Anti-Slip Substrates

Patent metadata

Field	Value
Publication number	US-2019045643-A1
Application number	US-201816156430-A
Country	US
Kind code	A1
Filing date	Oct 10, 2018
Priority date	Oct 31, 2013
Publication date	Feb 7, 2019
Grant date	—

Abstract

A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.

First claim

1 . A method of modifying a layer of a plastics material containing conductive fibers, the method comprising:
electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.

2 . The method of claim 1 which includes forming the plastics material as a shell of a housing for a device.

3 . The method of claim 1 , wherein the conductive fibers are exposed via openings at spaced apart locations of the surface of the layer.

4 . The method of claim 3 , wherein the bead of the polymer material is electrophoretically deposited at the openings of the spaced apart locations of the layer where the conductive fibers are exposed.

5 . The method of claim 3 , wherein the conductive fibers are arranged in a weave configuration and points where the conductive fibers cross in the weave configuration define locations where the conductive fibers are exposed.

6 . A method of manufacturing a shell of a housing for a device, the method comprising:
providing a shell of a plastics material containing conductive fibers which are exposed at spaced apart locations of a surface of the shell; and electrophoretically depositing beads of polymer material on the surface of the shell at the locations of the surface of the shell.

7 . The method of claim 6 , further comprising:
degreasing the surface of the carbon fiber reinforced plastics material with a degreasing agent before the electrophoretic deposition is performed; and rinsing the surface of the carbon fiber reinforced plastics material to remove the degreasing agent.

8 . The method of claim 6 , further comprising:
passivating the surface of the carbon fiber reinforced plastics material before the electrophoretic deposition is performed.

9 . The method of claim 6 , further comprising:
applying an insulating film to the surface of the shell in a pattern to form a mask before the electrophoretic deposition.

10 . The method of claim 9 , further comprising:
applying the insulating film by at least one of screen printing and ink-jet printing.

11 . The method of claim 6 , further comprising:
working the surface of the shell at the locations to expose the conductive fibers before performing the electrophoretic deposition.

12 . The method of claim 6 , wherein the conductive fibers are exposed via openings at spaced apart locations of the surface of the shell.

13 . The method of claim 12 , wherein the beads of the polymer material is electrophoretically deposited at the openings of the spaced apart locations of the shell where the conductive fibers are exposed.

14 . The method of claim 12 , wherein the conductive fibers are arranged in a weave configuration and points where the conductive fibers cross in the weave configuration define locations where the conductive fibers are exposed.

15 . The method of claim 6 , further comprising:
curing the beads of polymer material that are electrophoretically deposited on the surface of the shell.

Assignees

• Hewlett Packard Development Co

Inventors

• Kang Yu-Chuan
• Wu Kuan-Ting

Classifications

• C25D13/12

  characterised by the article coated · CPC title

• A45C2011/002

  Human Necessities · mapped topic

• A45C2011/003

  Human Necessities · mapped topic

• C25D13/06

  with polymers {(not used, see C09D5/44)} · CPC title

• H05K5/02 Primary

  Details · CPC title