Gap-filling sealing layer of thermal barrier coating

Patent metadata

Field	Value
Publication number	US-2019194812-A1
Application number	US-201715849883-A
Country	US
Kind code	A1
Filing date	Dec 21, 2017
Priority date	Dec 21, 2017
Publication date	Jun 27, 2019
Grant date	—

Abstract

A multi-layer thermal barrier coating is provided that includes an insulating layer having an outer surface defining a plurality of crevices therein and a sealing layer bonded to the outer surface of the insulating layer. The sealing layer is substantially non-permeable and is configured to seal against the insulating layer. The sealing layer fills in at least a portion of the crevices. A method of forming a thermal barrier coating is also provided, which includes a step of providing a plurality of hollow round microstructures bonded together, each having a diameter in the range of 10 to 100 microns to create an insulating layer. The method further includes depositing a plurality of metal particles onto the insulating layer and heating the plurality of metal particles to form a substantially non-permeable sealing layer over the insulating layer.

First claim

What is claimed is:

1 . A multi-layer thermal barrier coating comprising:
an insulating layer comprising a plurality of hollow round microstructures bonded together and defining an outer layer of microstructures disposed along an outer edge of the insulating layer, the outer layer of microstructures defining a plurality of crevices between adjacent microstructures along the outer edge; and a sealing layer bonded to the outer layer of microstructures, the sealing layer being substantially non-permeable and configured to seal against the outer layer of microstructures, the sealing layer filling in at least a portion of the crevices.

2 . The multi-layer thermal barrier coating of claim 1 , wherein the sealing layer is formed of a plurality of metal particles.

3 . The multi-layer thermal barrier coating of claim 2 , wherein the sealing layer has a sealing layer melting point and the insulating layer has an insulating layer melting point, the sealing layer melting point being lower than the insulating layer melting point.

4 . The multi-layer thermal barrier coating of claim 2 , wherein each microstructure of the plurality of hollow round microstructures consists essentially of nickel, and the sealing layer is comprised of an alloy formed of nickel and copper.

5 . The multi-layer thermal barrier coating of claim 4 , wherein each metal particle of the plurality of metal particles is smaller than each microstructure of at least a substantial majority of the plurality of hollow round microstructures.

6 . The multi-layer thermal barrier coating of claim 5 , wherein the sealing layer extends outward from the insulating layer by no more than 5 microns, wherein the insulating layer has a thickness between 75 and 300 microns, and wherein each microstructure of the plurality of hollow round microstructures has a width not greater than 100 microns.

7 . The multi-layer thermal barrier coating of claim 1 , further comprising a bonding layer configured to be bonded to a metal substrate, the insulating layer being bonded to the bonding layer.

8 . The multi-layer thermal barrier coating of claim 7 , wherein the bonding layer comprises at least one of a copper-based material, an aluminum based material, a zinc-based material, and an alloy comprising copper and zinc, and wherein each microstructure of the plurality of hollow round microstructures comprises at least one of a nickel-based material and an iron-based material.

9 . The multi-layer thermal barrier coating of claim 1 , wherein the insulating layer has a porosity of at least 90%.

10 . A component comprising a metal substrate presenting a surface, the multi-layer thermal barrier coating of claim 1 being bonded to the surface.

11 . An internal combustion engine comprising a component configured to be subjected to combustion gasses, the component having the multi-layer thermal barrier coating of claim 1 bonded thereto.

12 . A multi-layer thermal barrier coating comprising:
a bonding layer configured to be bonded to a metal substrate; an insulating layer bonded to the bonding layer, the insulating layer having an outer surface defining a plurality of crevices therein; and a sealing layer bonded to the outer surface of the insulating layer, the sealing layer being substantially non-permeable and configured to seal against the insulating layer, the sealing layer filling in at least a portion of the crevices.

13 . The multi-layer thermal barrier coating of claim 1 , wherein the sealing layer is formed of a plurality of metal particles, the sealing layer having a sealing layer melting point and the insulating layer having an insulating layer melting point, the sealing layer melting point being lower than the insulating layer melting point.

14 . A method of forming a thermal barrier coating, the method comprising:
providing a plurality of hollow round microstructures bonded together, each having a diameter in the range of 10 to 100 microns to create an insulating layer; depositing a plurality of metal particles onto the insulating layer; and heating the plurality of metal particles to form a substantially non-permeable sealing layer over the insulating layer.

15 . The method of claim 14 , further comprising:
providing the plurality of hollow round microstructures to define an outer layer of microstructures disposed along an outer edge of the insulating layer, the outer layer of microstructures defining a plurality of crevices between adjacent microstructures along the outer layer; and disposing at least a portion of the plurality of metal particles within the crevices.

16 . The method of claim 15 , further comprising:
providing the plurality of metal particles having a sealing layer melting point; and providing the plurality of round hollow microstructures having an insulating layer melting point, the sealing layer melting point being lower than the insulating layer melting point.

17 . The method of claim 15 , further comprising:
forming each microstructure of substantially pure nickel; and forming each metal particle of a nickel-copper alloy.

18 . The method of claim 17 , further comprising providing each metal particle of the plurality of metal particles as being smaller than each microstructure of at least a substantial majority of the plurality of hollow round microstructures.

19 . The method of claim 18 , further comprising:
providing the insulating layer having a porosity of at least 90%; providing a bonding layer configured to be bonded to a metal substrate; and bonding the insulating layer to the bonding layer.

20 . The method of claim 16 , further comprising performing the step of heating by one of laser scanning, laser welding, radiation, and inductive heating.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Walker Michael J
• Najt Paul M
• Durrett Russell P
• Andruskiewicz Iv Peter P

Classifications

• C22C9/04

  with zinc as the next major constituent · CPC title

• B32B5/30

  one layer {being formed of particles, e.g. chips,} granules, powder · CPC title

• C01P2004/34

  hollow · CPC title

• B32B2305/026

  Porous · CPC title

• B32B3/10

  characterised by a discontinuous layer, i.e. formed of separate pieces of material · CPC title