Insulated flat conductive wire having high aspect ratio, method for manufacturing same, and coil

US2019066883A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019066883-A1
Application numberUS-201815937036-A
CountryUS
Kind codeA1
Filing dateMar 27, 2018
Priority dateAug 22, 2017
Publication dateFeb 28, 2019
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This insulated flat conductive wire includes: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film has a film thickness t1 of 10 μm or more at a center portion of the long side of the rectangular cross-section, and the insulating film has a film thickness ratio t1/t2 of 0.80 to 1.35, and wherein the film thickness ratio t1/t2 is a ratio of the film thickness t1 at the center portion of the long side to a film thickness t2 at an edge portion of the long side of the rectangular cross-section.

First claim

Opening claim text (preview).

1 . An insulated flat conductive wire having a high aspect ratio, comprising: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film has a film thickness t1 of 10 μm or more at a center portion of the long side of the rectangular cross-section, and the insulating film has a film thickness ratio t1/t2 of 0.80 to 1.35, and wherein the film thickness ratio t1/t2 is a ratio of the film thickness t1 at the center portion of the long side to a film thickness t2 at an edge portion of the long side of the rectangular cross-section. 2 . The insulated flat conductive wire having a high aspect ratio according to claim 1 , wherein the polyamide-imide resin or the polyimide resin has a number average molecular weight Mn of 2.0×10 4 to 4.0×10 4 . 3 . A coil comprising: the insulated flat conductive wire having a high aspect ratio according to claim 1 which is coiled. 4 . A coil comprising: the insulated flat conductive wire having a high aspect ratio according to claim 2 which is coiled. 5 . A method for manufacturing the insulated flat conductive wire having a high aspect ratio according to claim 1 , the method comprising: an electrodeposition solution preparation step of mixing a polyamide-imide resin or a polyimide resin having a number average molecular weight Mn of 2.0×10 4 to 4.0×10 4 , a polar organic solvent, and a base, stirring the mixture at a temperature of 20° C. to 25° C. for 3 hours or more to obtain a mixed solution, and subsequently adding water to the mixed solution to prepare an electrodeposition solution; an electrodeposition step of immersing a flat conductive wire having an aspect ratio a/b of 12 or more in the electrodeposition solution, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof, and causing a direct current to flow at a voltage of 150 V or higher in the electrodeposition solution, thereby electrodepositing particles of the polyamide-imide resin or the polyimide resin on a surface of the flat conductive wire; and a baking step of heating the flat conductive wire, on which the particles of the polyamide-imide resin or the polyimide resin have been electrodeposited, to form an insulating film on the surface of the flat conductive wire. 6 . The method for manufacturing the insulated flat conductive wire having a high aspect ratio according to claim 5 , wherein the baking step includes: a low-temperature heating step of heating the flat conductive wire, on which the particles of the polyamide-imide resin or the polyimide resin have been electrodeposited, at a low temperature of 150° C. to 220° C. for 0.25 to 30 minutes; and a high-temperature heating step of heating the flat conductive wire, which has been heated at the low temperature, at a high temperature that is 30° C. or more higher than the temperature in the low-temperature heating step for 0.25 to 30 minutes.

Assignees

Inventors

Classifications

  • Polyamides; Polyimides · CPC title

  • Insulation of windings · CPC title

  • with organic materials · CPC title

  • Insulating conductors or cables (H01B13/32 takes precedence) · CPC title

  • Insulating of windings ({impregnating or encapsulating of transformers H01F41/005} ; of conductors in general H01B13/06) · CPC title

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What does patent US2019066883A1 cover?
This insulated flat conductive wire includes: a flat conductive wire having an aspect ratio a/b of 12 or more, wherein the aspect ratio is a ratio of a length a of a long side of a rectangular cross-section to a length b of a short side thereof; and an insulating film which consists of a polyamide-imide resin or a polyimide resin and coats the flat conductive wire, wherein the insulating film h…
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification H01B7/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Feb 28 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).