Optical Module

Patent metadata

Field	Value
Publication number	US-2018372967-A1
Application number	US-201816119236-A
Country	US
Kind code	A1
Filing date	Aug 31, 2018
Priority date	Mar 4, 2016
Publication date	Dec 27, 2018
Grant date	—

Abstract

The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

First claim

1 . An optical module, comprising:
a circuit board; a first chip; a second chip; and an integrally packaged lens assembly for placement on a surface of the circuit board, wherein: the first chip and the second chip are arranged on a surface of the circuit board, and the integrally packaged lens assembly is arranged in a chip on board package where the first chip and the second chip are positioned between the integrally packaged lens assembly and the surface of the circuit board; the integrally packaged lens assembly comprises a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

2 . The optical module according to claim 1 , wherein:
the first chip is a light transmitting chip, the first reflecting surface is configured to reflect light rays exiting the light transmitting chip to the second reflecting surface, and the second reflecting surface is configured to reflect the light rays reflected by the first reflecting surface to the first optic fiber insertion port.

3 . The optical module according to claim 1 , wherein:
the first chip is a light probing chip, the second reflecting surface is configured to reflect light rays incident on the first optic fiber insertion port to the first reflecting surface, and the first reflecting surface is configured to reflect the light rays reflected by the second reflecting surface to the light probing chip.

4 . The optical module according to claim 1 , wherein:
a distance between an axis of the first optic fiber insertion port and an axis of the second optic fiber insertion port is less than a distance between the first chip and the second chip.

5 . The optical module according to claim 1 , wherein:
the integrally packaged lens assembly further comprises a first lens and a second lens; the first lens is arranged between the first chip and the first reflecting surface; and the second lens is arranged at the first optic fiber insertion port.

6 . The optical module according to claim 1 , wherein a light propagation path between the first chip and the first reflecting surface is parallel to an axis of the first optic fiber insertion port.

7 . The optical module according to claim 1 , wherein a light propagation path between the first chip and the first reflecting surface is perpendicular to an axis of the first optic fiber insertion port.

8 . The optical module according to claim 6 , wherein a concave groove is located on an upper surface of the integrally packaged lens assembly, a bump is located in the concave groove, and the first reflecting surface and the second reflecting surface are located on a surface of the bump.

9 . The optical module according to claim 7 , wherein a concave groove is located on an upper surface of the integrally packaged lens assembly, a bump is located in the concave groove, and the first reflecting surface and the second reflecting surface are located on a surface of the bump.

10 . The optical module according to claim 4 , further comprising a first driving chip configured to drive the first chip, wherein a straight line defined between a pin of the first chip and a pin of the first driving chip is perpendicular to a side of the first driving chip.

11 . An optical module, comprising:
a circuit board; a first chip; a second chip; an integrally packaged first lens assembly for placement on a surface of the circuit board; and an integrally packaged second lens assembly for placement on a surface of the circuit board, wherein: the first chip is arranged on a surface of the circuit board, and the integrally packaged first lens assembly is arranged in a chip on board package where the first chip is positioned between the integrally packaged first lens assembly and the surface of the circuit board; the second chip is arranged on the surface of the circuit board, and the integrally packaged second lens assembly is arranged in a chip on board package where the second chip is positioned between the integrally packaged second lens assembly and the surface of the circuit board; the integrally packaged first lens assembly comprises a first optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the integrally packaged second lens assembly comprises a second optic fiber insertion port; the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

12 . The optical module according to claim 11 , wherein:
a distance between an axis of the first optic fiber insertion port and an axis of the second optic fiber insertion port is less than a distance between the first chip and the second chip.

13 . The optical module according to claim 11 , wherein:
the integrally packaged first lens assembly further comprises a first lens and a second lens; the first lens is arranged between the first chip and the first reflecting surface; and the second lens is arranged at the first optic fiber insertion port.

14 . The optical module according to claim 11 , wherein a light propagation path between the first chip and the first reflecting surface is parallel to an axis of the first optic fiber insertion port.

15 . The optical module according to claim 11 , wherein a light propagation path between the first chip and the first reflecting surface is perpendicular to an axis of the first optic fiber insertion port.

16 . The optical module according to claim 11 , wherein a concave groove is located on an upper surface of the integrally packaged first lens assembly, a bump is located in the concave groove, and the first reflecting surface and the second reflecting surface are located on a surface of the bump.

17 . The optical module according to claim 12 , further comprising a first driving chip driving the first chip, and a second driving chip driving the second chip;
wherein a straight line defined between a pin of the first chip and a pin of the first driving chip is perpendicular to a side of the first driving chip, and a straight line defined between a pin of the second chip and a pin of the second driving chip is perpendicular to a side of the second driving chip.

18 . The optical module according to claim 11 , wherein:
the integrally packaged second lens assembly further comprises a third reflecting surface and a fourth reflecting surface; and the third reflecting surface faces the second chip, the third reflecting surface faces the fourth reflecting surface, and the fourth reflecting surface faces the second optic fiber insertion port.

19 . The optical module according to claim 18 , wherein:
the first chip is a light transmitting chip, the first reflecting surface is configured to reflect light rays exiting the light transmitting chip to the second reflecting surface, and the second reflecting surface is configured to reflect the light rays reflected by the first reflecting surface to the first optic fiber insertion port; and the second chip is a light probing chip, the fourth reflecting surface is configured to reflect light rays incident on the second optic fiber insertion port to the third reflecting surface, and the third reflecting surface is configured to reflect the light rays reflected by the fourth reflec

Assignees

• Hisense Broadband Multimedia Technology Co Ltd
• Hisense Usa Corp
• Hisense Int Co Ltd

Inventors

• Liu Xuxia
• Huang Yongliang
• Shao Qian

Classifications

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/426

  mounting, engaging or coupling of the package to a board, a frame or a panel · CPC title

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/32

  having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} · CPC title