Power conversion device

Patent metadata

Field	Value
Publication number	US-2019103344-A1
Application number	US-201815881883-A
Country	US
Kind code	A1
Filing date	Jan 29, 2018
Priority date	Sep 29, 2017
Publication date	Apr 4, 2019
Grant date	—

Abstract

To obtain a compact and high output power conversion device by achieving high heat dispersion performance and a reduction in heat generation, and enabling an efficient arrangement of power modules of three-phase circuits, four switchable power semiconductor chips of each of the power modules are arranged so that two pairs of circuits for one phase connected in series are connected in parallel to form a circuit for two phases, the lead frame includes two positive potential leads, two AC potential leads, and one negative potential lead that are separated from each other, the four switchable power semiconductor chips are individually arranged on four leads of the two positive potential leads and the two AC potential leads, the two positive potential leads each have an end portion connected to a bus bar via a welding point individually provided for each phase, and the bus bar is provided in common.

First claim

What is claimed is:

1 . A power conversion device, comprising two three-phase circuits for electric power conversion in parallel,
the two three-phase circuits including a combination of three power modules each including:
four switchable power semiconductor chips; and
a lead frame on which the four switchable power semiconductor chips are mounted,
the four switchable power semiconductor chips of each of the three power modules being arranged so that two pairs of circuits for one phase connected in series are connected in parallel to form a circuit for two phases, the lead frame including two positive potential leads, two AC potential leads, and one negative potential lead that are separated from each other, the four switchable power semiconductor chips being individually arranged on four leads of the two positive potential leads and the two AC potential leads, the two positive potential leads each having an end portion connected to a bus bar via a welding point individually provided for each phase,
the bus bar being provided in common between the three power modules.

2 . A power conversion device according to claim 1 ,
wherein each of the three power modules includes a mold encapsulation power module in which components included in each of the three power modules, which include the four switchable power semiconductor chips, the two positive potential leads, the two AC potential leads, and the one negative potential lead are encapsulated with a mold resin, wherein surfaces of the two positive potential leads, surfaces of the two AC potential leads, and a surface of the one negative potential lead that face corresponding surfaces are covered with the mold resin, and wherein the lead frame has, on a surface opposite to a surface on which the components are mounted, a region that is prevented from being encapsulated with the mold resin, and is connected to a heat sink via an insulating member containing an insulating tiller.

3 . A power conversion device according to claim 2 , wherein the insulating member is made of a material having a heat conductivity and a specific heat that are higher than a heat conductivity and a specific heat of the mold resin.

4 . A power conversion device according to claim 1 , wherein the bus bar, to which the two positive potential leads are welded, has a sheet thickness that is 1.4 times or more as large as a sheet thickness of the two positive potential leads.

5 . A power conversion device according to claim 1 , further comprising a control board arranged above the three power modules.

6 . A power conversion device according to claim I,
wherein the bus bar is formed into a shape forming three sides of a rectangular shape, and wherein the three power modules are arranged on the three sides of an outer periphery of the bus bar so that one power module is arranged on one of the three sides.

7 . A power conversion device according to claim 1 , further comprising a smoothing capacitor connected between a positive potential and a negative potential of each of the three power modules,
wherein the smoothing capacitor is arranged in a space between the three power modules on a heat sink on which the three power modules are mounted.

Assignees

• Mitsubishi Electric Corp

Inventors

• Fukase Tatsuya
• Kato Masaki
• Tahara Jun
• Shimano Tomoaki
• Tanaka Saburo

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/131

  the semiconductor body being only partially enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title