Microcapped package having polymer standoff

Patent metadata

Field	Value
Publication number	US-2019123716-A1
Application number	US-201715792417-A
Country	US
Kind code	A1
Filing date	Oct 24, 2017
Priority date	Oct 24, 2017
Publication date	Apr 25, 2019
Grant date	—

Abstract

An apparatus includes: a substrate; a lid disposed over the substrate, and comprising posts disposed around a perimeter of the substrate, the posts enclosing a cavity between the lid and the substrate; an electronic device disposed over an upper surface of the substrate, and in the cavity; an electrical contact pad; and an electrically insulating layer disposed between the electrical contact pad and an upper surface of the lid.

First claim

We claim:

1 . An apparatus, comprising:
a substrate; a lid disposed over the substrate, and comprising posts disposed around a perimeter of the substrate, the posts enclosing a cavity between the lid and the substrate; an electronic device disposed over an upper surface of the substrate, and in the cavity; an electrical contact pad; and an electrically insulating layer disposed between the electrical contact pad and an upper surface of the lid.

2 . The apparatus of claim 1 , wherein the electrically insulating layer comprises a polymer material.

3 . The apparatus of claim 2 , wherein the polymer material is photodefinable.

4 . The apparatus of claim 2 , wherein the polymer material has a thickness of approximately 10 μm to approximately 50 μm.

5 . The apparatus of claim 3 , wherein the polymer material is a dry film photoresist material.

6 . The apparatus of claim 3 , wherein the polymer material is a spin-on material.

7 . The apparatus of claim 1 , wherein an electrically conducting via exists through the lid, and between the electrical contact pad, and the electrical circuit traces over the upper surface of the substrate.

8 . The apparatus of claim 7 , wherein the electrically conducting via is a first electrically conducting via, the electrical contact pad is a first electrical contact pad, and the apparatus further comprises:
a second electrical contact pad; and a second electrically conducting via, which exists through the lid and between the second electrical contact pad, and the electrical circuit traces over the upper surface of the substrate.

9 . The apparatus of claim 8 , wherein the electrically insulating layer is disposed between the second electrical contact pad and an upper surface of the lid.

10 . The apparatus of claim 9 , wherein the electrically insulating layer comprises a polymer material.

11 . The apparatus of claim 10 , wherein the polymer material is photodefinable.

12 . The apparatus of claim 10 , wherein the polymer material has a thickness of approximately 10 μm to approximately 50 μm.

13 . The apparatus of claim 9 , further comprising an electrically conductive pillar disposed over the electrically insulating layer, and being electrically connected to the first electrical contact pad, or the second electrical contact pad, or both.

14 . The apparatus of claim 1 , wherein the lid comprises a semiconductor material.

15 . The apparatus of claim 14 , wherein areas of the lid beneath an overlap of the electrical contact pad and the electrically insulating layer are substantially free of enhancement or depletion regions.

16 . The apparatus of claim 2 , wherein a passivation layer is disposed over the polymer material.

17 . An apparatus, comprising:
a substrate; a lid disposed over the substrate, and comprising posts disposed around a perimeter of the substrate, the posts enclosing a cavity between the lid and the substrate; an electrical filter comprising a plurality of acoustic resonators disposed over an upper surface of the substrate, and in the cavity; an electrical contact pad; and an electrically insulating layer disposed between the electrical contact pad and an upper surface of the lid.

18 . The apparatus of claim 17 , wherein each of the plurality of acoustic resonators is a film bulk acoustic wave resonator (FBAR).

19 . The apparatus of claim 17 , wherein each of the plurality of acoustic resonators is a solid mount acoustic wave resonator (SMR).

20 . The apparatus of claim 17 , wherein the electrically insulating layer comprises a polymer material.

21 . The apparatus of claim 20 , wherein the polymer material is photodefinable.

22 . The apparatus of claim 20 , wherein the polymer material has a thickness of approximately 10 μm to approximately 50 μm.

23 . The apparatus of claim 22 , wherein the polymer material is a dry-resist material.

24 . The apparatus of claim 22 , wherein the polymer material is a spin-on material.

25 . The apparatus of claim 17 , wherein an electrically conducting via exists through the lid, and between the electrical contact pad, and electrical circuit traces over the upper surface of the substrate.

26 . The apparatus of claim 20 , wherein a passivation layer is disposed over the polymer material.

Assignees

• Avago Technologies General Ip

Inventors

• Martin Steven
• Barfknecht Andrew
• Perkins Nathan
• Patil Vikram

Classifications

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title

• H03H9/525 Primary

  for microelectro-mechanical filters · CPC title

• H03H3/02 Primary

  for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

• H03H9/1014 Primary

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title

• H03H9/171

  implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type · CPC title