Electronic device, liquid ejection head, and method of manufacturing electronic device

Patent metadata

Field	Value
Publication number	US-2019001681-A1
Application number	US-201615735884-A
Country	US
Kind code	A1
Filing date	Jul 1, 2016
Priority date	Jul 28, 2015
Publication date	Jan 3, 2019
Grant date	—

Abstract

An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.

First claim

1 . An electronic device comprising a joined-structure assembly in which a plurality of structures are joined together, wherein
at least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent contains an organo-siloxane compound with three or more reaction points.

2 . The electronic device according to claim 1 , wherein the organo-siloxane compound includes a heterocyclic compound in the backbone.

3 . The electronic device according to claim 2 , wherein the adhesive agent includes, as the heterocyclic compound, an isocyanurate compound in the backbone.

4 . The electronic device according to claim 3 , wherein the adhesive agent includes an epoxy group or an oxetanyl group.

5 . The electronic device according to claim 1 , wherein the adhesive agent includes a component including hydrosilane in a constituent molecule, a component including a vinyl group, and a platinum catalyst.

6 . The electronic device according to claim 5 , wherein the movable region is a driven region or an active region.

7 . The electronic device according to claim 5 , wherein the movable region is provided with a piezoelectric element that functions as a part of the movable region.

8 . A liquid ejection head including the electronic device according to claim 3 , comprising:
a first plate as one of the structures in which a pressure chamber is formed as the space communicating with a nozzle from which a liquid is to be ejected; and a second plate as another one of the structures in which a space communicating with the pressure chamber is formed, wherein one surface forming the pressure chamber is a flexible surface that functions as a part of the movable region.

9 . The liquid ejection head according to claim 8 , wherein the second plate is a communicating plate in which a nozzle communicating port allowing the pressure chamber and the nozzle to communicate with each other which is formed as the space.

10 . The liquid ejection head according to claim 9 , wherein the communicating plate is a stacked body in which a plurality of plates are stacked and joined together with the adhesive agent, and an opening to constitute a part of the nozzle communicating port is formed in each of the plurality of plates.

11 . A method of manufacturing an electronic device which includes a joined-structure assembly formed by joining a plurality of structures together, in which at least one of the plurality of structures includes a movable region, and a part of an adhesive agent applied between the structures faces a space communicating with the movable region, the method comprising:
applying the adhesive agent to a transfer sheet, the adhesive agent containing an organo-siloxane compound with three or more reaction points; increasing a viscosity of the adhesive agent by incompletely curing the adhesive agent applied to the transfer sheet; and transferring the adhesive agent to a surface of one of the structures in each joint pair.

12 . The method of manufacturing an electronic device according to claim 11 , wherein
the adhesive agent is an addition-type silicone resin, and the increasing of a viscosity is performed by a heat treatment.

13 . The method of manufacturing an electronic device according to claim 12 , further comprising curing the adhesive agent by a heat treatment after the transferring of the adhesive agent.

Assignees

• Seiko Epson Corp

Inventors

• Matsuo Yasuhide
• Otsuka Kenji
• Tsuchiya Hiroyuki
• Tadachi Kei
• Takahashi Wataru

Classifications

• B41J2002/14241

  having a cover around the piezoelectric thin film element · CPC title

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/161

  of film type, deformed by bending and disposed on a diaphragm · CPC title

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2/1607

  Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence) · CPC title