Additive manufacturing powder distribution

US2019126551A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019126551-A1
Application numberUS-201616089092-A
CountryUS
Kind codeA1
Filing dateAug 31, 2016
Priority dateAug 31, 2016
Publication dateMay 2, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Powder distribution in additive manufacturing may include systems or methods to distribute powder from an intermediate buffer or reservoir while scanning over a stage with the buffer or reservoir.

First claim

Opening claim text (preview).

What is claimed is: 1 . A powder distribution system for use in an additive manufacturing apparatus, comprising a carriage to scan over a build stage, an intermediate powder buffer on the carriage to receive powder from a powder delivery system of the additive manufacturing apparatus, a distributor on the carriage to distribute powder from the intermediate powder buffer over the build stage. 2 . The powder distribution system of claim 1 wherein the carriage is to scan in two opposite directions across the stage to be able to distribute powder over the stage in both directions, and the intermediate powder buffer is to provide powder to two opposite sides of the distributor to facilitate distributing the powder in both directions. 3 . The powder distribution system of claim 1 wherein the powder buffer includes a reservoir with a hole array plate in its bottom to allow powder to pass through towards the stage. 4 . The powder distribution system of claim 3 wherein the powder buffer includes a structure for varying a size of holes of the hole array plate. 5 . The powder distribution system of claim 4 wherein the hole array plate includes different hole arrays having holes of different diameters, wherein within each hole the holes have the same diameter, and a shutter to shut holes of at least one array. 6 . The powder distribution system of claim 3 wherein the powder buffer includes a shake element to shake the plate to facilitate relatively constant powder flow through the holes. 7 . The powder distribution system of claim 1 wherein the intermediate powder buffer is to provide the powder to the distributor so that the distributor distributes the powder from the buffer over the stage. 8 . The powder distribution system of claim 3 wherein the distributor extends under the reservoir to receive powder passing through the hole array, and distribute the powder over the stage. 9 . The powder distribution system of claim 1 wherein the intermediate powder buffer is to provide the powder to the stage, and the distributor further spreads the powder over the stage. 10 . The powder distribution system of claim 1 wherein the distributor comprises a roller. 11 . The powder distribution system of claim 10 wherein the roller includes ridges and/or grooves parallel to its central axis to facilitate even distribution of the powder from the buffer. 12 . The powder distribution system of claim 1 wherein the distributor comprises a roller to distribute powder from the buffer over the stage, and a flattening roller to flatten distributed powder. 13 . The powder distribution system of claim 1 comprising a pre-heater element in at least one of the powder buffer and the distributor. 14 . An additive manufacturing sub-system for an additive manufacturing apparatus, comprising a powder distribution system of claim 1 , and at least one irradiation structure that, during carriage scanning, heats powder in the powder buffer before distribution on the powder bed. 15 . A method of distributing powder over a stage comprising supplying powder to an intermediate buffer reservoir, scanning the intermediate buffer reservoir over the stage, and distributing powder from the reservoir onto the stage during scanning.

Assignees

Inventors

Classifications

  • using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • B29C64/329Primary

    using hoppers · CPC title

  • using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Means for applying layers · CPC title

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Frequently asked questions

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What does patent US2019126551A1 cover?
Powder distribution in additive manufacturing may include systems or methods to distribute powder from an intermediate buffer or reservoir while scanning over a stage with the buffer or reservoir.
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B29C64/329. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu May 02 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).