Degradable polymeric compositions and articles comprising same
US-2024425683-A1 · Dec 26, 2024 · US
Preparation of large ultrathin free-standing polymer films
US2019048158A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019048158-A1 |
| Application number | US-201816163220-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 17, 2018 |
| Priority date | Apr 21, 2015 |
| Publication date | Feb 14, 2019 |
| Grant date | — |
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Abstract
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A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin free-standing polymer film.
First claim
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1 . An ultrathin polymer film product, comprising: a polymer film having a thicknesses below 100 nm. 2 . The ultrathin polymer film product of claim 1 wherein said polymer film having a thicknesses below 100 nm is produced by the process comprising the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin polymer film product. 3 . The ultrathin polymer film product of claim 1 wherein said step of applying a polyelectrolyte material to said substrate comprises applying a polycation to said substrate. 4 . The ultrathin polymer film product of claim 1 wherein said step of applying a polyelectrolyte material to said substrate comprises applying a polyanion to said substrate. 5 . The ultrathin polymer film product of claim 1 wherein said step of applying a polyelectrolyte material to said substrate comprises applying polydiallyldimethylammonium chloride to said substrate. 6 . The ultrathin polymer film product of claim 1 wherein said step of providing a substrate comprises providing a silicon substrate. 7 . The ultrathin polymer film product of claim 1 wherein said step of providing a substrate comprises providing a silicon wafer substrate. 8 . The ultrathin polymer film product of claim 1 wherein said step of directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ultrathin polymer film comprises immersing said substrate with said polymer material on said polyelectrolyte material and on said substrate into water and directly delaminating said polymer material to produce the ultrathin polymer film. 9 . The ultrathin polymer film product of claim 1 further comprising the step of collecting said ultrathin polymer film from said water using a holder. 10 . The ultrathin polymer film product of claim 1 further comprising the steps of collecting said ultrathin polymer film in said water using a holder and removing said ultrathin polymer film from said water at a shallow angle using a holder. 11 . The ultrathin polymer film product of claim 1 further comprising the step of applying a marker to said polymer material. 12 . An ultrathin film, comprising: a film having a thicknesses of less than 100 nm. 13 . The ultrathin film of claim 12 produced by the process of providing a substrate, adding a layer of film material to said substrate, and removing said layer of film without use of a sacrificial layer. 14 . The ultrathin film of claim 13 further comprising the step of processing said substrate before said step of adding a layer of film material to said substrate.
Assignees
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Classifications
Post-treatment of applied coatings · CPC title
comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} · CPC title
Moistening · CPC title
- C08J5/18Primary
Manufacture of films or sheets · CPC title
Two layers · CPC title
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- What does patent US2019048158A1 cover?
- A method of making large ultrathin free-standing polymer films without use of a sacrificial layer includes the steps of providing a substrate, applying a polyelectrolyte material to said substrate, applying a polymer material onto said substrate and onto said polyelectrolyte material, and directly delaminating said polymer material from said substrate and said polyelectrolyte to produce the ult…
- Who is the assignee on this patent?
- L Livermore Nat Security Llc, General Atomics
- What technology area does this patent fall under?
- Primary CPC classification C08J5/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Feb 14 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).