Method For Predicting The Break-up Possibility Of A Synthetic Resin Filament In A Melt Blowing Process From Rheological Properties Of The Synthetic Resin

US2019113428A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019113428-A1
Application numberUS-201716090732-A
CountryUS
Kind codeA1
Filing dateAug 31, 2017
Priority dateOct 17, 2016
Publication dateApr 18, 2019
Grant date

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Abstract

Official abstract text for this publication.

The present invention relates to a method for predicting the break-up possibility of a synthetic resin filament in a melt blowing process from the rheological properties of the synthetic resin. According to the present invention, a method that is capable of predicting the break-up possibility of the synthetic resin filament in the melt blowing process for preparing a filament using the synthetic resin in advance, through the measurement of the rheological properties of the synthetic resin, is provided.

First claim

Opening claim text (preview).

1 . A method for predicting the break-up possibility of a synthetic resin filament in a melt blowing process, comprising the steps of: applying 200% strain to a synthetic resin sample at 235° C., and then measuring a change in residual stress with passage of time; and confirming whether or not the change in residual stress fulfills the following Mathematical Formula 1. (RS 1 /RS 0 )*100≤0.04  [Mathematical Formula 1] In Mathematical Formula 1, RS 0 is residual stress at one time point (t 0 ) of less than 0.05 seconds after applying 200% strain to the synthetic resin sample at 235° C., and RS 1 is residual stress at one time point (t 1 ) between 0.05 seconds and 1.50 seconds after applying 200% strain to the synthetic resin sample at 235° C. 2 . The method for predicting the break-up possibility of a synthetic resin filament according to claim 1 , wherein in Mathematical Formula 1, t 0 is 0.02 seconds and t 1 is 1.00 seconds. 3 . The method for predicting the break-up possibility of a synthetic resin filament according to claim 1 , wherein the synthetic resin fulfilling Mathematical Formula 1 has properties fulfilling the following Mathematical Formula 2. ( M w *10 −5 )*(MWD 0.5 )≤3.0  [Mathematical Formula 2] In Mathematical Formula 2, Mw is the weight average molecular weight of the synthetic resin (g/mol), MWD is the molecular weight distribution of the synthetic resin. 4 . The method for predicting the break-up possibility of a synthetic resin filament according to claim 1 , wherein the synthetic resin fulfilling Mathematical Formula 1 has properties fulfilling the following Mathematical Formula 3. HMW≤2.5  [Mathematical Formula 3] In Mathematical Formula 3, HMW is a content (wt %) of the polymer having a molecular weight (M, g/mol) of log(M)≥5.9. 5 . The method for predicting the break-up possibility of a synthetic resin filament according to claim 1 , wherein the synthetic resin is polypropylene.

Assignees

Inventors

Classifications

  • polypropylene · CPC title

  • G01N11/00Primary

    Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties · CPC title

  • by means of a flowing gas (e.g. melt-blowing) · CPC title

  • Yield stress; Residual stress at zero shear rate · CPC title

  • Stress relaxation time · CPC title

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What does patent US2019113428A1 cover?
The present invention relates to a method for predicting the break-up possibility of a synthetic resin filament in a melt blowing process from the rheological properties of the synthetic resin. According to the present invention, a method that is capable of predicting the break-up possibility of the synthetic resin filament in the melt blowing process for preparing a filament using the syntheti…
Who is the assignee on this patent?
Lg Chemical Ltd
What technology area does this patent fall under?
Primary CPC classification G01N11/00. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Apr 18 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).