Touch panel and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2019042011-A1
Application number	US-201815951609-A
Country	US
Kind code	A1
Filing date	Apr 12, 2018
Priority date	Aug 1, 2017
Publication date	Feb 7, 2019
Grant date	—

Abstract

A manufacturing method includes steps of: providing a substrate having a first side and a second side opposite to the first side; forming a first protection layer at the first side of the substrate to cover a plurality of touch units; forming a second protection layer on the first protection layer and at the second side of the substrate; cutting the substrate into a plurality of secondary substrates; subjecting an edge of each secondary substrate to treatment; removing the second protection layer at a second side of each secondary substrate; applying a first coating onto the second side of the secondary substrate; forming a third protection layer onto the first coating; removing the second protection layer at a first side of each secondary substrate; and forming a fourth protection layer on the first protection layer at the first side of each secondary substrate.

First claim

What is claimed is:

1 . A method for manufacturing a touch panel, comprising steps of:
providing a substrate, the substrate having a first side and a second side opposite to the first side, a plurality of touch units being arranged at the first side of the substrate, each touch unit comprising a touch structure and a wiring structure surrounding the touch structure; forming a first protection layer at the first side of the substrate to cover the plurality of touch units; forming a second protection layer on the first protection layer and at the second side of the substrate; cutting the substrate into a plurality of secondary substrates, each secondary substrate comprising one of the touch units; subjecting an edge of each secondary substrate to treatment; removing the second protection layer at a second side of each secondary substrate; applying a first coating onto the second side of the secondary substrate; forming a third protection layer onto the first coating; removing the second protection layer at a first side of each secondary substrate; and forming a fourth protection layer on the first protection layer at the first side of each secondary substrate.

2 . The method according to claim 1 , wherein in the case of removing the second protection layer at the second side of each secondary substrate, the method further comprising removing the second protection layer arranged at the first side of each secondary substrate and covering the wiring structure, and reserving the second protection layer covering the touch structure.

3 . The method according to claim 1 , wherein subsequent to the step of forming the first protection layer and prior to the step of removing the second protection layer at the first side of each secondary substrate, the method further comprises removing a portion of the first protection layer to expose a bonding region of the wiring structure.

4 . The method according to claim 3 , wherein subsequent to the step of forming the third protection layer and prior to removing the second protection layer at the first side of each secondary substrate, the method further comprises bonding an Integrated Circuit (IC) chip to the bonding region of the wiring structure.

5 . The method according to claim 1 , wherein the step of subjecting the edge of each secondary substrate to treatment comprises grinding, polishing and reinforcing the edge of each secondary substrate.

6 . The method according to claim 1 , wherein the first protection layer is an insulation protection layer, the second protection layer is a peelable adhesive layer, the third protection layer is an intermediate process film, the fourth protection layer is an explosion-proof film, and the first coating is a fingerprint-proof coating.

7 . The method according to claim 6 , wherein the insulation protection layer is made of at least one of propylene glycol monomethyl ether acetate (PGMEA), acrylic-based resin, polymethyl methacrylate (PMMA) and diethylene glycol methyl ethyl ether (DEGMEE).

8 . The method according to claim 6 , wherein the intermediate process film is made of polyethylene glycol terephthalate (PET).

9 . The method according to claim 6 , wherein the explosion-proof film comprises one or more of a glass film, a sapphire film and a PET film.

10 . The method according to claim 1 , further comprising removing the third protection layer.

11 . The method according to claim 1 , wherein the touch structure comprises an indium tin oxide (ITO) pattern electrode.

12 . The method according to claim 1 , wherein the step of forming the second protection layer on the first protection layer and at the second side of the substrate comprises forming a peelable adhesive layer on the first protection layer and at the second side of the substrate through silk-screen printing.

13 . A touch panel, comprising:
a substrate having a first side and a second side opposite to the first side; a plurality of touch units arranged at the first side of the substrate and each comprising a touch structure and a wiring structure surrounding the touch structure; a first protection layer covering and being in contact with the touch units; a first coating covering and being in contact with the second side of the substrate; and a fourth protection layer covering and being in contact with the first protection layer.

14 . The touch panel according to claim 13 , further comprising a third protection layer covering and being in contact with the first coating.

15 . The touch panel according to claim 13 , wherein the wiring structure has a bonding region.

16 . The touch panel according to claim 15 , further comprising an Integrated Circuit (IC) chip bonded to the bonding region of the wiring structure.

17 . The touch panel according to claim 14 , wherein the first protection layer is an insulation protection layer, the third protection layer is an intermediate process film, the fourth protection layer is an explosion-proof film, and the first coating is a fingerprint-proof coating.

18 . The touch panel according to claim 17 , wherein the insulation protection layer is made of at least one of propylene glycol monomethyl ether acetate (PGMEA), acrylic-based resin, polymethyl methacrylate (PMMA) and diethylene glycol methyl ethyl ether (DEGMEE).

19 . The touch panel according to claim 17 , wherein the intermediate process film is made of polyethylene glycol terephthalate (PET).

20 . The touch panel according to claim 13 , wherein the touch structure comprises an indium tin oxide (ITO) pattern electrode.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Pan Chenglong
• Ning Peihuan
• Wei Guangchao
• He Min
• Wang Liantao
• Wang Longlong
• Chen Yu

Classifications

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title