured product thereof

Patent metadata

Field	Value
Publication number	US-2019225758-A1
Application number	US-201716312588-A
Country	US
Kind code	A1
Filing date	Jun 15, 2017
Priority date	Jun 29, 2016
Publication date	Jul 25, 2019
Grant date	—

Abstract

A phenol novolak resin having an excellent balance between the mold shrinkage of a composition containing the phenol novolak resin during heat curing and the modulus of elasticity at high temperature. A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween, wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13C-NMR measurement is within the range of 0.05 to 0.30, and the area ratio of alkyl phenol (I) based on GPC measurement is within the range of 0.01% to 3.0%, a curable resin composition using the same, and a cured product thereof.

First claim

1 .- 15 . (canceled)

16 . A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween and denoted by general formula (1) described below,

[in formula (1), each of R 1 , R 2 , and R 3 represents a hydrogen atom or an alkyl group having a carbon number of 4 to 8, at least one is an alkyl group having a carbon number of 4 to 8, and n represents an integer of 0 to 5]
wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13 C-NMR measurement is within the range of 0.05 to 0.30, and
the area ratio of alkyl phenol (I) (body with n=0) based on GPC measurement is within the range of 0.01% to 3.0%.

17 . The phenol novolak resin according to claim 16 , wherein one or two of R 1 , R 2 , and R 3 in general formula (1) are t-butyl groups and the remainder is a hydrogen atom.

18 . The phenol novolak resin according to claim 16 , wherein the ICI viscosity of the phenol novolak resin at 150° C. is 0.01 to 3.0 dPa·s.

19 . The phenol novolak resin according to claim 16 , wherein the area ratio of the body with n=0 based on GPC measurement of the phenol novolak resin is within the range of 0.4% to 3.0%.

20 . The phenol novolak resin according to claim 16 , wherein n in general formula (1) is within the range of 0.01 to 2.

21 . A curable resin composition comprising, as indispensable components, the phenol novolak resin according to claim 16 and a resin having a functional group that reacts with a hydroxy group.

22 . The curable resin composition according to claim 21 , wherein the resin having a functional group that reacts with a hydroxy group is an epoxy resin.

23 . The curable resin composition according to claim 22 , further comprising an epoxy resin curing agent other than the phenol novolak resin.

24 . A cured product of the curable resin composition according to claim 21 .

25 . A semiconductor sealing material comprising the curable resin composition according to claim 21 and an inorganic filler.

26 . A semiconductor device that is a cured product of the semiconductor sealing material according to claim 25 .

27 . A prepreg that is a semi-cured product of an impregnation base material including the curable resin composition according to claim 21 and a reinforcing base material.

28 . A circuit board comprising a tabularly shaped product of the curable resin composition according to claim 21 and copper foil.

29 . A build-up film comprising a cured product of the curable resin composition according to claim 21 and a base material film.

30 . A fiber-reinforced composite material comprising the curable resin composition according to claim 21 and reinforcing fiber.

31 . A fiber-reinforced molded article that is a cured product of the fiber-reinforced composite material according to claim 30 .

32 . The phenol novolak resin according to claim 17 , wherein the ICI viscosity of the phenol novolak resin at 150° C. is 0.01 to 3.0 dPa·s.

33 . The phenol novolak resin according to claim 17 , wherein the area ratio of the body with n=0 based on GPC measurement of the phenol novolak resin is within the range of 0.4% to 3.0%.

34 . The phenol novolak resin according to claim 17 , wherein n in general formula (1) is within the range of 0.01 to 2.

35 . A curable resin composition comprising, as indispensable components, the phenol novolak resin according to claim 17 and a resin having a functional group that reacts with a hydroxy group.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Hirota Yousuke
• Tanii Shota

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W70/695

  Organic materials · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title