Monolithic phase change heat sink

Patent metadata

Field	Value
Publication number	US-2019039883-A1
Application number	US-201715666475-A
Country	US
Kind code	A1
Filing date	Aug 1, 2017
Priority date	Aug 1, 2017
Publication date	Feb 7, 2019
Grant date	—

Abstract

A monolithic vapor chamber heat dissipating device uses a phase change liquid and one or more wicks to dissipate heat from a heat-generating system. The phase change liquid and one or more wicks may be directly coupled to the heat-generating system, or may be coupled to an intermediate evaporator substrate. The phase change liquid vaporizes as it absorbs heat from the heat-generating system. When the vapor rises and encounters a condenser substrate, the vapor condenses and transfers the heat to the condenser substrate. The condensed vapor is drawn by gravity and the one or more wicks to the phase change liquid coupled to the heat-generating system.

First claim

What is claimed is:

1 . A monolithic microelectromechanical (MEMS) device including a vapor chamber, the device comprising:
a condenser substrate; a device substrate having a device surface comprising an integrated circuit disposed therein and a rear surface, wherein the vapor chamber is enclosed between the condenser substrate and one of the device surface or rear surface of the device substrate, wherein the condenser substrate has approximately a same footprint as the device substrate; and one or more wicks extending into the vapor chamber.

2 . The monolithic MEMS device of claim 1 , wherein the condenser substrate is bonded to the rear surface of the device substrate.

3 . The monolithic MEMS device of claim 2 , wherein the vapor chamber is enclosed between the rear surface of the device substrate and the condenser substrate.

4 . The monolithic MEMS device of claim 1 , further comprising a phase change material within the vapor chamber.

5 . The monolithic MEMS device of claim 1 , wherein an evaporator substrate is bonded to the device substrate.

6 . The monolithic MEMS device of claim 5 , further comprising one or more through silicon vias between the device surface and the rear surface of the device substrate.

7 . The monolithic MEMS device of claim 6 , wherein the condenser substrate is bonded to the evaporator substrate.

8 . The monolithic MEMS device of claim 5 , wherein the one or more wicks is joined to the evaporator substrate.

9 . The monolithic MEMS device of claim 1 , wherein the condenser substrate is contoured and is bonded to the device substrate such that it defines a plurality of chambers.

10 . The monolithic MEMS device of claim 9 , wherein first and second chambers of the plurality of chambers each include at least one of the one or more wicks.

11 . The monolithic MEMS device of claim 1 , wherein the one or more wicks is joined to the device substrate.

12 . A micro-scale heat dissipation device, comprising:
a device substrate having a device surface comprising an integrated circuit disposed therein, the device substrate having a first width and a first length; a condenser substrate having a second width approximately equal the first width and a second length approximately equal the first length, wherein the device substrate and condenser substrate are coupled together to define a vapor chamber between them; a phase change liquid in the vapor chamber; and a wick disposed at least partially in the phase change liquid.

13 . The micro-scale heat dissipation device of claim 12 , wherein the device substrate has a rear surface opposite the device surface, and wherein the device surface is between the rear surface and the condenser substrate.

14 . The micro-scale heat dissipation device of claim 13 , wherein the device substrate comprises a through silicon via (TSV) providing electrical connection to the integrated circuit.

15 . The micro-scale heat dissipation device of claim 12 , wherein the device substrate has a rear surface opposite the device surface, and wherein the rear surface is between the device surface and the condenser substrate.

16 . (canceled)

17 . The micro-scale heat dissipation device of claim 12 , wherein the vapor chamber comprises a plurality of indentations, and wherein the wick is disposed in the vapor chamber between adjacent indentations of the plurality of indentations.

18 . . A micro-scale heat dissipation device, comprising:
a device substrate having a device surface comprising an integrated circuit disposed therein and a rear surface; a cap coupled to the device substrate through a support structure, the cap and the device substrate having a vapor chamber formed between them, the vapor chamber being bounded in a plane parallel to the device surface by the support structure; a phase change liquid in the vapor chamber; and a wick disposed at least partially in the phase change liquid.

19 . The micro-scale heat dissipation device of claim 18 , further comprising an external condenser and a vapor outlet line coupled between the vapor chamber and the external condenser.

20 . The micro-scale heat dissipation device of claim 18 , wherein the device substrate comprises at least a portion of the support structure.

21 . The micro-scale heat dissipation device of claim 18 , wherein the cap comprises at least a portion of the support structure.

Assignees

• Analog Devices Global

Inventors

• Chen Baoxing
• Lane William Allan
• Dunham Marc T

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• B81B2207/096

  through the substrate · CPC title