Electro-chemical module

Patent metadata

Field	Value
Publication number	US-2019013527-A1
Application number	US-201615745184-A
Country	US
Kind code	A1
Filing date	Jun 29, 2016
Priority date	Jul 14, 2015
Publication date	Jan 10, 2019
Grant date	—

Abstract

An electro-chemical module has a porous plate-shaped metallic carrier substrate with a gas-permeable central region and a peripheral region. A layered construction is disposed in the central region on a first side of the carrier substrate. At least one metallic gas-tight housing part is by way of a welded connection connected to the peripheral region of the carrier substrate. A gas-tight zone extends from the layered construction up to the housing part. The gas-tight zone has a gas-tight surface portion which extends superficially from the layered construction on the first side of the carrier substrate at least up to the welded connection. The welded connection by which the gas-tight surface portion is connected in a gas-tight manner to the housing part and the welding zone of which extends only through part of the thickness of the carrier substrate.

First claim

1 - 15 . (canceled)

16 . An electro-chemical module, comprising:
a porous plate-shaped metallic carrier substrate having a gas-permeable central region, a peripheral region surrounding said central region, a first side and a second side; a layered construction having at least one electro-chemically active layer, said layered construction disposed in said central region on said first side of said carrier substrate; a welded connection having a welding zone; at least one metallic gas-tight housing part connected by way of said welded connection to said peripheral region of said carrier substrate; a gas-tight zone extending from said layered construction up to said metallic gas-tight housing part, said gas-tight zone having a gas-tight surface portion extending superficially from said layered construction on said first side of said carrier substrate at least up to said welded connection; and said welded connection by which said gas-tight surface portion is connected in a gas-tight manner to said metallic gas-tight housing part and said welding zone, proceeding from said first side, in a thickness direction extends only through part of a thickness of said carrier substrate to an opposite said second side of said carrier substrate.

17 . The electro-chemical module according to claim 16 , wherein said carrier substrate below said gas-tight surface portion and below said welding zone of said welded connection is configured so as to be porous.

18 . The electro-chemical module according to claim 17 , wherein said carrier substrate in a porous portion of said peripheral region has a porosity which in relation to a porosity of said central region is reduced.

19 . The electro-chemical module according to claim 16 , wherein said carrier substrate is integrally manufactured in one piece by powder metallurgical means from a material combination which is based on at least one fo chromium or iron.

20 . The electro-chemical module according to claim 17 , wherein said carrier substrate in a porous portion of said peripheral region has a porosity in a range of 3% to 20%.

21 . The electro-chemical module according to claim 16 , wherein said welding zone extends from said first side in said thickness direction toward said second side up to a depth t where 20% ≤t ≤80% of said thickness which said carrier substrate has in said peripheral region.

22 . The electro-chemical module according to claim 16 , wherein said housing part has a housing portion connected by said welded connection, said housing portion is disposed so as to overlap said peripheral region of said carrier substrate and disposed on said first side of said carrier substrate.

23 . The electro-chemical module according to claim 16 , wherein said welding zone in the thickness direction extends completely through said housing part and only partially into said carrier substrate.

24 . The electro-chemical module according to claim 16 , wherein said welding zone is configured on a periphery of said carrier substrate and/or on a periphery of said housing part, and in the thickness direction extends only through part of a thickness of said housing part.

25 . The electro-chemical module according to claim 16 , wherein said housing part is configured in a frame-type manner, extending in an encircling manner around said peripheral region of said carrier substrate.

26 . The electro-chemical module according to claim 16 ,
further comprising an interconnector; and wherein said housing part is a sheet-metal frame plate having gas-passage openings formed therein, said sheet-metal frame plate in a region of an external periphery thereof being connected to said interconnector.

27 . The electro-chemical module according to claim 16 , wherein said gas-tight surface portion has an electrolyte which is part of said layered construction and on said first side of said carrier substrate extends beyond said layered construction.

28 . The electro-chemical module according to claim 16 , wherein said gas-tight surface portion is a superficial gas-tight portion formed in said carrier substrate, said superficial gas-tight portion is formed from a carrier substrate material and contains a melt phase of said carrier substrate material.

29 . The electro-chemical module according to claim 16 , wherein said gas-tight surface portion has a gas-tight sealing compound which is applied on said carrier substrate.

30 . A method for manufacturing an electro-chemical module, which comprises the steps of:
powder metallurgical manufacturing a porous plate-shaped metallic carrier substrate having a central region being surrounded by a peripheral region and at least the central region being configured so as to be gas-permeable; gas-tight bonding a layered construction to at least one metallic gas-tight housing part on a first side of the carrier substrate, the layered construction having at least one electro-chemically active layer in the central region applied on the first side of the carrier substrate, the at least one metallic gas-tight housing part by way of a welded connection is connected to the peripheral region of the carrier substrate such that a welding zone, proceeding from the first side, in a thickness direction extending only through part of a thickness of the carrier substrate to an opposite second side of the carrier substrate; and configuring a gas-tight surface portion extending superficially from the layered construction on the first side of the carrier substrate up to the welded connection.

Assignees

• Plansee Se

Inventors

• Schafbauer Wolfgang
• Koegl Markus
• Ruettinger Matthias
• Bienert Christian
• Brandner Marco

Classifications

• C22C38/44

  with molybdenum or tungsten · CPC title

• H01M8/0232 Primary

  Metals or alloys · CPC title

• H01M8/0273

  with sealing or supporting means in the form of a frame · CPC title

• H01M8/0286

  Processes for forming seals · CPC title

• C22C38/50

  with titanium or zirconium · CPC title