Temperature-control device with spring element

Patent metadata

Field	Value
Publication number	US-2019203836-A1
Application number	US-201716311958-A
Country	US
Kind code	A1
Filing date	Jun 29, 2017
Priority date	Jun 29, 2016
Publication date	Jul 4, 2019
Grant date	—

Abstract

A temperature-control device for cooling or heating a heat exchanger fluid is disclosed. The device may have a base plate and a heat exchanger element. The base plate may have at least one throughflow opening as an inlet or outlet for the heat exchanger fluid. Furthermore, the temperature-control device may have a spring element which has a spring plate and a retaining region for the spring plate, which retaining region is connected to the spring plate and surrounds the latter at least in some regions. A spring plate seat for abutment for the spring plate may be included, and optionally a receiving region for receiving the spring element in and/or adjacent to the base plate. The spring plate, in a projection of the spring plate perpendicular to the areal extent thereof, is arranged within the throughflow opening.

First claim

1 - 24 . (canceled)

25 . A temperature-control device for cooling or heating a heat exchanger fluid, comprising:
a base plate and a heat exchanger element, wherein the base plate has at least one throughflow opening as an inlet or outlet for the heat exchanger fluid, a spring element which has a spring plate and a retaining region for the spring plate, which retaining region is connected to the spring plate and surrounds the latter at least in some regions; a spring plate seat for abutment for the spring plate, and optionally a receiving region for receiving the spring element in and/or adjacent to the base plate, wherein the spring plate, in a projection of the spring plate perpendicular to the areal extent thereof, is arranged within the throughflow opening.

26 . The temperature-control device according to claim 25 , wherein the temperature-control device has at least one connecting piece, the opening cross-section of which is arranged so as to overlap with the opening cross-section of the throughflow opening, wherein the connecting piece, at one end, is connected to the base plate or engages through the base plate.

27 . The temperature-control device according to claim 26 , wherein the spring element in some sections adjoins the base plate and at least in some sections is arranged within the region delimited by the connecting piece, and/or a connecting region of the spring element is connected in a materially bonded, form-fitting and/or force-fitting manner to at least the base plate, optionally to the connecting piece, to a further layer and/or to a counterpart component.

28 . The temperature-control device according to claim 25 , wherein the spring plate seat for abutment for the spring plate is configured as part of the spring element, of the base plate, of an additional layer, of a further functional element, of a connecting piece and/or of a counterpart component.

29 . The temperature-control device according to claim 28 , wherein a through-opening arranged in the throughflow opening, wherein the spring plate seat is arranged so as to run around the through-opening.

30 . The temperature-control device according to claim 25 , wherein the spring plate seat has an elevation element on which the spring plate rests in some regions or around its outer circumferential edge in the state in which no pressure is applied.

31 . The temperature-control device according to claim 30 , wherein the elevation element on the surface of the spring plate runs around the through-opening.

32 . The temperature-control device according to claim 25 , wherein a first functional layer, comprising a sealing layer, which is arranged adjacent to the surface of the base plate and has a through-opening which is arranged so as to overlap with the throughflow opening.

33 . The temperature-control device according to claim 26 , wherein the spring plate and the retaining region and optionally the connecting region are formed integrally as part of a spring layer or of a further layer arranged adjacent to the base plate.

34 . The temperature-control device according to claim 27 , wherein the connecting region and/or the retaining region is arranged and/or fastened between the base plate and the optionally provided first functional layer, a further layer, the connecting piece and/or a counterpart component.

35 . The temperature-control device according to claim 27 , wherein the connecting region and/or the retaining region, at least in some regions, is configured to run around and adjacent to the throughflow opening.

36 . The temperature-control device according to claim 35 , wherein the abutment region is configured as a first recess in the base plate, in an additional layer or in a counterpart component, which recess runs around the circumferential edge of the throughflow opening at least in some sections and is set back in a step-like manner from the surface of the base plate, of the additional layer or of the counterpart component around the circumferential edge of the throughflow opening.

37 . The temperature-control device according to claim 36 , wherein the spring plate is pre-shaped with respect to the connecting region and/or the retaining region such that it rests on the elevation element in the state in which no pressure is applied.

38 . The temperature-control device according to claim 37 , wherein the spring plate, in the state in which no pressure is applied, is offset, preferably is offset by at least 0.4 mm, relative to the plane in which the connecting region and/or the retaining region extends.

39 . The temperature-control device according to claim 27 , wherein the spring plate is integrally connected to the connecting region and/or the retaining region via one retaining arm, two retaining arms, three retaining arms, four retaining arms or more than four retaining arms, wherein the at least one retaining arm may be branched.

40 . The temperature-control device according to claim 39 , wherein the retaining arms are configured as spiral-shaped retaining arms which extend between the inner circumferential edge of the connecting region or of the retaining region and the outer circumferential edge of the spring plate, optionally also around one of the circumferential edges.

41 . The temperature-control device according to claim 36 , wherein the spring element, one of the layers, the base plate or a counterpart component has at least one travel-limiting element for limiting the travel of the spring plate in one or both directions perpendicular to the areal extent of the spring plate.

42 . The temperature-control device according to claim 41 , wherein the travel-limiting element is formed integrally with the spring element.

42 . The temperature-control device according to claim 42 , wherein the travel-limiting element is formed by at least one simply formed web, arm or region of the spring element, and the parallel projection of which in the direction of the lifting direction of the spring plate is arranged so as to overlap with the spring plate.

Assignees

• Reinz Dichtungs Gmbh

Inventors

• Buntz Werner
• Pendzialek Matthias

Classifications

• F16N2280/00

  Valves · CPC title

• F01P11/10

  Guiding or ducting cooling-air, to, or from, liquid-to-air heat exchangers · CPC title

• F16J15/0825

  laminated · CPC title

• F16J15/064 Primary

  the packing combining the sealing function with other functions · CPC title

• F16K15/144

  the closure elements being fixed along all or a part of their periphery · CPC title