Resin-molded component

US2019016029A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2019016029-A1
Application numberUS-201816115856-A
CountryUS
Kind codeA1
Filing dateAug 29, 2018
Priority dateDec 2, 2015
Publication dateJan 17, 2019
Grant date

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A resin-molded component includes a first molding part, and a second molding part. A portion of the first molding part and a portion of the second molding part are laminated in a direction of connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion. A portion of the second molding part is provided as an exposed portion. Each of portions of the laminated portion is located at least on opposite sides across the exposed portion. A one-side surface of the exposed portion in the laminating direction of the laminated portion is configured as a portion of the outer surface and the other-side surface thereof is configured as a portion of the inner surface.

First claim

Opening claim text (preview).

What is claimed is: 1 . A resin-molded component which is molded by filling a second molten resin in the state where a first molten resin is filled in a cavity of a mold and then cooled, the resin-molded component comprising: a first molding part molded by solidifying the first molten resin; and a second molding part molded by solidifying the second molten resin, wherein a portion of the first molding part and a portion of the second molding part are laminated in a direction connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion, an exposed portion is provided at a sharp corner having an acute angle of the second molding part or in a vicinity of the sharp corner of the second molding part, the area of the one-side surface of the exposed portion is smaller than the area of a one-side surface of the first molding part configured as a portion of the outer surface, portions of the laminated portion are located only on opposite sides across the exposed portion, and a one-side surface of the exposed portion in the laminating direction of the laminated portion is configured as a portion of the outer surface and the other-side surface thereof is configured as a portion of the inner surface.

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Frequently asked questions

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What does patent US2019016029A1 cover?
A resin-molded component includes a first molding part, and a second molding part. A portion of the first molding part and a portion of the second molding part are laminated in a direction of connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion. A portion of the second molding part is provided as an exposed portion. Each of portions of th…
Who is the assignee on this patent?
Koito Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/1671. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jan 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).