Nano-Structured Non-Polarizing Beamsplitter

US2019107727A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019107727-A1
Application numberUS-201816138092-A
CountryUS
Kind codeA1
Filing dateSep 21, 2018
Priority dateOct 10, 2017
Publication dateApr 11, 2019
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A beamsplitter includes a substrate formed from a material transparent to wavelengths of light at least above a selected cutoff wavelength and reflective structures distributed across a surface of the substrate. The reflective structures split incident light having wavelengths above the selected cutoff wavelength into a reflected beam formed from portions of the incident light reflected from the reflective structures and a transmitted beam formed from portions of the incident light transmitted through the substrate. A splitting ratio of a power of the reflected beam to a power of the transmitted beam is based on a ratio of surface area of the reflective surfaces to an area of the incident light on the substrate. Separation distances between neighboring reflective structures are smaller than the cutoff wavelength such that diffracted power of the incident light having wavelengths above the selected cutoff wavelength is maintained below a selected tolerance.

First claim

Opening claim text (preview).

What is claimed: 1 . A beamsplitter comprising: a substrate formed from a material transparent to wavelengths of light at least above a selected cutoff wavelength; and a plurality of reflective structures distributed across a surface of the substrate, wherein the plurality of reflective structures are configured to split incident light having wavelengths above the selected cutoff wavelength into a reflected beam formed from portions of the incident light reflected from the plurality of reflective structures and a transmitted beam formed from portions of the incident light transmitted through the substrate, wherein a splitting ratio of a power of the reflected beam to a power of the transmitted beam is based on a ratio of surface area of the reflective surfaces to an area of the substrate not covered by the reflective structures, wherein separation distances between neighboring reflective structures of the plurality of reflective structures are smaller than the cutoff wavelength, wherein the plurality of reflective structures are configured to maintain power of non-zero diffracted orders of the incident light having wavelengths above the selected cutoff wavelength below a selected tolerance. 2 . The beamsplitter of claim 1 , wherein the plurality of reflective structures comprises: metallic films on the surface of the substrate. 3 . The beamsplitter of claim 1 , wherein the plurality of reflective structures includes planar surfaces parallel to the surface of the substrate. 4 . The beamsplitter of claim 1 , wherein the plurality of reflective structures is distributed in a square lattice pattern having a common pitch in a first direction and a second direction perpendicular to the first direction. 5 . The beamsplitter of claim 1 , wherein the plurality of reflective structures is distributed in at least one of a hexagonal lattice pattern, an oblique lattice pattern, or an equilateral triangle lattice pattern. 6 . The beamsplitter of claim 1 , wherein the substrate comprises: at least one of fused silica, Suprasil, Heralux, CaF 2 , MgF 2 , LiF, quartz, or sapphire. 7 . The beamsplitter of claim 1 , wherein the selected cutoff wavelength comprises: a wavelength in the range of approximately 120 nm to approximately 200 nm. 8 . The beamsplitter of claim 1 , wherein the selected cutoff wavelength comprises: at least one of an ultraviolet wavelength, a deep ultraviolet wavelength, a vacuum ultraviolet wavelength, or an extreme ultraviolet wavelength. 9 . The beamsplitter of claim 1 , wherein sizes of the plurality of reflective structures are less than 1 micrometer. 10 . The beamsplitter of claim 1 , wherein the separation distances between neighboring reflective structures are less than 1 micrometer. 11 . The beamsplitter of claim 1 , wherein the splitting ratio is independent of wavelength above the selected cutoff wavelength. 12 . The beamsplitter of claim 1 , wherein the splitting ratio is independent of polarization of the incident light, wherein the beamsplitter comprises: a non-polarizing beamsplitter. 13 . The beamsplitter of claim 1 , wherein the substrate and the plurality of reflective structures are configured as a plate beamsplitter. 14 . The beamsplitter of claim 1 , further comprising: an additional substrate disposed on the plurality of reflective structures, wherein the second substrate is transparent to wavelengths at least above the selected cutoff wavelength. 15 . The beamsplitter of claim 14 , wherein the substrate, the plurality of reflective structures, and the additional substrate are configured as a cubic beamsplitter. 16 . The beamsplitter of claim 1 , wherein the surface of the substrate is a planar surface. 17 . The beamsplitter of claim 1 , wherein the surface of the substrate is a curved surface. 18 . The beamsplitter of claim 1 , wherein the curved surface provides a selected focal power. 19 . A metrology system comprising: an illumination source configured to generate an illumination beam having wavelengths above a selected cutoff wavelength; an objective lens; a detector; and a beamsplitter, wherein the beamsplitter splits the illumination beam into a first illumination beam and a second illumination beam, wherein the objective lens directs the first illumination beam to a sample, wherein the objective lens collects radiation emanating from the sample in response to the first illumination beam, wherein the beamsplitter splits the radiation emanating from the sample from the objective lens into a first detected beam and a second detected beam, wherein the detector receives the first detected beam, wherein the beamsplitter comprises: a substrate formed from a material transparent to wavelengths of light at least above the selected cutoff wavelength; and a plurality of reflective structures distributed across a surface of the substrate, wherein the plurality of reflective structures are configured to split incident light having wavelengths above the selected cutoff wavelength into a reflected beam formed from portions of the incident light reflected from the plurality of reflective structures and a transmitted beam formed from portions of the incident light transmitted through the substrate, wherein a splitting ratio of a power of the reflected beam to a power of the transmitted beam is based on a ratio of surface area of the reflective surfaces to an area of the substrate not covered by the reflective structures, wherein separation distances between neighboring reflective structures of the plurality of reflective structures are smaller than the cutoff wavelength, wherein the plurality of reflective structures are configured to maintain power of non-zero diffracted orders of the incident light having wavelengths above the selected cutoff wavelength below a selected tolerance. 20 . The metrology system of claim 19 , wherein the plurality of reflective structures comprises: metallic films on the surface of the substrate. 21 . The metrology system of claim 19 , wherein the plurality of reflective structures includes planar surfaces parallel to the surface of the substrate. 22 . The metrology system of claim 19 , wherein the plurality of reflective structures is distributed in a square lattice pattern having a common pitch in a first direction and a second direction perpendicular to the first direction. 23 . The metrology system of claim 19 , wherein the plurality of reflective structures is distributed in at least one of a hexagonal lattice pattern, an oblique lattice pattern, or an equilateral triangle lattice pattern. 24 . The metrology system of claim 19 , wherein the substrate comprises: at least one of fused silica, Suprasil, Heralux, CaF 2 , MgF 2 , LiF, quartz, or sapphire. 25 . The metrology system of claim 19 , wherein the selected cutoff wavelength comprises: a wavelength in the range of approximately 120 nm to approximately 200 nm. 26 . The metrology system of claim 19 , wherein the selected cutoff wavelength comprises: at least one of an ultraviolet wavelength, a deep ultraviolet wavelength, a vacuum ultraviolet wavelength, or an extreme ultraviolet wavelength. 27 . The metrology system of claim 19 , wherein the sizes of the plurality of reflective structures are less than 1 micrometer. 28 . The metrology system of claim 19 , wherein the separat

Assignees

Inventors

Classifications

  • G02B27/147Primary

    using averaging effects by spatially variable reflectivity on a microscopic level, e.g. polka dots, chequered or discontinuous patterns, or rapidly moving surfaces (G02B27/1086 takes precedence) · CPC title

  • Coating structures, e.g. thin films multilayers · CPC title

  • G02B27/14Primary

    operating by reflection only · CPC title

  • using macroscopically faceted or segmented reflective surfaces · CPC title

  • Lenses (lenses per se G02B3/00) · CPC title

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What does patent US2019107727A1 cover?
A beamsplitter includes a substrate formed from a material transparent to wavelengths of light at least above a selected cutoff wavelength and reflective structures distributed across a surface of the substrate. The reflective structures split incident light having wavelengths above the selected cutoff wavelength into a reflected beam formed from portions of the incident light reflected from th…
Who is the assignee on this patent?
Kla Tencor Corp
What technology area does this patent fall under?
Primary CPC classification G02B27/147. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Apr 11 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).