Fingerprint sensor package and display apparatus including the same

Patent metadata

Field	Value
Publication number	US-2019213373-A1
Application number	US-201816027620-A
Country	US
Kind code	A1
Filing date	Jul 5, 2018
Priority date	Jan 11, 2018
Publication date	Jul 11, 2019
Grant date	—

Abstract

Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

First claim

What is claimed is:

1 . A fingerprint sensor package, comprising:
a flexible film having a top surface and a bottom surface opposite to the top surface; a fingerprint sensor; and a display driver integrated circuit on the flexible film, wherein the fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

2 . The package of claim 1 , further comprising:
a stiffener that overlaps the fingerprint sensor, wherein the stiffener is provided on the bottom surface of the flexible film.

3 . The package of claim 1 , further comprising:
an active device and a passive device that are provided on the top surface of the flexible film, wherein the active device comprises a semiconductor memory device, and wherein the passive device comprises one or more of a capacitor, a resistor, and an inductor.

4 . The package of claim 1 , further comprising a cap overlying the fingerprint sensor, the cap having an opening to pass light to the fingerprint sensor.

5 . The package of claim 1 , further comprising a cap overlying the fingerprint sensor, the cap having a plurality of pin holes to pass light to the fingerprint sensor.

6 . The package of claim 1 , further comprising:
a cap overlying the fingerprint sensor; and an infrared cut filter on the cap and overlapping the fingerprint sensor.

7 . The package of claim 1 , wherein the fingerprint sensor is wire-bonded to the flexible film.

8 . The package of claim 1 ,
wherein a first end of the flexible film is electrically connected to an electronic device, and wherein a second end of the flexible film, opposite to the first end, is electrically connected to other electronic device.

9 . A display apparatus, comprising:
a display panel; and a fingerprint sensor package below the display panel, wherein the fingerprint sensor package comprises:
a flexible film;
a fingerprint sensor;
a display driver integrated circuit configured to drive the display panel; and
active and passive devices,
wherein the flexible film comprises a top surface facing the display panel and a bottom surface opposite to the top surface, and wherein the fingerprint sensor, the display driver integrated circuit, and the active and passive devices are provided on the top surface of the flexible film.

10 . The apparatus of claim 9 , wherein the fingerprint sensor package further comprises:
a stiffener on the bottom surface of the flexible film, wherein the stiffener overlaps the fingerprint sensor provided on the top surface of the flexible film.

11 . The apparatus of claim 9 , further comprising:
a cap overlying the fingerprint sensor, wherein the cap comprises an opening that is opened between the fingerprint sensor and the display panel.

12 . The apparatus of claim 9 , further comprising:
a cap overlying the fingerprint sensor, wherein the cap comprises a plurality of pin holes that are opened between the fingerprint sensor and the display panel.

13 . The apparatus of claim 9 , further comprising:
a cap overlying the fingerprint sensor, wherein the fingerprint sensor package further comprises an infrared cut filter between the cap and the display panel.

14 . The apparatus of claim 9 , wherein the display panel comprises an organic light emitting diode (OLED) type display panel in which a plurality of light emitting layers are arrayed.

15 . The apparatus of claim 9 , wherein the display panel comprises a bottom surface facing the fingerprint sensor package and a top surface opposite to the bottom surface of the display panel,
wherein when a fingerprint recognition target is provided on the top surface of the display panel, a light is reflected on the fingerprint recognition target and travels toward the fingerprint sensor.

16 . A display apparatus, comprising:
an organic light emitting diode (OLED) display panel; and a fingerprint sensor package below the OLED display panel, wherein the fingerprint sensor package comprises:
a flexible film electrically connected to the OLED display panel, the flexible film having a top surface facing the OLED display panel and a bottom surface opposite to the top surface;
a fingerprint sensor on the top surface of the flexible film;
a display driver integrated circuit on the top surface of the flexible film and configured to drive the OLED display panel;
a semiconductor memory device on the top surface of the flexible film; and
a passive device on the top surface of the flexible film.

17 . The apparatus of claim 16 , wherein the fingerprint sensor package further comprises a cap on the top surface of the flexible film and surrounding the fingerprint sensor.

18 . The apparatus of claim 17 , wherein the cap comprises an opening that is opened between the OLED display panel and the fingerprint sensor, the opening being configured to allow passage of light traveling toward the fingerprint sensor, the light being emitted from the OLED display panel.

19 . The apparatus of claim 17 , wherein the cap comprises a plurality of pin holes that are opened between the OLED display panel and the fingerprint sensor, the pin holes being configured to allow passage of light traveling toward the fingerprint sensor, the light being emitted from the OLED display panel.

20 . The apparatus of claim 16 , wherein the fingerprint sensor package further comprises at least one of:
an infrared cut filter between the OLED display panel and the fingerprint sensor; and a stiffener on the bottom surface of the flexible film and overlapping the fingerprint sensor provided on the top surface of the flexible film.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Woonbae
• Song Jikho
• Jo Sungeun
• Park Ji-Yong
• Ha Jeong-Kyu

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G09G3/3208

  organic, e.g. using organic light-emitting diodes [OLED] · CPC title

• G09G2380/02

  Flexible displays · CPC title

• G06K9/0002 Primary

  Physics · mapped topic