Chemical mechanical polishing method
US-2015375361-A1 · Dec 31, 2015 · US
US2019152017A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019152017-A1 |
| Application number | US-201916252513-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 18, 2019 |
| Priority date | Feb 26, 2016 |
| Publication date | May 23, 2019 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
Opening claim text (preview).
What is claimed is: 1 . A polishing pad, comprising: a polishing layer stack having a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface, the polishing layer stack including a polishing layer having the polishing surface; a fluid-impermeable layer spanning the aperture and spanning the polishing pad; a first adhesive layer of a first adhesive material in contact with and securing the bottom surface of the polishing layer stack to the fluid-impermeable layer, the first adhesive layer spanning the aperture and the polishing pad; a light-transmitting body positioned in the aperture, the light-transmitting body having a lower surface in contact with and secured to the first adhesive layer and spaced apart from a side-wall of the aperture by a gap; and an adhesive sealant of a different second material disposed in and laterally filling the gap. 2 . The polishing pad of claim 1 , wherein the light-transmitting body is softer than the polishing layer. 3 . The polishing pad of claim 2 , wherein the polishing layer has a hardness of about 58-65 Shore D and the light-transmitting body has a hardness of about 45-60 Shore D 4 . The polishing pad of claim 1 , wherein the adhesive sealant has about the same hardness as the light-transmitting body. 5 . The polishing pad of claim 4 , wherein the light-transmitting body and the adhesive sealant have a hardness of about 45-60 Shore D. 6 . The polishing pad of claim 1 , wherein the gap completely laterally surrounds the light-transmitting body. 7 . The polishing pad of claim 1 , wherein the adhesive sealant extends to contact the first adhesive layer without extending below the light-transmitting body. 8 . The polishing pad of claim 7 , wherein the adhesive sealant completely vertically fills the gap. 9 . The polishing pad of claim 1 , wherein an air gap separates the adhesive sealant from the first adhesive layer. 10 . The polishing pad of claim 1 , comprising a second adhesive layer positioned on a side of the fluid-impermeable layer opposite the first adhesive layer and in contact with the fluid-impermeable layer. 11 . The polishing pad of claim 10 , comprising an aperture through the second adhesive layer aligned with the light-transmitting body. 12 . The polishing pad of claim 10 , further comprising a removable liner covering the second adhesive layer. 13 . The polishing pad of claim 1 , wherein the first adhesive material comprises a pressure sensitive adhesive and the second adhesive material comprises a cured epoxy or polyurethane. 14 . The polishing pad of claim 1 , wherein the polishing layer stack comprises the polishing layer and a backing layer, and wherein the polishing layer is a napped polyurethane and the backing layer is a different material than the polishing layer. 15 . The polishing pad of claim 14 , wherein each of the backing layer and the fluid-impermeable are a polyester. 16 . The polishing pad of claim 1 , wherein the polishing pad has a total thickness less than about 3 mm.
provided with a window for inspecting the surface of the work being lapped · CPC title
characterised by a multi-layered structure · CPC title
characterised by the composition or properties of the pad materials · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.