Package support structure and light emitting device including same

Patent metadata

Field	Value
Publication number	US-2018374997-A1
Application number	US-201816020172-A
Country	US
Kind code	A1
Filing date	Jun 27, 2018
Priority date	Jun 27, 2017
Publication date	Dec 27, 2018
Grant date	—

Abstract

The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing. The package support structure provided in the present invention achieves the effect of reducing an upper piece error and the purpose of effectively removing the heat energy.

First claim

What is claimed is:

1 . A package support structure, comprising:
a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove, wherein the light emitting surface is disposed opposite to the backlight surface, the bottom surface is disposed between the light emitting surface and the backlight surface, and the groove is formed on the light emitting surface; and a conductive support which is partially covered by the housing and comprises a first lead and a second lead that are separated from each other, wherein each of the first lead and the second lead comprises an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; wherein one of the first lead and the second lead further comprises a heat radiation portion, the heat radiation portion extends outward from the electrode portion and is exposed from the backlight surface of the housing.

2 . The package support structure according to claim 1 , wherein the housing further comprises two side faces, the two side faces are disposed between the light emitting surface and the backlight surface, and the bottom surface is disposed between the two side faces; wherein the bent portion extends outward through the side faces beyond the housing and bends toward the side faces and the bottom surface.

3 . The package support structure according to claim 1 , wherein the bent portion extends outward from the heat radiation portion, such that the bent portion indirectly extends outward from the electrode portion.

4 . The package support structure according to claim 1 , wherein the heat radiation portion and the bent portion extend outward from opposite sides of the electrode portion, respectively.

5 . The package support structure according to claim 1 , wherein the housing further comprises at least one supporting portion, and the supporting portion is formed on the bottom surface; wherein the thickness of the supporting portion in a normal direction of the bottom surface is less than or equal to the thickness of the bent portion.

6 . The package support structure according to claim 1 , wherein one of the first lead and the second lead further comprises a sub-bent portion, the sub-bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; wherein the sub-bent portion is disposed between the bent portion of the first lead and the bent portion of the second lead.

7 . The package support structure according to claim 1 , wherein there is a gap between the first lead and the second lead, and the width of the gap is variable.

8 . The package support structure according to claim 1 , wherein an exposed surface of the heat radiation portion exposed on the backlight surface is aligned with the backlight surface.

9 . A light emitting device, comprising:
a package support structure which comprises a housing and a conductive support, wherein the housing comprises a light emitting surface, a backlight surface, a bottom surface and a groove, the light emitting surface is disposed opposite to the backlight surface, the bottom surface is disposed between the light emitting surface and the backlight surface, and the groove is formed on the light emitting surface, and wherein the conductive support is partially covered by the housing and comprises a first lead and a second lead that are separated from each other, each of the first lead and the second lead comprises an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing, one of the first lead and the second lead further comprises a heat radiation portion, the heat radiation portion extends outward from the electrode portion and is exposed from the backlight surface of the housing; a substrate which comprises a surface and a plurality of pads disposed on the surface, wherein the package support structure is disposed on the surface, and the bottom surface of the housing faces the surface, the bent portion of the first lead and the bent portion of the second lead are electrically connected to the pads, respectively; a light emitting element which is disposed in the groove of the housing and is electrically connected to the electrode portion of the first lead and the electrode portion of the second lead; and a heat sink which is disposed on the surface and is connected to the heat radiation portion of the conductive support.

10 . The light emitting device according to claim 9 further comprises a package colloid filled in the groove, wherein the package colloid covers the light emitting element, and a quantum dot material and a phosphor material are distributed in the package colloid.

11 . The light emitting device according to claim 10 , wherein the quantum dot material and the phosphor material are distributed in an end of the package colloid away from the light emitting element after they are subjected to an inverted centrifugation in the package colloid.

12 . The light emitting device according to claim 9 , wherein the substrate further comprises a supporting structure which is formed on the surface to support the light emitting surface of the housing.

13 . The light emitting device according to claim 12 , wherein the supporting structure is an accommodating slot or a supporting block.

14 . The light emitting device according to claim 9 , further comprises a light guide plate, wherein the light guide plate is disposed on the surface and comprises a light incoming side, and the light incoming side corresponds to the groove of the housing.

Assignees

• Everlight Electronics Co Ltd

Inventors

• Liu Chien-Nan
• Chen Teng-Wei
• Kang Chieh-Yu
• Yang Hao-Yu
• Lee Yu-Da

Classifications

• G02B6/009

  of the light source in the package (G02B6/0021 takes precedence) · CPC title

• G02B6/0073

  Light emitting diode [LED] · CPC title

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• H01L33/62

  Electricity · mapped topic

• H01L33/644

  Electricity · mapped topic